Film interposer for integrated circuit devices
US-9490240-B2 · Nov 8, 2016 · US
US11264688B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11264688-B2 |
| Application number | US-201816624067-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 23, 2018 |
| Priority date | Jun 23, 2017 |
| Publication date | Mar 1, 2022 |
| Grant date | Mar 1, 2022 |
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An interposer ( 16 ) and a substrate ( 10 ) incorporating the interposer ( 16 ) are provided. The interposer ( 16 ) includes one or more layers ( 18 ) and a cavity ( 20 ) defined in the one or more layers ( 18 ), the cavity ( 20 ) being configured as a waveguide for propagation of electromagnetic waves.
Opening claim text (preview).
The invention claimed is: 1. An interposer, comprising: one or more layers, wherein each of the one or more layers is formed only of a plurality of nanostructures; and a cavity defined in the one or more layers, wherein the cavity is configured as a waveguide for propagation of electromagnetic waves. 2. The interposer of claim 1 , further comprising a slow-wave structure provided in the one or more layers, the slow-wave structure being in communication with the waveguide. 3. The interposer of claim 2 , wherein the slow-wave structure comprises a slot defined in one of the one or more layers. 4. The interposer of claim 1 , wherein the cavity is configured to comprise one or more of a splitter, a coupler, an antenna feed, a filter, a phase shifter and a crossover. 5. The interposer of claim 3 , wherein the cavity is configured to comprise one of a Y-splitter, a four-way coupler, an array antenna feed, a single cavity filter, a multiple cavity filter, a filtering multiplexer, a delay line phase shifter, a Butler matrix, a hybrid coupler and a ridge waveguide. 6. The interposer of claim 1 , wherein a bend is provided in the waveguide. 7. The interposer of claim 1 , wherein the nanostructures are elongate in shape and are arranged in parallel orientation to one another in each of the one or more layers. 8. The interposer of claim 7 , wherein a height of the nanostructures in each layer corresponds to a thickness of the each layer. 9. The interposer of claim 1 , further comprising an antenna provided in the cavity. 10. The interposer of claim 9 , wherein the antenna is one of an excitation pillar, a slot, a planar antenna, and a coaxial antenna. 11. A substrate, comprising: a first substrate layer; a second substrate layer; and an interposer in accordance with claim 1 between the first and second substrate layers.
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