Method for manufacturing ceramic electronic component, and ceramic electronic component

Patent metadata

Field	Value
Publication number	US-11322293-B2
Application number	US-201916264025-A
Country	US
Kind code	B2
Filing date	Jan 31, 2019
Priority date	Jun 16, 2015
Publication date	May 3, 2022
Grant date	May 3, 2022

Abstract

A manufacturing method that is capable of forming an electrode on any part of a surface of a sintered ceramic body in accordance with a simple approach, and a ceramic electronic component manufactured by the method. The method for manufacturing a ceramic electronic component includes steps of preparing a sintered ceramic body containing a metal oxide, irradiating an electrode formation region on a surface of the ceramic body with a laser to partially lower resistance of the ceramic body, thereby forming a low-resistance portion, and subjecting the ceramic body to plating to deposit a plated metal serving as an electrode on the low-resistance portion, and growing the plated metal to extend over the entire electrode formation region.

First claim

What is claimed is:

1. A ceramic electronic component comprising:
a sintered ceramic body containing a metal oxide;
a low-resistance portion formed on a surface of the ceramic body, and having resistance lowered by partially modifying the metal oxide; and
an electrode including a plated metal formed on the low-resistance portion.

2. The ceramic electronic component according to claim 1 , wherein
the low-resistance portion includes a reduced layer obtained by partially reducing the metal oxide contained in the ceramic body.

3. A ceramic electronic component comprising:
a sintered ceramic body containing a metal oxide;
a low-resistance portion formed on a surface of the ceramic body, and having resistance lowered by partially modifying the metal oxide; and
an electrode including a plated metal formed on the low-resistance portion, wherein
the low-resistance portion includes a reduced layer obtained by partially reducing the metal oxide contained in the ceramic body, and
a surface layer of the reduced layer is covered with a reoxidized layer.

4. The ceramic electronic component according to claim 1 , wherein
the ceramic body includes ferrite.

5. The ceramic electronic component according to claim 1 , wherein
the ceramic body has a rectangular parallelepiped shape,
an internal electrode is provided in the ceramic body,
an end of the internal electrode is exposed on any surface of the ceramic body,
the low-resistance portion is formed on the surface on which the end of the internal electrode is exposed, and
an external electrode serving as the electrode is formed on the low-resistance portion so as to cover the end of the internal electrode.

6. The ceramic electronic component according to claim 1 , wherein
the ceramic body is a ferrite core including flanges at both ends, and a winding core therebetween,
the low-resistance portion that is a coil-shaped low-resistance portion is formed on a peripheral surface of the winding core,
low-resistance portions connected to the coil-shaped low-resistance portion are formed on surfaces of the flanges, and
an electrode including the plated metal is continuously formed on the low-resistance portions of the flanges and the coil-shaped low-resistance portion.

7. The ceramic electronic component according to claim 6 , wherein
the electrode formed on the coil-shaped low-resistance portion is larger in film thickness, as compared with the electrode formed on the low-resistance portions of the flanges.

8. The ceramic electronic component according to claim 1 , wherein
the ceramic body is a ferrite core including flanges at both ends, and a winding core therebetween,
a wire is wound around a peripheral surface of the winding core,
the low-resistance portion is formed on each of surfaces of the flanges,
electrodes including the plated metal are formed on each of the low-resistance portions of the flanges, and
the electrodes are connected to both ends of the wire.

Assignees

• Murata Manufacturing Co

Inventors

• Maki Yoshifumi
• Ishida Takuya
• Tomioka Hirotsugu
• Hirai Shinya
• Katayama Daisuke

Classifications

• H01F17/0006 Primary

  Printed inductances (printed coils for dynamo-electric machines H02K3/26; printed circuits H05K) · CPC title

• H01F17/045

  with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core · CPC title

• H01F17/0033

  with the coil helically wound around a magnetic core · CPC title

• H01F41/041 Primary

  Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title

• H01F41/046

  structurally combined with ferromagnetic material · CPC title