Cleaning compositions

Patent metadata

Field	Value
Publication number	US-11279903-B2
Application number	US-202016923535-A
Country	US
Kind code	B2
Filing date	Jul 8, 2020
Priority date	Mar 28, 2018
Publication date	Mar 22, 2022
Grant date	Mar 22, 2022

Abstract

This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one alkylsulfonic acid or a salt thereof, the alkylsulfonic acid containing an alkyl group substituted by OH or NH 2 ; and 3) at least one aminoalcohol.

First claim

What is claimed is:

1. A cleaning composition, comprising:
1) at least one redox agent;
2) at least one alkylsulfonic acid or a salt thereof, the alkylsulfonic acid comprising an alkyl group substituted by OH or NH 2 ; and
3) at least one aminoalcohol;
wherein the composition is free of a fluoride-containing compound.

2. The composition of claim 1 , wherein the composition has a pH from about 8 to about 11.

3. The composition of claim 1 , wherein the at least one alkylsulfonic acid comprises an alkylsulfonic acid of formula (I):
R—SO 3 H   (I),

in which R is C 1 -C 10 alkyl substituted by at least one substituent selected from the group consisting of OH and NH 2 .

4. The composition of claim 3 , wherein R is C 1 -C 4 alkyl substituted by at least one OH.

5. The composition of claim 1 , wherein the at least one alkylsulfonic acid or a salt thereof comprises HO(CH 2 ) 2 SO 3 H or HO(CH 2 ) 2 SO 3 NH 4 .

6. The composition of claim 1 , wherein the at least one alkylsulfonic acid or a salt thereof is from about 0.3% by weight to about 5% by weight of the composition.

7. The composition of claim 1 , wherein the at least one redox agent comprises hydroxylamine.

8. The composition of claim 1 , wherein the at least one redox agent is from about 6% by weight to about 15% by weight of the composition.

9. The composition of claim 1 , wherein the at least one aminoalcohol comprises ethanolamine or 2-(2-aminoethoxy)ethanol.

10. The composition of claim 1 , wherein the at least one aminoalcohol is from about 5% by weight to about 10% by weight of the composition.

11. The composition of claim 1 , further comprising at least one corrosion inhibitor.

12. The composition of claim 11 , wherein the at least one corrosion inhibitor comprises benzotriazole optionally substituted by at least one substituent selected from the group consisting of alkyl groups, aryl groups, halogen groups, amino groups, nitro groups, alkoxy groups, and hydroxyl groups.

13. The composition of claim 11 , wherein the at least one corrosion inhibitor comprises a compound selected from the group consisting of benzotriazole, 5-aminotetrazole, 1-hydroxybenzotriazole, 5-phenylthiol-benzotriazole, 5-chlorobenzotriazole, 4-chlorobenzotriazole, 5-bromobenzotriazole, 4-bromobenzotriazole, 5-fluorobenzotriazole, 4-fluorobenzotriazole, naphthotriazole, tolyltriazole, 5-phenyl-benzotriazole, 5-nitrobenzotriazole, 4-nitrobenzotriazole, 3-amino-5-mercapto-1,2,4-triazole, 2-(5-amino-pentyl)-benzotriazole, 1-amino-benzotriazole, 5-methylbenzotriazole, benzotriazole-5-carboxylic acid, 4-methylbenzotriazole, 4-ethylbenzotriazole, 5-ethylbenzotriazole, 4-propylbenzotriazole, 5-propylbenzotriazole, 4-isopropylbenzotriazole, 5-isopropylbenzotriazole, 4-n-butylbenzotriazole, 5-n-butylbenzotriazole, 4-isobutylbenzotriazole, 5-isobutylbenzotriazole, 4-pentylbenzotriazole, 5-pentylbenzotriazole, 4-hexylbenzotriazole, 5-hexylbenzotriazole, 5-methoxybenzotriazole, 5-hydroxybenzotriazole, dihydroxypropylbenzotriazole, 1-[N,N-bis(2-ethylhexyl)aminomethyl]-benzotriazole, 5-t-butylbenzotriazole, 5-(1′,1′-diimethylpropyl)-benzotriazole, 5-(1′,1′,3′-trimethylbutyl)benzotriazole, 5-n-octylbenzotriazole, and 5-(1′,1′,3′,3′-tetramethylbutyl)benzotriazole.

