Electronic component and electronic component device

Patent metadata

Field	Value
Publication number	US-11264172-B2
Application number	US-201716097175-A
Country	US
Kind code	B2
Filing date	Sep 20, 2017
Priority date	Sep 23, 2016
Publication date	Mar 1, 2022
Grant date	Mar 1, 2022

Abstract

An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.

First claim

The invention claimed is:

1. An electronic component comprising:
an element body of a rectangular parallelepiped shape including a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface; and
an external electrode including a first electrode portion disposed on the principal surface, and a second electrode portion disposed on the first side surface and coupled to the first electrode portion,
wherein the first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer,
the second electrode portion includes
a first region including a sintered metal layer and a plating layer formed on the sintered metal layer, and
a second region including a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer, and

the second region is located closer to the principal surface than the first region.

2. The electronic component according to claim 1 , wherein a ratio of a length of the second region in a direction orthogonal to the principal surface, to a length of the element body in the direction orthogonal to the principal surface is equal to or more than 0.2.

3. The electronic component according to claim 1 , wherein the element body further includes a second side surface adjacent to the principal surface and the first side surface,
the external electrode further includes a third electrode portion disposed in the second side surface and coupled to the first electrode portion, and
the third electrode portion includes
a third region including a sintered metal layer and a plating layer formed on the sintered metal layer, and
a fourth region including a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer, and

the fourth region is located closer to the principal surface than the third region.

4. The electronic component according to claim 3 , wherein a ratio of a length of the fourth region in the direction orthogonal to the principal surface, to a length of the element body in the direction orthogonal to the principal surface is equal to or more than 0.2.

5. An electronic component device comprising:
the electronic component according to claim 1 ; and
an electronic device including a pad electrode coupled to the external electrode via a solder fillet,
wherein the solder fillet is formed on the first region and second region included in the second electrode portion.

6. An electronic component comprising:
an element body of a rectangular parallelepiped shape including a principal surface arranged to constitute a mounting surface and a side surface adjacent to the principal surface; and
an external electrode including an electrode portion disposed on the side surface, wherein
the electrode portion includes
a first region including a sintered metal layer formed on the side surface and a plating layer formed on the sintered metal layer, and
a second region including a sintered metal layer formed on the side surface, a conductive resin layer formed over the sintered metal layer and the side surface, and a plating layer formed on the conductive resin layer,

the second region is located closer to the principal surface than the first region,
the second region includes
a first portion in which the conductive resin layer is formed on the sintered metal layer, and
a second portion in which the conductive resin layer is formed on the side surface, and

a width of the second portion continuously decreases with an increase in distance from the principal surface.

7. The electronic component according to claim 6 , wherein an end edge of the second portion is curved when viewed from in a direction orthogonal to the side surface.

8. The electronic component according to claim 6 , wherein an end edge of the second region has an approximately arc shape when viewed from in a direction orthogonal to the side surface.

9. An electronic component comprising:
an element body of a rectangular parallelepiped shape including a principal surface arranged to constitute a mounting surface, a pair of end surfaces opposing each other and adjacent to the principal surface, and a side surface adjacent to the pair of end surfaces and the principal surface; and
external electrodes disposed at each end portion of the element body in a direction in which the pair of end surfaces opposes each other, wherein
each of the external electrodes includes a sintered metal layer and a conductive resin layer formed over the sintered metal layer and the element body,
an entirety of the sintered metal layer is covered with the conductive resin layer when viewed from a direction orthogonal to the principal surface,
an edge region near the principal surface of the sintered metal layer is covered with the conductive resin layer and an end edge of the conductive resin layer crosses an end edge of the sintered metal layer, when viewed from a direction orthogonal to the side surface,
the each of the external electrodes includes a first electrode portion disposed on the side surface and on a ridge portion located between the end surface and the side surface,
the first portion includes
a first region in which the sintered metal layer is exposed from the conductive resin layer, and
a second region in which the sintered metal layer is covered with the conductive resin layer,

the second region is located closer to the principal surface than the first region, and
a width of the second portion in the direction in which the pair of end surfaces opposes each other decreases with an increase in distance from the principal surface.

10. The electronic component according to claim 9 , wherein an end edge of the second region has an approximately arc shape when viewed from in the direction orthogonal to the side surface.

11. The electronic component according to claim 9 , wherein an end edge of the second portion is approximately linear when viewed from the direction orthogonal to the side surface.

12. The electronic component according to claim 9 , wherein an end edge of the second portion has two side edges crossing each other when viewed from the direction orthogonal to the side surface.

13. An electronic component comprising:
an element body of a rectangular parallelepiped shape including a principal surface arranged to constitute a mounting surface, a pair of end surfaces opposing each other and adjacent to the principal surface, and a pair of side surfaces opposing each other and adjacent to the pair of end surfaces and the principal surface; and
external electrodes disposed at each end portion of the element body in a direction in which the pair of end surfaces opposes each other,
wherein each of the external electrodes includes a conductive resin layer formed to continuously cover a part of the principal surface, a part of each of the pair of the end surfaces, and a part of each of the pair of side surfaces.

14. The electronic component according to claim 13 , further comprising:
an internal conductor exposed to the each of the pair of end surfaces,
wherein the each of the external electrodes further includes a sintered metal layer formed on the each of the pair of end surfaces to be connected to the internal conductor.

15. The electronic component according to claim 14 , wherein the sintered metal layer includes a first region covered with the conductive resin layer and a second region exposed from the c

Assignees

• Tdk Corp

Inventors

• Onodera Shinya
• Ito Koki
• Kaneko Hideki

Classifications

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/2325 Primary

  characterised by the material of the terminals · CPC title

• H01G4/1218

  based on titanium oxides or titanates (H01G4/1245 takes precedence) · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/0085

  Fried electrodes · CPC title