Film interposer for integrated circuit devices

Patent metadata

Field	Value
Publication number	US-9490240-B2
Application number	US-201213631814-A
Country	US
Kind code	B2
Filing date	Sep 28, 2012
Priority date	Sep 28, 2012
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

In one embodiment, a stack device comprising a film interposer of a polyimide film material, for example, is assembled. In accordance with one embodiment of the present description, a front side of the film interposer is attached to a first element of the stack device, which may be an integrated circuit package, an integrated circuit die, a substrate such as a printed circuit board, or other structure used to fabricate electronic devices. In addition, a back side of the film interposer is attached to a second element which like the first element, may be an integrated circuit package, an integrated circuit die, a substrate such as a printed circuit board, or other structure used to fabricate electronic devices. Other aspects are described.

First claim

What is claimed is:

1. A device, comprising:
a first element selected from a group consisting of an integrated circuit package, an integrated circuit die, and a substrate, wherein said first element has a photonic component;
a second element selected from a group consisting of an integrated circuit package, an integrated circuit die, and a substrate; and
a film interposer having a body, a first side of the body attached to the first element, a second side of the body attached to the second element, a photonic component and a plurality of electrically conductive columnar interconnects disposed in and at least partially passing through the body of said film interposer, wherein said photonic component of said film interposer is optically aligned with the photonic component of the first element, wherein the photonic component of the film interposer includes a first optical cavity aligned with the photonic component of the first element so that an optical signal can be propagated between the photonic component of the first element and the first optical cavity of the film interposer, and wherein the second element has a photonic component aligned with the first optical cavity of the film interposer and with the photonic component of the second element, and wherein the first optical cavity passes entirely through the body of the film interposer and is adapted to propagate an optical signal between photonic components of the first and second elements and through the first optical cavity of the film interposer.

2. The device of claim 1 further comprising a third element selected from a group consisting of an integrated circuit package, an integrated circuit die, and a substrate, attached to one of said first side and said second sides of said film interposer and having a photonic component, wherein the film interposer further has an optical waveguide and a second optical cavity optically aligned with the photonic component of the third element, wherein each optical cavity has a reflector, wherein the optical reflector of the first optical cavity is adapted to reflect an optical signal between the first optical cavity of the film interposer and the waveguide of the film interposer, and the optical reflector of the second optical cavity is adapted to reflect an optical signal between the waveguide and the second optical cavity of the film interposer so that an optical signal may propagate between the photonic component of the first element and the photonic component of the third element, through the first optical cavity, the waveguide and the second optical cavity of the film interposer.

3. The device of claim 1 wherein the film interposer is a first film interposer and includes an internal waveguide, and wherein the first optical cavity includes a reflector oriented to reflect an optical signal between the first optical cavity of the first film interposer and the internal waveguide of the first film interposer, the device further comprising a third element external to and spaced from the first film interposer and the first and second elements, the third element having a photonic component and being selected from a group consisting of an integrated circuit package, an integrated circuit die, a substrate, and a second film interposer, said device further comprising a waveguide external to the first film interposer and optically coupling the internal waveguide of the first film interposer to the photonic component of the external third element so that an optical signal may propagate between the photonic component of the first element and the photonic component of the third element, through the external waveguide, and the internal wave guide and the first optical cavity of the first film interposer.

4. The device of claim 1 wherein said first element has electrical contacts, said second element has electrical contacts said film interposer has electrical contacts disposed on the first side which are bonded to the electrical contacts of the first element, and said film interposer has electrical contacts disposed on the second side of the film interposer, which are bonded to the electrical contacts of the second element, and wherein the first element is electrically coupled to the second element through the columnar interconnects which pass at least partially through the body of the film interposer.

5. The device of claim 4 wherein the film interposer defines a cavity passing through the body of the film interposer and wherein electrical contacts of the first element are bonded to electrical contacts of the second element, through the cavity defined by the body of the film interposer.

6. The device of claim 4 wherein electrical contacts on the first side of the film interposer have a first density and electrical contacts on the second side of the film interposer have a second density different from the first density.

7. The device of claim 1 wherein film interposer is flexible so the shape of the flexible film interposer on the first side conforms to the shape of the first element, the shape of the flexible film interposer on the second side conforms to the shape of the second element.

8. The device of claim 1 wherein the body of the film interposer includes at least one layer of polyimide material.

9. The device of claim 8 wherein the film interposer has a layer of electrical contacts on the first side of the film interposer, a columnar interconnect layer of columnar electrical interconnects passing through the at least one layer of polyimide material, a routing layer of lateral electrical interconnects disposed on the at least one polyimide layer, and a layer of electrical contacts on the second side of the film interposer.

10. The device of claim 9 wherein the film interposer further has a solder mask layer having solder bonding electrical contacts disposed on the first side of the film interposer to electrical contacts of the first element, and a layer of adhesive on the second side of the film interposer bonding the film interposer second side to the second element.

11. The device of claim 1 further comprising:
a motherboard wherein the first element, film interposer and second element are carried on the motherboard;
at least one system memory carried on the motherboard;
a controller carried on said motherboard;
an expansion card coupled to said motherboard; and
a controller carried on said expansion card.

12. A device for use with a first element selected from a group consisting of an integrated circuit package, an integrated circuit die, and a substrate; and a second element selected from a group consisting of an integrated circuit package, an integrated circuit die, and a substrate; the device comprising:
a film interposer having a body, a first side of the body adapted to be attached to the first element, a second side of the body adapted to be attached to the second element, a photonic component and a plurality of electrically conductive columnar interconnects disposed in and at least partially passing through the body of said film interposer, wherein said photonic component of said film interposer is adapted to be optically aligned with the photonic component of the first element, wherein the photonic component of the film interposer includes a first optical cavity adapted to be aligned with the photonic component of the first element so that an optical signal can be propagated between the photonic component of the first element and the first optical cavity of the film interposer, and wherein the second element has a photonic component adapted to be aligned with the first optical cavity of the film interposer and with the photonic component of the second element, and wherein the first o

Assignees

• Intel Corp

Inventors

• Lucero Alan E
• Johnson Alan E

Classifications

• H10W72/07251

  characterised by changes in properties of the bump connectors during connecting · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H05K2201/10378

  Interposers · CPC title

• G02B6/12004

  Combinations of two or more optical elements · CPC title