14. The composition of claim 11 , wherein the at least one corrosion inhibitor is from about 0.1% by weight to about 2% by weight of the composition.

15. The composition of claim 1 , wherein the composition further comprises at least one pH adjusting agent and the at least one pH adjusting agent comprises an acid.

16. The composition of claim 15 , wherein the at least one pH adjusting agent is from about 1% by weight to about 10% by weight of the composition.

17. The composition of claim 1 , wherein the composition further comprising at least one organic solvent and the at least one organic solvent comprises a solvent selected from the group consisting of water soluble alcohols, water soluble ketones, water soluble esters, and water soluble ethers.

18. The composition of claim 17 , wherein the at least one organic solvent comprises a solvent selected from the group consisting of alkylene glycols and alkylene glycol ethers.

19. The composition of claim 17 , wherein the at least one organic solvent is from about 30% by weight to about 50% by weight of the composition.

20. The composition of claim 1 , further comprises water.

21. The composition of claim 20 , wherein water is from about 20% by weight to about 50% by weight of the composition.

22. The composition of claim 1 , wherein
the at least one redox agent is from about 6% by weight to about 15% by weight of the composition;
the at least one alkylsulfonic acid or a salt thereof is from about 0.3% by weight to about 5% by weight of the composition; and
the at least one aminoalcohol is from about 5% by weight to about 10% by weight of the composition.

23. The composition of claim 22 , wherein the at least one redox agent comprises hydroxylamine.

24. A cleaning composition, comprising:
1) at least one redox agent in an amount of from about 6% by weight to about 15% by weight of the composition;
2) at least one alkylsulfonic acid or a salt thereof in an amount of from about 0.3% by weight to about 5% by weight of the composition, the alkylsulfonic acid comprising an alkyl group substituted by OH or NH 2 ;
3) at least one aminoalcohol in an amount of from about 5% by weight to about 10% by weight of the composition;
4) at least one corrosion inhibitor in an amount of from about 0.1% by weight to about 2% by weight of the composition;
5) at least one organic solvent in an amount of from about 30% by weight to about 50% by weight of the composition; and
6) water in an amount of from about 20% by weight to about 50% by weight of the composition.

25. A method, comprising:
contacting a semiconductor substrate containing post etch residues or post ashing residues with a cleaning composition of claim 1 .

26. The method of claim 25 , wherein the semiconductor substrate further comprises at least one material selected from the group consisting of Cu, Co, W, AlOx, AlN, AlOxNy, Ti, TiN, Ta, TaN, TiOx, ZrOx, HfOx, and TaOx.

27. The method of claim 25 , further comprising rinsing the semiconductor substrate with a rinse solvent after the contacting step.

28. The method of claim 27 , further comprising drying the semiconductor substrate after the rinsing step.

29. The method of claim 25 , further comprising forming a semiconductor device from the semiconductor substrate.

30. The composition of claim 24 , wherein the composition has a pH from about 8 to about 11.

31. The composition of claim 24 , wherein the at least one alkylsulfonic acid comprises an alkylsulfonic acid of formula (I):
R—SO 3 H   (I),

in which R is C 1 -C 10 alkyl substituted by at least one substituent selected from the group consisting of OH and NH 2 .

32. The composition of claim 31 , wherein R is C 1 -C 4 alkyl substituted by at least one OH.

33. The composition of claim 24 , wherein the at least one alkylsulfonic acid or a salt thereof comprises HO(CH 2 ) 2 SO 3 H or HO(CH 2 ) 2 SO 3 NH 4 .

34. The composition of claim 1 , wherein the at least one alkylsulfonic acid or a salt thereof is from about 0.4% by weight to ab

Assignees

• Fujifilm Electronic Mat Usa Inc

Inventors

• Dory Thomas
• Bjelopavlic Mick
• Guske Joshua
• Takahashi Kazutaka

Classifications

• H10P70/10

  Cleaning before device manufacture, i.e. Begin-Of-Line process · CPC title

• H10P70/234

  the processing being the formation of vias or contact holes · CPC title

• C11D2111/22

  Electronic devices, e.g. PCBs or semiconductors · CPC title

• C11D7/06 Primary

  Hydroxides · CPC title

• C11D7/3281 Primary

  Heterocyclic compounds · CPC title