Mounting apparatus

Patent metadata

Field	Value
Publication number	US-10118246-B2
Application number	US-201715632570-A
Country	US
Kind code	B2
Filing date	Jun 26, 2017
Priority date	Dec 26, 2014
Publication date	Nov 6, 2018
Grant date	Nov 6, 2018

Abstract

Provided is a bonding apparatus including a bonding stage 83 for heating a substrate (lead frame) 61 placed on the upper surface thereof or a semiconductor die 63 mounted on the substrate (lead frame) 61 , an imaging device 20 arranged above the bonding stage 83 to image the substrate 61 placed on the bonding stage 83 or the semiconductor die 63 mounted on the substrate 61 , and a standing wave generating device 35 for generating an ultrasonic standing wave in the space between the upper surface of the bonding stage 83 and the imaging device 20 . This improves the accuracy of image position detection by the imaging device with a simple structure.

First claim

The invention claimed is:

1. A mounting apparatus comprising:
a mounting stage for heating a bonding target placed on the upper surface thereof and an electronic component mounted on the bonding target;
an imaging device arranged above the mounting stage to image the bonding target placed on the mounting stage or the bonding target and the electronic component; and
a standing wave generating device for generating an ultrasonic standing wave in the space between the upper surface of the mounting stage and the imaging device.

2. The mounting apparatus according to claim 1 , wherein
the standing wave generating device includes an ultrasonic speaker and a reflection surface for reflecting an ultrasonic wave emitted from the ultrasonic speaker.

3. The mounting apparatus according to claim 2 , wherein
the reflection surface is a surface of a flat plate arranged in a manner opposed to the ultrasonic speaker.

4. The mounting apparatus according to claim 3 , wherein
the imaging device is movable in an XY direction, and wherein
the flat plate is arranged to move together with the imaging device in the XY direction.

5. The mounting apparatus according to claim 4 , wherein
the distance between the optical axis of the imaging device and the surface of the flat plate is (2n−1)/4 times (n is a positive integer) the wavelength λ of the ultrasonic wave so that an anti-node of the standing wave is positioned in the vicinity of the optical axis.

6. The mounting apparatus according to claim 3 , further comprising a wind clamper for pressing the bonding target or the surface of the bonging target on which the electronic component is mounted toward the mounting state, wherein
the flat plate is attached to the upper surface of the wind clamper in an end portion farther from the ultrasonic speaker.

7. The mounting apparatus according to claim 2 , wherein
the reflection surface is composed of a surface of a half mirror arranged in an inclined manner between the imaging device and the mounting stage and the surface of the bonding target placed on the mounting stage.

8. The mounting apparatus according to claim 2 , wherein
the reflection surface is composed of a surface of a curved mirror arranged in a manner opposed to the ultrasonic speaker and a surface of a flat plate arranged in a manner opposed to the curved mirror with the ultrasonic speaker and the mounting stage therebetween.

9. The mounting apparatus according to claim 8 , wherein
the curved mirror is a parabolic mirror or an ellipsoidal mirror.

10. The mounting apparatus according to claim 1 , wherein
the standing wave generating device includes two ultrasonic speakers arranged in a manner opposed to each other.

11. The mounting apparatus according to claim 1 , wherein
the standing wave generating device is a piezoelectric element arranged between the imaging device and the mounting stage to form a tube opened toward the mounting stage, and wherein
a standing wave region is formed between the opening and the upper surface of the mounting stage.

12. The mounting apparatus according to claim 1 , wherein
the bonding target is a substrate or a lead frame.

Assignees

• Shinkawa Kk
• Shinikawa Ltd

Inventors

• Hayata Shigeru
• Yuzawa Hiroya
• Matsuki Yusuke

Classifications

• H10W72/552

  comprising metals or metalloids, e.g. silver · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/5449

  not being orthogonal to a side surface of the chip, e.g. fan-out arrangements · CPC title