Method for producing plated component, plated component, catalytic activity inhibitor and composite material for electroless plating

Patent metadata

Field	Value
Publication number	US-11310918-B2
Application number	US-202117228897-A
Country	US
Kind code	B2
Filing date	Apr 13, 2021
Priority date	Mar 11, 2016
Publication date	Apr 19, 2022
Grant date	Apr 19, 2022

Abstract

A method for producing a plated part, includes: forming, on a surface of a base member, a catalyst activity inhibiting layer containing a polymer which has at least one of an amide group and an amino group; irradiating with light or heating a part of the surface of the base member on which the catalyst activity inhibiting layer is formed; applying an electroless plating catalyst to the surface of the base member heated or irradiated with the light; and bringing an electroless plating solution into contact with the surface of the base member to which the electroless plating catalyst is applied, to form an electroless plating film at a light-irradiated portion or a heated portion of the surface.

First claim

What is claimed is:

1. A method for producing a plated part, comprising:
forming, on a surface of a base member, a catalyst activity inhibiting layer containing a dendritic polymer which has an aromatic ring and at least one of an amide group and an amino group, wherein the dendritic polymer has a group containing sulfur;
irradiating with light or heating a part of the surface of the base member on which the catalyst activity inhibiting layer is formed;
applying an electroless plating catalyst to the surface of the base member heated or irradiated with the light; and
bringing an electroless plating solution into contact with the surface of the base member to which the electroless plating catalyst is applied, to form an electroless plating film at a light-irradiated portion or a heated portion of the surface.

2. The method for producing the plated part according to claim 1 , further comprising washing the surface of the base member after the part of the surface of the base member is heated or irradiated with the light and before the electroless plating solution is brought into contact with the surface of the base member.

3. The method for producing the plated part according to claim 1 , wherein an inhibiting layer-removed portion from which the catalyst activity inhibiting layer is removed and an inhibiting layer-remaining portion in which the catalyst activity inhibiting layer remains are formed on the base member by the irradiating with the light or the heating the part of the surface of the base member, and
the electroless plating film is formed at the inhibiting layer-removed portion.

4. The method for producing the plated part according to claim 1 , wherein the dendritic polymer is a hyper-branched polymer.

5. The method for producing the plated part according to claim 1 , wherein the dendritic polymer has a number average molecular weight of 3,000 to 30,000 and has a weight average molecular weight of 10,000 to 300,000.

6. The method for producing the plated part according to claim 1 , wherein the group containing sulfur is a sulfide group or a dithiocarbamate group.

7. A method for producing a plated part, comprising:
forming, on a surface of a base member, a catalyst activity inhibiting layer containing a dendritic polymer which has an aromatic ring and at least one of an amide group and an amino group wherein the dendritic polymer is represented by the following formula (1),

in the formula (1),
A 1 is a group containing an aromatic ring, A 2 is a group containing sulfur or an amino group,
R 1 is a single bond or a substituted or unsubstituted alkylene group having 1 to 5 carbon atoms, each of R 2 and R 3 is hydrogen or a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, and
m1 is in a range of 1 to 10, and n1 is in a range of 5 to 100;

irradiating with light or heating a part of the surface of the base member on which the catalyst activity inhibiting layer is formed;
applying an electroless plating catalyst to the surface of the base member heated or irradiated with the light; and
bringing an electroless plating solution into contact with the surface of the base member to which the electroless plating catalyst is applied, to form an electroless plating film at a light-irradiated portion or a heated portion of the surface.

8. The method for producing the plated part according to claim 7 , wherein the dendritic polymer is represented by the formula (1), and wherein in the formula (1), A 1 is a group represented by the following formula (2):

A 2 is a dithiocarbamate group, R 1 is a single bond, R 2 is hydrogen, and R 3 is an isopropyl group.

9. The method for producing the plated part according to claim 7 , further comprising washing the surface of the base member after the part of the surface of the base member is heated or irradiated with the light and before the electroless plating solution is brought into contact with the surface of the base member.

10. The method for producing the plated part according to claim 7 , wherein an inhibiting layer-removed portion from which the catalyst activity inhibiting layer is removed and an inhibiting layer-remaining portion in which the catalyst activity inhibiting layer remains are formed on the base member by the irradiating with the light or the heating the part of the surface of the base member, and
the electroless plating film is formed at the inhibiting layer-removed portion.

11. The method for producing the plated part according to claim 7 , wherein the dendritic polymer is a hyper-branched polymer.

12. The method for producing the plated part according to claim 7 , wherein the dendritic polymer has a number average molecular weight of 3,000 to 30,000 and has a weight average molecular weight of 10,000 to 300,000.

Assignees

• Maxell Ltd

Inventors

• Usuki Naoki
• Kito Akiko
• Yusa Atsushi

Classifications

• C23C18/2066

  Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers · CPC title

• C08L2203/20

  use in electrical or conductive gadgets · CPC title

• C23C18/1612

  through irradiation means · CPC title

• H05K3/182 Primary

  characterised by the patterning method · CPC title

• C23C18/38 Primary

  Coating with copper · CPC title