Multi-purpose IO pads/bumps on semiconductor chips to maximize chip-to-chip data connectivity
US-12182051-B1 · Dec 31, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L25/18 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 9,743 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 261 |
| 2016 | 374 |
| 2017 | 428 |
| 2018 | 513 |
| 2019 | 732 |
| 2020 | 951 |
| 2021 | 1,047 |
| 2022 | 1,189 |
| 2023 | 1,220 |
| 2024 | 1,276 |
| 2025 | 1,446 |
| 2026 | 306 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor devices and methods of manufacturing
US-12166025-B2 · Dec 10, 2024 · US
Memory devices having signal routing structures at bonding interfaces
US-2024404976-A1 · Dec 5, 2024 · US
Logic drive using standard commodity programmable logic ic chips comprising non-volatile random access memory cells
US-2024380401-A1 · Nov 14, 2024 · US
Semiconductor memory device and manufacturing method of semiconductor memory device
US-12144179-B2 · Nov 12, 2024 · US
Apparatus and method for making a secured substrate
US-2024355722-A1 · Oct 24, 2024 · US
Semiconductor Device and Method of Forming Fine Pitch Conductive Posts with Graphene-Coated Cores
US-2024312884-A1 · Sep 19, 2024 · US
Semiconductor memory device
US-2024315058-A1 · Sep 19, 2024 · US
Thermal expansion matched chip module with integrated liquid cooling
US-2024203822-A1 · Jun 20, 2024 · US
Semiconductor device and mounting structure for semiconductor element
US-2024170353-A1 · May 23, 2024 · US
Display Device and System
US-2024164196-A1 · May 16, 2024 · US
Interconnect architecture with silicon interposer and emib
US-2024145395-A1 · May 2, 2024 · US
Apparatus for non-volatile random access memory stacks
US-2024145438-A1 · May 2, 2024 · US
Dynamic random-access memory in a molding beneath a die
US-2024113033-A1 · Apr 4, 2024 · US
Memory system, semiconductor device and fabrication method therefor
US-2024107759-A1 · Mar 28, 2024 · US
Semiconductor storage device
US-2024107765-A1 · Mar 28, 2024 · US
Semiconductor structure, method of forming same, and memory
US-2024105706-A1 · Mar 28, 2024 · US
Stacked memory routing techniques
US-2024096852-A1 · Mar 21, 2024 · US
3d layout and organization for enhancement of modern memory systems
US-2024088099-A1 · Mar 14, 2024 · US
Semiconductor package with reinforcing structure
US-2024063077-A1 · Feb 22, 2024 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L25/18?
- CPC H01L25/18 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L25/18 (Electricity)?
- Our database includes 9,743 publications tagged with this CPC code.
- Is patent activity under CPC H01L25/18 growing?
- Publication counts under this code: 1,276 in 2024 vs 1,446 in 2025 (latest complete years).