Substrate bonding apparatus

Patent metadata

Field	Value
Publication number	US-11267237-B2
Application number	US-202017011890-A
Country	US
Kind code	B2
Filing date	Sep 3, 2020
Priority date	Sep 12, 2019
Publication date	Mar 8, 2022
Grant date	Mar 8, 2022

Abstract

According to one embodiment, there is provided a substrate bonding apparatus including a first suction stage, a second suction stage, and a pressing member. The first suction stage sucks a first substrate. The second suction stage is arranged so as to face the first substrate. The second suction stage sucks the second substrate. The pressing member is capable of deforming the first substrate sucked on the first suction stage so as to be convex toward the second suction stage side. The pressing member has a marking structure on a distal end side.

First claim

What is claimed is:

1. A substrate bonding apparatus comprising:
a first suction stage that sucks a first substrate;
a second suction stage that is arranged so as to face the first substrate and that sucks a second substrate;
a pressing member that is capable of deforming the first substrate sucked on the first suction stage so as to be convex toward the second suction stage side and that has a marking structure on a distal end side, the marking structure including a marking portion on a distal end surface, the marking portion having a marking pattern, and the distal end surface being a surface to come into contact with the first substrate; and
a coater having a space configured to store a marking liquid to be coated on the marking portion.

2. The substrate bonding apparatus according to claim 1 , wherein the marking pattern extends in a grid shape in plan view.

3. The substrate bonding apparatus according to claim 1 , wherein the marking pattern extends in a cross shape in plan view.

4. The substrate bonding apparatus according to claim 1 , wherein the marking pattern extends radially in plan view.

5. The substrate bonding apparatus according to claim 1 , further comprising
an adjusting mechanism that adjusts a tilt angle of the pressing member from a normal line of a surface of the second suction stage in a predetermined direction, wherein
the marking portion has a shape that is angled toward the predetermined direction in plan view.

6. The substrate bonding apparatus according to claim 5 , wherein
the marking pattern has a rectangular outer contour in plan view, and
the marking pattern extends in a grid shape along sides of the outer contour.

7. The substrate bonding apparatus according to claim 5 , wherein
the marking pattern has a rectangular outer contour in plan view, and
the marking pattern extends in a grid shape along diagonal lines of the outer contour.

8. The substrate bonding apparatus according to claim 5 , wherein the marking pattern extends in a grid shape so as to include a pattern along the predetermined direction in plan view.

9. The substrate bonding apparatus according to claim 5 , wherein the marking pattern extends in a cross shape so as to include a pattern along the predetermined direction in plan view.

10. The substrate bonding apparatus according to claim 5 , wherein the marking pattern extends radially so as to include a pattern along the predetermined direction in plan view.

11. The substrate bonding apparatus according to claim 5 , wherein a distal end portion of the pressing member is supported by a pin, and
the adjusting mechanism includes:
a first driver that is capable of tilting the pin in a first direction; and
a second driver that is capable of tilting the pin in a second direction.

12. The substrate bonding apparatus according to claim 1 , wherein
the coater includes:
side wall portions; and
a coating base, and

the side wall portions and the coating base surround the space.

13. The substrate bonding apparatus according to claim 12 , wherein an upper surface of the coating base is lower than upper ends of the side wall portions.

Assignees

• Kioxia Corp

Inventors

• Terai Hayato
• Takakuwa Manabu

Classifications

• H10P72/0614

  Marking devices · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10P72/53

  using optical controlling means · CPC title

• B23K20/02

  by means of a press {; Diffusion bonding} · CPC title