Method for correcting solder bump

Patent metadata

Field	Value
Publication number	US-10681822-B2
Application number	US-201616062853-A
Country	US
Kind code	B2
Filing date	Dec 15, 2016
Priority date	Dec 15, 2015
Publication date	Jun 9, 2020
Grant date	Jun 9, 2020

Abstract

A pattern formed on a silicon wafer is fine so that solder bumps formed on the silicon wafer are also fine and hence, when a failure occurs, the failure cannot be corrected so that an entire silicon wafer as a workpiece is discarded. Provided is a correction method where, on solder bumps formed on the silicon wafer, a mask in which holes are formed with the same pattern as the solder bumps is placed so as to cover the solder bumps and, thereafter, molten solder is caused to come into contact with the solder bumps through the mask thus filling hole portions of the mask with the molten solder.

First claim

The invention claimed is:

1. A method for correcting a solder bump formed on a workpiece, the method comprising:
placing a mask having a same pattern as the solder bump so as to cover the workpiece which has a defective portion having a defect of the solder bump and/or an insufficient amount of solder;
heating a fluid for forming the solder bump by a first heater; and
discharging the fluid for forming the solder bump from a correction head configured to discharge the fluid, which has been heated by the first heater, while the correction head is caused to scan on the mask so as to discharge the fluid into a portion of the mask which corresponds to the defective portion, and
heating the fluid discharged into the mask by a second heater installed at a lower portion of the correction head.

2. The method according to claim 1 , further comprising,
sucking the fluid, which has been discharged into the mask and heated by the second heater, from the mask.

3. The method according to claim 1 , further comprising,
reducing a pressure of air in an opening portion of the mask before discharging the fluid for forming the solder bump.

4. A method for correcting a solder bump formed on a workpiece, the method comprising:
placing a mask having a same pattern as the solder bump so as to cover the workpiece which has a defective portion having a defect of the solder bump and/or an insufficient amount of solder;
heating a fluid for forming the solder bump by a first heater;
discharging the fluid for forming the solder bump from a correction head configured to discharge the fluid, which has been heated by the first heater, while the correction head is caused to scan on the mask so as to discharge the fluid into a portion of the mask which corresponds to the defective portion; and
reducing a pressure of air in an opening portion of the mask before discharging the fluid for forming the solder bump.

Assignees

• Senju Metal Industry Co

Inventors

• Nakamura Hideki

Classifications

• H01L2224/94

  Electricity · mapped topic

• H01L24/742

  Electricity · mapped topic

• H05K3/0094

  Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement · CPC title

• H01L2224/11312

  Electricity · mapped topic

• B23K3/0623

  for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets · CPC title