Row bar and wafer for forming magnetic heads

Patent metadata

Field	Value
Publication number	US-10490212-B2
Application number	US-201715653788-A
Country	US
Kind code	B2
Filing date	Jul 19, 2017
Priority date	Jul 19, 2016
Publication date	Nov 26, 2019
Grant date	Nov 26, 2019

Abstract

A row bar for forming magnetic heads includes a row of magnetic head forming portions each having a magnetic head and a cutting portion adjacent to the magnetic heads. A row of bonding pads and a first ELG pad are provided at the magnetic head, a second ELG pad is provided at the cutting portion, both of the first and the second ELG pads are adapted for contacting with a probe during lapping process, and a conductive structure that is higher than surfaces of the first and the second ELG pads is formed at peripheries of the first and the second ELG pads respectively. Due to the conductive structures, a probe used in lapping process will be prevented from shifting from the ELG pads to ensure a stable contact, thereby obtaining efficient and accurate resistance measurement.

First claim

What is claimed is:

1. A row bar for forming magnetic heads, comprising:
a row of magnetic head forming portions each of which has a magnetic head to be cut from the row bar and a cutting portion adjacent to the magnetic head,
a row of bonding pads and a first electrical lapping guide pad being provided at the magnetic head,
a second electrical lapping guide pad being provided at the cutting portion, both of the first and the second electrical lapping guide pads being adapted for contacting with a probe during a lapping process, and
a first conductive structure and a second conductive structure formed at peripheries of the first and the second electrical lapping guide pads respectively, wherein the first conductive structure and second conductive structure protrude above surfaces of the first and the second electrical lapping guide pads respectively.

2. The row bar for forming magnetic heads according to claim 1 , wherein the first and second conductive structures are formed around the peripheries of the first and the second electrical lapping guide pads respectively.

3. The row bar for forming magnetic heads according to claim 1 , wherein the first and second conductive structures are arranged at two opposite sides of the first and the second electrical lapping guide pads.

4. The row bar for forming magnetic heads according to claim 1 , wherein the first and second conductive structures are shaped in a strip, and have a width in a range of 8 μm˜15 μm.

5. The row bar for forming magnetic heads according to claim 1 , wherein the first and second conductive structures extend beyond the surface of the first and the second electrical lapping guide pads by about 500 A˜1000 A.

6. The row bar for forming magnetic heads according to claim 1 , wherein the first and second conductive structures are made of titanium or tantalum.

7. A wafer for forming magnetic heads, comprising:
multiple row bars each of which comprises a row of magnetic head forming portions, each magnetic head forming portion having a magnetic head to be cut from the row bar and a cutting portion adjacent to the magnetic head,
a row of bonding pads and a first electrical lapping guide pad being provided at the magnetic head,
a second electrical lapping guide pad being provided at the cutting portion, both of the first and the second electrical lapping guide pads being adapted for contacting with a probe during a lapping process, and
a first conductive structure and second conductive structure formed at peripheries of the first and the second electrical lapping guide pads respectively, wherein the first conductive structure and second conductive structure protrude above surfaces of the first and the second electrical lapping guide pads respectively.

8. The wafer for forming magnetic heads according to claim 7 , wherein the first and second conductive structures are formed around the peripheries of the first and the second electrical lapping guide pads respectively.

9. The wafer for forming magnetic heads according to claim 7 , wherein the first and second conductive structures are arranged at two opposite sides of the first and the second electrical lapping guide pads.

10. The wafer for forming magnetic heads according to claim 7 , wherein the first and second conductive structures are shaped in a strip, and have a width in a range of 8 μm˜15 μm.

11. The wafer for forming magnetic heads according to claim 7 , wherein the first and second conductive structures protrude above the surfaces of the first and the second electrical lapping guide pads by about 500 A˜1000 A.

12. The wafer for forming magnetic heads according to claim 7 , wherein the first and second conductive structures are made of titanium or tantalum.

13. The row bar for forming magnetic heads according to claim 1 , wherein each of the first and second electrical lapping guide pads is configured to electrically connect with a corresponding electrical lapping guide member configured on a magnetic head for measuring an electrical lapping guide resistance of the magnetic head during the lapping process.

14. The wafer for forming magnetic heads according to claim 7 , wherein each of the first and second electrical lapping guide pads is configured to electrically connect with a corresponding electrical lapping guide member configured on a magnetic head for measuring an electrical lapping guide resistance of the magnetic head during the lapping process.

Assignees

• Sae Magnetics Hk Ltd

Inventors

• Fujii Ryuji
• Chen Shi Xiong
• Wang Long Ping
• ZHANG Zeng Hui

Classifications

• G11B5/3103 Primary

  Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing · CPC title

• G11B5/1272

  Assembling or shaping of elements (G11B5/1278 takes precedence) · CPC title

• G11B5/10

  Structure or manufacture of housings or shields for heads · CPC title

• G11B5/3173

  Batch fabrication, i.e. producing a plurality of head structures in one batch · CPC title

• G11B5/3163

  Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers · CPC title