Integrated circuits and methods for forming thin film crystal layers

Patent metadata

Field	Value
Publication number	US-11276644-B2
Application number	US-201816221798-A
Country	US
Kind code	B2
Filing date	Dec 17, 2018
Priority date	Dec 17, 2018
Publication date	Mar 15, 2022
Grant date	Mar 15, 2022

Abstract

An aspect of the disclosure relates to an integrated circuit. The integrated circuit includes a first electrically conductive structure, a thin film crystal layer located on the first electrically conductive structure, and a second electrically conductive structure including metal e.g. copper. The second electrically conductive structure is located on the thin film crystal layer. The first electrically conductive structure is electrically connected to the second electrically conductive structure through the thin film crystal layer. The thin film crystal layer may be provided as a copper diffusion barrier.

First claim

What is claimed is:

1. An integrated circuit comprising:
a first electrically conductive structure comprising a first Cu concentration;
a diffusion barrier comprising a thin film crystal layer located on the first electrically conductive structure,
wherein the thin film crystal layer is a heterojunction thin film crystal layer comprising at least two different thin film crystals;
wherein the thin film crystals comprise a transition metal dichalcogenide, a ternary MAX phase carbide, or ternary MAX phase nitride material; and

a second electrically conductive structure comprising metal,
wherein the second electrically conductive structure comprises greater than 50% copper as a second Cu concentration,
wherein the first Cu concentration is less than 20% of the second Cu concentration,
wherein the second electrically conductive structure is located on the thin film crystal layer, and
wherein the first electrically conductive structure is electrically connected to the second electrically conductive structure through the thin film crystal layer.

2. The integrated circuit according to claim 1 , wherein the second electrically conductive structure comprises copper.

3. The integrated circuit according to claim 1 , wherein a thickness of the thin film crystal layer is smaller than 10 nm.

4. The integrated circuit according to claim 1 , wherein the thin film crystal layer comprises less than 20 two-dimensional crystalline monolayers.

5. The integrated circuit according to claim 1 , wherein the thin film crystal layer comprises at least 10% of metal atoms, wherein the metal atoms are Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, Rf, Db, Sg, Bh, Hs, Mt, Ds, or Rg.

6. The integrated circuit according to claim 1 , wherein the thin film crystal layer comprises at least 10% of secondary atoms, wherein the secondary atoms are S, Cl, H, O, Se, or Te.

7. The integrated circuit according to claim 1 , wherein the heterojunction thin film crystal layer comprises the ternary MAX phase carbide or ternary MAX phase nitride material as a first thin film crystal layer and the transition metal dichalcogenide layer as a second thin film crystal layer.

8. The integrated circuit according to claim 1 , wherein the second electrically conductive structure is electrically connected to at least one of a source region, a drain region, and a gate of a transistor of the integrated circuit.

9. The integrated circuit according to claim 1 , wherein a contact interface between the thin film crystal layer and a structure adjacent to the thin film crystal layer is voidless.

Assignees

• Intel Corp

Inventors

• Naylor Carl
• Agrawal Ashish
• Lin Kevin
• Sharma Abhishek
• Kobrinsky Mauro
• Jezewski Christopher
• Alaan Urusa

Classifications

• H10P14/418

  the conductive layers comprising transition metals · CPC title

• H10P14/3436

  being chalcogenide semiconductor materials not being oxides, e.g. ternary compounds · CPC title

• H10P14/203

  using transformation of metal, e.g. oxidation or nitridation · CPC title

• H10W20/055

  by formation methods other than physical vapour deposition [PVD], chemical vapour deposition [CVD] or liquid deposition · CPC title

• H10W20/42

  Vias, e.g. via plugs · CPC title