Composite electronic component

Patent metadata

Field	Value
Publication number	US-11328871-B2
Application number	US-202016872676-A
Country	US
Kind code	B2
Filing date	May 12, 2020
Priority date	Nov 25, 2019
Publication date	May 10, 2022
Grant date	May 10, 2022

Abstract

A composite electronic component includes a composite body including a multilayer ceramic capacitor and a ceramic chip coupled to each other. The multilayer ceramic capacitor includes a first ceramic body and first and second external electrodes, and the ceramic chip is disposed below the multilayer ceramic capacitor and includes a second ceramic body having first and second terminal electrodes. The multilayer ceramic capacitor and the ceramic chip are coupled by solder disposed between the first and second external electrodes and the first and second terminal electrodes, and each angle (θ) defined by inner side surfaces of the solder, respectively disposed on inner ends of bent portions of the first and second terminal electrodes disposed on an upper surface of the second ceramic body, and an upper plane of the second ceramic body of the ceramic chip satisfies 45 degrees or less.

First claim

What is claimed is:

1. A composite electronic component comprising:
a composite body including a multilayer ceramic capacitor and a ceramic chip coupled to each other,
wherein the multilayer ceramic capacitor includes a first ceramic body having a plurality of dielectric layers and internal electrodes, stacked to face each other with the respective dielectric layers interposed therebetween, and further includes first and second external electrodes disposed on opposite end portions of the first ceramic body, respectively, in a first direction,
wherein the ceramic chip is disposed below a lower surface of the first ceramic body of the multilayer ceramic capacitor in a second direction and includes a second ceramic body and first and second terminal electrodes disposed on opposite end portions of the second ceramic body, respectively, in the first direction and connected to the first and second external electrodes, respectively,
wherein solder is arranged between the first external electrode and the first terminal electrode and between the second external electrode and the second terminal electrode such that the multilayer ceramic capacitor and the ceramic chip are coupled,
wherein the solder includes first portions respectively disposed on inner ends of bent portions of the first and second terminal electrodes disposed on an upper surface of the second ceramic body facing the lower surface of the first ceramic body, and
wherein each angle (θ) defined by inner sider surfaces of the first portions of the solder and the upper surface of the second ceramic body satisfies 45 degrees or less.

2. The composite electronic component according to claim 1 , wherein, when ‘C1’ is a distance in the first direction from a central plane of the composite body to inner ends of bent portions of the first and second external electrodes disposed on the lower surface of the first ceramic body, ‘C2’ is a distance in the first direction from the central plane of the composite body to the inner ends of the bent portions of the first and second terminal electrodes disposed on the upper surface of the second ceramic body, and ‘G1’ is a gap between the first ceramic body and the second ceramic body in the second direction, (C1−C2)>G1.

3. The composite electronic component according to claim 1 , wherein, when ‘X’ is a distance in the first direction from outermost ends of the first and second terminal electrodes to the respective inner ends of the bent portions of the first and second terminal electrodes, and ‘G’ is a distance in the first direction between both of the inner ends of the bent portions of the first and second terminal electrodes, 2X>G.

4. The composite electronic component according to claim 1 , wherein, when ‘M’ is a distance in the first direction between both of inner ends of bent portions of the first and second external electrodes disposed on an upper surface of the first ceramic body opposite the lower surface of the first ceramic body, and ‘G’ is a distance in the first direction between both of the inner ends of the bent portions of the first and second terminal electrodes disposed on the upper surface of the second ceramic body, M>G.

5. The composite electronic component according to claim 1 , wherein, when ‘L1’ is a length of the multilayer ceramic capacitor in the first direction and ‘L2’ is a length of the ceramic chip in the first direction, L1≥L2.

6. The composite electronic component according to claim 1 , wherein, when ‘C’ is a distance in the first direction from a central plane of the composite body to inner ends of bent portions of the first and second external electrodes disposed on the lower surface of the first ceramic body, and ‘C2’ is a distance in the first direction from the central plane of the composite body to the inner ends of the bent portions of the first and second terminal electrodes disposed on the upper surface of the second ceramic body, C1≥C2.

7. The composite electronic component according to claim 1 , wherein the internal electrodes of the first ceramic body are stacked perpendicularly to a mounting surface of the composite body.

8. The composite electronic component according to claim 1 , wherein the second ceramic body is made of a ceramic material which includes only alumina (Al 2 O 3 ).

9. A composite electronic component comprising:
a composite body including a multilayer ceramic capacitor and a ceramic chip coupled to each other,
wherein the multilayer ceramic capacitor includes a first ceramic body having a plurality of dielectric layers and internal electrodes, stacked to face each other with the respective dielectric layers interposed therebetween, and further includes first and second external electrodes disposed on opposite end portions of the first ceramic body, respectively, in a first direction, and
wherein the ceramic chip is disposed below a lower surface of the first ceramic body of the multilayer ceramic capacitor in a second direction perpendicular to the first direction and includes a second ceramic body and first and second terminal electrodes disposed on opposite end portions of the second ceramic body, respectively, in the first direction and connected to the first and second external electrodes, respectively,
wherein, when ‘C1’ is a distance in the first direction from a central plane of the composite body to inner ends of bent portions of the first and second external electrodes disposed on the lower surface of the first ceramic body, ‘C2’ is a distance (C2) in the first direction from the central plane of the composite body to inner ends of bent portions of the first and second terminal electrodes disposed on an upper surface of the second ceramic body facing the lower surface of the first ceramic body, and ‘G1’ is a gap between the first ceramic body and the second ceramic body in the second direction, (C1−C2)>G1.

10. The composite electronic component according to claim 9 , wherein solder is arranged between the first external electrode and the first terminal electrode and between the second external electrode and the second terminal electrode such that the multilayer ceramic capacitor and the ceramic chip are coupled,
wherein the solder includes first portions respectively disposed on the inner ends of the bent portions of the first and second terminal electrodes disposed on the upper surface of the second ceramic body, and
wherein each angle (θ) defined by inner sider surfaces of the first portions of the solder and the upper surface of the second ceramic body satisfies 45 degrees or less.

11. The composite electronic component according to claim 9 , wherein, when ‘X’ is a distance in the first direction from outermost ends of the first and second terminal electrodes to the respective inner ends of the bent portions of the first and second terminal electrodes disposed on the upper surface of the second ceramic body, and ‘G’ is a distance in the first direction between both of the inner ends of the bent portions of the first and second terminal electrodes disposed on the upper surface of the second ceramic body, 2X>G.

12. The composite electronic component according to claim 9 , wherein, when ‘M’ is a distance in the first direction between both of the inner ends of the bent portions of the first and second external electrodes disposed on an upper surface of the first ceramic body opposite the lower surface of the first ceramic body, and ‘G’ is a distance in the first direction between both of the inner ends of the bent portions of the first and second terminal electrodes disposed on the upper surface of the second ceramic body, M>G.

13. The composite electronic component according to claim 9 , wherein, when

Assignees

• Samsung Electro Mech

Inventors

• Son Soo Hwan

Classifications

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/2325

  characterised by the material of the terminals · CPC title

• H01G4/38 Primary

  Multiple capacitors, i.e. structural combinations of fixed capacitors · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/1209

  characterised by the ceramic dielectric material (H01G4/1272, H01G4/1281 take precedence) · CPC title