Method of processing a slider
US-11037585-B2 · Jun 15, 2021 · US
Articles for lapping stacked row bars having in-wafer ELG circuits
US11344990B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11344990-B2 |
| Application number | US-201916728251-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 27, 2019 |
| Priority date | Jun 28, 2017 |
| Publication date | May 31, 2022 |
| Grant date | May 31, 2022 |
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- Title
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- Abstract
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- Assignees and inventors
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- Key dates
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- First independent claim
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- CPC / IPC classifications
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- Citations and related patents
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Abstract
Official abstract text for this publication.
An assembly for lapping multiple row bars, the assembly including a carrier having at least one carrier bond pad, multiple row bars adjacent to each other in a stack, wherein a first row bar of the stack is positioned closer to the carrier than any of the other multiple row bars of the stack and comprises at least one row bar bond pad, an electrical connection between at least one of the carrier bond pads and at least one of the row bar bond pads of the first row bar, and at least one electrical trace extending through at least two of the multiple row bars and electrically connected to at least the first row bar and one additional row bar of the stack. An outermost row bar of the stack includes an outer surface and at least one electronic lapping guide.
First claim
Opening claim text (preview).
What is claimed is: 1. An assembly for lapping multiple row bars, the assembly comprising: a carrier comprising at least one carrier bond pad; multiple row bars adjacent to each other in a stack, wherein a first row bar of the stack is positioned closer to the carrier than any of the other multiple row bars of the stack and comprises at least one row bar bond pad; at least one electrical connector, wherein each electrical connector comprises a proximal end attached to one of the carrier bond pads and a distal end attached to one of the row bar bond pads of the first row bar; and at least one electrical trace extending through at least two of the multiple row bars and electrically connecting at least the first row bar and one additional row bar of the stack; wherein an outermost row bar of the stack comprises an outer surface and at least one electronic lapping guide. 2. The assembly of claim 1 , wherein each of the multiple row bars of the stack comprises an electronic lapping guide. 3. The assembly of claim 1 , wherein at least one of the electrical connectors comprises a wire. 4. The assembly of claim 1 , wherein the at least one electrical trace extends through all of the multiple row bars of the stack. 5. The assembly of claim 1 , wherein the outer surface of each of the multiple row bars is an air bearing surface. 6. The assembly of claim 1 , wherein at least one of the electrical connectors comprises conductive adhesive. 7. The assembly of claim 1 , wherein at least one of the electrical connectors comprises conductive trace materials. 8. The assembly of claim 1 , wherein the at least one electrical trace comprises a first end extending from the first row bar.
Assignees
Inventors
Classifications
- B24B37/013Primary
Devices or means for detecting lapping completion · CPC title
Testing or indicating in relation thereto, e.g. before the fabrication is completed · CPC title
of sliders and magnetic heads of hard disc drives or the like · CPC title
Design of the air bearing surface · CPC title
Working or finishing the interfacing surface of heads, e.g. lapping of heads · CPC title
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Frequently asked questions
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- What does patent US11344990B2 cover?
- An assembly for lapping multiple row bars, the assembly including a carrier having at least one carrier bond pad, multiple row bars adjacent to each other in a stack, wherein a first row bar of the stack is positioned closer to the carrier than any of the other multiple row bars of the stack and comprises at least one row bar bond pad, an electrical connection between at least one of the carrie…
- Who is the assignee on this patent?
- Seagate Technology Llc
- What technology area does this patent fall under?
- Primary CPC classification B24B37/013. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue May 31 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).