Technologies for Estimating Remaining Life of Integrated Circuits Using On-Chip Memory
US-2017255507-A1 · Sep 7, 2017 · US
US11269006B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11269006-B2 |
| Application number | US-202017062225-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 2, 2020 |
| Priority date | Apr 19, 2016 |
| Publication date | Mar 8, 2022 |
| Grant date | Mar 8, 2022 |
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The disclosed technology generally relates to integrated circuit devices with wear out monitoring capability. An integrated circuit device includes a wear-out monitor device configured to record an indication of wear-out of a core circuit separated from the wear-out monitor device, wherein the indication is associated with localized diffusion of a diffusant within the wear-out monitor device in response to a wear-out stress that causes the wear-out of the core circuit.
Opening claim text (preview).
What is claimed is: 1. A monitor system comprising: a monitor device comprising a reservoir and a diffusion region configured such that an exposure of the monitor device to a stress condition causes atomic diffusion of a diffusant from the reservoir into the diffusion region, wherein the monitor device is configured to initiate recording an indication of the exposure by diffusing the diffusant from the reservoir into the diffusion region; and a measurement circuit configured to be operated away from a location of the stress condition, the measurement circuit configured to measure a change in electrical characteristics of the monitor device caused by the atomic diffusion. 2. The monitor system of claim 1 , wherein the measurement circuit is configured to be physically and electrically disconnected from the monitor device when the stress condition causes the atomic diffusion, and be electrically connected to the monitor device when a measurement of the change in the electrical characteristics is made. 3. The monitor system of claim 2 , wherein the monitor device is configured to record indications of exposures to some stress conditions that are outside of operating conditions under which the measurement circuit is designed to operate. 4. The monitor system of claim 1 , wherein the monitor device is configured to record an indication of the exposure without being powered. 5. The monitor system of claim 1 , wherein the measurement circuit is configured to be operated wirelessly to measure the change in the electrical characteristics. 6. The monitor system of claim 1 , wherein the diffusant has a diffusion activation energy between 0.75 eV and 2.5 eV. 7. The monitor system of claim 1 , wherein the diffusant comprises one or more elements selected from the group consisting of aluminum (Al), cobalt (Co), platinum (Pt), sulfur (S), nickel (Ni), silver (Ag), zinc (Zn), gold (Au), chromium (Cr), copper (Cu), iron (Fe), sodium (Na) and potassium (K). 8. The monitor system of claim 1 , wherein the monitor device is configured to initiate recording the indication of the exposure by diffusing the diffusant through a physical diffusion barrier and into the diffusion region in response to an applied stimulus prior to the exposure of the monitor device to the stress condition. 9. The monitor system of claim 8 , wherein the physical diffusion barrier has an energy barrier associated with the atomic diffusion of the diffusant therethrough corresponding to a temperature exceeding 125° C. 10. The monitor system of claim 1 , wherein the monitor device comprises a plurality of monitor structures spatially distributed over a substrate, wherein each of the monitor structures comprises the reservoir and the diffusion region configured such that an exposure of the monitor structures to the stress condition causes atomic diffusion of the diffusant from the reservoir into the diffusion region. 11. The monitor system of claim 10 , wherein the monitor structures are arranged as an array of monitor structures configured to record a spatially resolved indication of the exposure to the stress condition. 12. The monitor system of claim 10 , wherein different ones of the monitor structures are configured to diffuse respective diffusants at different diffusion rates within respective diffusion regions. 13. The monitor system of claim 12 , wherein the different ones of the monitor structures comprise respective reservoirs containing different diffusants. 14. The monitor system of claim 10 , wherein each of the monitor structures further comprises a physical diffusion barrier disposed between the reservoir and the diffusion region, wherein the physical diffusion barrier is configured such that the diffusant diffuses through the physical diffusion barrier in response to activation by a stimulus prior to the exposure of the monitor structures to the stress condition. 15. The monitor system of claim 14 , wherein the physical diffusion barrier has an energy barrier associated with the atomic diffusion of the diffusant therethrough corresponding to a temperature exceeding 125° C. 16. The monitor system of claim 1 , wherein the monitor device comprises the reservoir and a plurality of differently arranged diffusion regions each configured such that the exposure of the monitor device to the stress condition causes atomic diffusion of the diffusant from the reservoir into one or more of the differently arranged diffusion regions. 17. The monitor system device of claim 16 , wherein the monitor device comprises a plurality of different reservoirs and corresponding ones of the diffusion regions, wherein the different ones of the reservoirs comprise different diffusants. 18. The monitor system of claim 16 , wherein each of the diffusion regions extends in a direction of diffusion of the diffusant and comprises a plurality of electrically accessible measurement structures arranged along the direction of diffusion. 19. The monitor system of claim 16 , wherein the monitor device further comprises a physical diffusion barrier disposed between the reservoir and the diffusion regions, wherein the physical diffusion barrier is configured such that the diffusant diffuses through the diffusion barrier in response to activation by a stimulus. 20. The monitor system of claim 19 , wherein the physical diffusion barrier has an energy barrier associated with the diffusion of the diffusant therethrough corresponding to a temperature exceeding 125° C. 21. The monitor system of claim 1 , wherein the stress condition includes an ambient condition. 22. The monitor system of claim 1 , wherein the monitor system is installed in an automobile.
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