Substrate processing apparatus
US-10738382-B2 · Aug 11, 2020 · US
Frame feeder
US11315808B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11315808-B2 |
| Application number | US-201816650378-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 31, 2018 |
| Priority date | Aug 1, 2017 |
| Publication date | Apr 26, 2022 |
| Grant date | Apr 26, 2022 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
The present invention includes: a heat plate for heating a lower side of a substrate sliding on an upper surface; and a heat block for heating the heat plate. The heat block includes an air heating flow path for heating air which flows in from a bottom surface side and causing the air to flow out to the heat plate side, the heat plate includes air holes for discharging the air heated by the air heating flow path from the upper surface, the heated air discharged from the air holes forms a heated air atmosphere above the heat plate, and the substrate is transported through the heat air atmosphere. Thereby, curved deformation of the substrate is suppressed.
First claim
Opening claim text (preview).
What is claimed is: 1. A frame feeder for heating and transporting a substrate, comprising: a heat plate for heating a lower side of the substrate sliding on an upper surface of the heat plate; and a heat block which is attached to a lower side of the heat plate and heats the heat plate, wherein the heat block comprises an air heating flow path for heating air which flows in from a bottom surface side and causing the air to flow out to the heat plate side, the heat plate comprises air holes for discharging the air heated by the air heating flow path of the heat block from the upper surface, and the heated air discharged from the air holes forms a heated air atmosphere above the heat plate, and the substrate is transported through the heated air atmosphere, a flow rate of the air flowing through the air heating flow path is a flow rate at which a temperature of the heated air discharged from the air holes is substantially the same as a temperature of the upper surface of the heat plate. 2. The frame feeder according to claim 1 , wherein the air heating flow path of the heat block is a labyrinth flow path comprising at least one turn. 3. The frame feeder according to claim 2 , wherein the upper surface of the heat plate is open to the atmosphere, and the air holes diffuse the heated air atmosphere to surroundings. 4. The frame feeder according to claim 2 , wherein the heat plate is formed by a material having a thermal diffusivity of 1×10 −5 to 8×10 −5 (m 2 /sec). 5. The frame feeder according to claim 2 , wherein a plurality of the air holes in the heat plate is arranged side by side in a direction intersecting a transport direction of the substrate. 6. The frame feeder according to claim 5 , wherein the heat plate is formed by a material having a thermal diffusivity of 1×10 −5 to 8×10 −5 (m 2 /sec). 7. The frame feeder according to claim 1 , wherein the heat plate is formed by a material having a thermal diffusivity of 1×10 −5 to 8×10 −5 (m 2 /sec). 8. The frame feeder according to claim 7 , wherein the upper surface of the heat plate is open to the atmosphere, and the air holes diffuse the heated air atmosphere to surroundings. 9. The frame feeder according to claim 1 , wherein the upper surface of the heat plate is open to the atmosphere, and the air holes diffuse the heated air atmosphere to surroundings.
Assignees
Inventors
Classifications
Materials of bond wires · CPC title
Connecting techniques · CPC title
Thermally treating (reflowing H10W72/01357) · CPC title
Treating the bonding area before connecting, e.g. by applying flux or cleaning · CPC title
Means for moving chips, wafers or other parts, e.g. conveyor belts · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11315808B2 cover?
- The present invention includes: a heat plate for heating a lower side of a substrate sliding on an upper surface; and a heat block for heating the heat plate. The heat block includes an air heating flow path for heating air which flows in from a bottom surface side and causing the air to flow out to the heat plate side, the heat plate includes air holes for discharging the air heated by the air…
- Who is the assignee on this patent?
- Shinkawa Kk
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0432. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 26 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).