Chamber apparatus for chemical etching of dielectric materials

Patent metadata

Field	Value
Publication number	US-11302520-B2
Application number	US-201514747367-A
Country	US
Kind code	B2
Filing date	Jun 23, 2015
Priority date	Jun 28, 2014
Publication date	Apr 12, 2022
Grant date	Apr 12, 2022

Abstract

Implementations of the disclosure generally provide an improved pedestal heater for a processing chamber. The pedestal heater includes a temperature-controlled plate having a first surface and a second surface opposing the first surface. The temperature-controlled plate includes an inner zone comprising a first set of heating elements, an outer zone comprising a second set of heating elements, the outer zone surrounding the inner zone, and a continuous thermal choke disposed between the inner zone and the outer zone, and a substrate receiving plate having a first surface and a second surface opposing the first surface, the second surface of the substrate receiving plate is coupled to the first surface of the temperature-controlled plate. The continuous thermal choke enables a very small temperature gradient to be created and manipulated between the inner zone and the outer zone, allowing center-fast or edge-fast etching profile to achieve on a surface of the substrate.

First claim

We claim:

1. A pedestal heater for a processing chamber, comprising:
a temperature-controlled plate having a first surface and a second surface opposing the first surface, comprising:
a first zone comprising a first set of heating elements; and
a second zone comprising a second set of heating elements, the second zone surrounding the first zone;

a substrate receiving plate having a first surface and a second surface opposing the first surface, wherein the second surface of the substrate receiving plate is coupled to the first surface of the temperature-controlled plate;
a continuous annular thermal choke disposed between the first zone and the second zone, wherein the thermal choke is a cut-out formed through the entire thickness of the temperature-controlled plate and into a thickness of the substrate receiving plate so that a portion of the substrate receiving plate disposed above the second zone is connected to a portion of the substrate receiving plate disposed above the first zone by a thin bridge;
a bore formed through the thin bridge, wherein the bore opens into the cut-out;
a base support plate having a first surface and a second surface opposing the first surface, the first surface of the base support plate is disposed proximate the second surface of the temperature-controlled plate, and the base support plate has a plurality of fluid channels;
a blocking plate disposed between the base support plate and the temperature-controlled plate, wherein the blocking plate is sized to cover the plurality of fluid channels, wherein an upper surface of the blocking plate is in direct contact with the first and second set of heating elements, wherein the blocking plate physically isolates the plurality of fluid channels from the first and second set of heating elements, wherein at least one fluid channel is disposed below the first zone of the temperature-controlled plate and at least one fluid channel is disposed below the second zone of the temperature-controlled plate;
and
a lift pin sized to pass through the bore in the thin bridge.

2. The pedestal heater of claim 1 , wherein the first zone covers the majority of the temperature-controlled plate around its central region.

3. The pedestal heater of claim 1 , wherein the temperature-controlled plate, the base support plate, and the substrate receiving plate are formed of aluminum, stainless steel, aluminum oxide, or aluminum nitride.

4. A pedestal heater for a processing chamber, comprising:
a substrate receiving plate having an upper surface and a bottom surface opposing the upper surface;
a temperature-controlled plate having an upper surface and a bottom surface opposing the upper surface, the upper surface of the temperature-controlled plate is coupled to the bottom surface of the substrate receiving plate, the temperature-controlled plate comprising:
a first zone disposed in a central region of the temperature-controlled plate, the temperature-controlled plate comprising a first set of heating elements disposed in the first zone; and
a second zone disposed around the first zone, the temperature-controlled plate comprising a second set of heating elements disposed in the second zone;

a cut-out disposed between the first zone and the second zone, the cut-out extending through the temperature-controlled plate from the bottom surface to the upper surface and into a portion of the substrate receiving plate to provide a bridge portion in the substrate receiving plate;
a base support plate having an upper surface and a bottom surface opposing the upper surface, the base support plate having a plurality of fluid channels disposed in the upper surface;
a blocking plate disposed between the base support plate and the temperature-controlled plate, wherein the blocking plate is sized to cover the plurality of fluid channels, wherein an upper surface of the blocking plate is in direct contact with the first and second set of heating elements, wherein the blocking plate physically isolates the plurality of fluid channels from the first and second set of heating elements, wherein at least one fluid channel is disposed below the first zone of the temperature-controlled plate and at least one fluid channel is disposed below the second zone of the temperature-controlled plate;
a bore formed through the bridge portion, wherein the bore opens into the cut-out; and
a lift pin sized to pass through the bore formed through the thin bridge.

5. The pedestal heater of claim 4 , wherein the first zone is concentric with the second zone.

6. The pedestal heater of claim 4 , wherein the temperature-controlled plate, the base support plate, the blocking plate, and the substrate receiving plate are formed of aluminum, stainless steel, aluminum oxide, or aluminum nitride.

7. The pedestal heater of claim 4 , wherein the first and second sets of heating elements are arranged in a radially symmetrical manner about the central region.

8. The pedestal heater of claim 1 , wherein the ratio of the thickness of the thin bridge to the combined thickness of the substrate receiving plate and the temperature-controlled plate is about 1:1.05 to about 1:10.

9. The pedestal heater of claim 1 , wherein a top surface of the thin bridge portion forms a portion of the first surface of the substrate receiving plate.

Assignees

• Applied Materials Inc

Inventors

• Tan Tien Fak
• Lubomirsky Dmitry
• Floyd Kirby H
• Nguyen Son T
• Palagashvili David
• Tam Alexander
• Chen Shaofeng

Classifications

• H01J37/32715

  Workpiece holder · CPC title

• H01J37/32522

  Temperature · CPC title

• H10P72/0431 Primary

  Apparatus for thermal treatment · CPC title

• H01J37/32724 Primary

  Temperature · CPC title