Display device having reduced cell seal area and method of manufacturing display device

Patent metadata

Field	Value
Publication number	US-11075259-B2
Application number	US-202016923159-A
Country	US
Kind code	B2
Filing date	Jul 8, 2020
Priority date	Nov 15, 2017
Publication date	Jul 27, 2021
Grant date	Jul 27, 2021

Abstract

A display device includes: a first substrate in which a display area and a non-display area disposed outside the display area are defined; a second substrate facing the first substrate; and a cell seal disposed on the non-display area, where the cell seal includes a bonding filament connecting the first substrate and the second substrate to each other.

First claim

What is claimed is:

1. A method of manufacturing a display device, the method comprising:
sealing an original panel including a cell including a first substrate and a second substrate facing each other; and
forming a cell seal to seal the cell,
wherein the forming the cell seal comprises forming a bonding filament between the first substrate and the second substrate by radiating a laser, forming a frit in the cell, and curing the frit to form a frit seal, and
wherein the frit seal and the bonding filament are connected to each other,
wherein the bonding filament is in direct contact with and of a same material as the first and second substrates.

2. The method of claim 1 ,
wherein the laser includes a first sub laser radiated toward the first substrate from the second substrate,
wherein a first focal point of the first sub laser is inside the first substrate,
wherein a focus depth of the first sub laser is in a range of about −100 micrometers to about zero micrometer, and
wherein the focus depth of the first sub laser is measured from a surface of the first substrate which faces the second substrate.

3. The method of claim 2 ,
wherein the laser further includes a second sub laser radiated toward the second substrate from the first substrate,
wherein a second focal point of the second sub laser is inside the second substrate,
a focus depth of the second sub laser is in a range of about zero micrometer to about 100 micrometers, and
wherein the focus depth of the second sub laser is measured from a surface of the second substrate which faces the first substrate.

4. The method of claim 3 ,
wherein at least one of the first sub laser and the second sub laser is radiated at a predetermined inclination angle inclined with respect to a thickness direction of the first substrate.

5. The method of claim 1 , further comprising:
removing an insulation film disposed on the first substrate.

6. The method of claim 1 ,
wherein the forming the bonding filament between the first substrate and the second substrate by radiating the laser comprises:
forming a first bonding filament by radiating the laser in a first direction; and
forming a second bonding filament by radiating the laser in a second direction,
wherein the first bonding filament and the second bonding filament intersect each other to form an intersection portion.

7. The method of claim 1 , wherein the bonding filament comprises a central portion and a peripheral portion surrounding the central portion, and
wherein a refractive index of the central portion of the bonding filament is different from a refractive index of the peripheral portion of the bonding filament.

8. The method of claim 1 , wherein the bonding filament comprises an inner bonding filament and an outer bonding filament,
wherein the inner bonding filament and the outer bonding filament partially overlap each other, and,

wherein a refractive index of an overlap area of the inner bonding filament and the outer bonding filament and a refractive index of a peripheral portion of the inner bonding filament are different from each other.

Assignees

• Samsung Display Co Ltd

Inventors

• Seo Woo Suk
• Ha Sang Woo
• Kim Sung Chul
• Kim Jung Hyun
• Song Si Joon
• Song Jun Ho
• You Bong Hyun

Classifications

• H10K59/8722 Primary

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

• H10K59/131

  Interconnections, e.g. wiring lines or terminals · CPC title

• B23K26/20 Primary

  Bonding (soldering by means of radiant energy B23K1/005) · CPC title

• B23K26/06

  Shaping the laser beam, e.g. by masks or multi-focusing · CPC title

• B23K2101/36

  Electric or electronic devices · CPC title