Thermoconductive silicone composition

Patent metadata

Field	Value
Publication number	US-11248154-B2
Application number	US-201716342785-A
Country	US
Kind code	B2
Filing date	Oct 5, 2017
Priority date	Oct 18, 2016
Publication date	Feb 15, 2022
Grant date	Feb 15, 2022

Abstract

A thermoconductive silicone composition which has (A) an organopolysiloxane as a base polymer and includes (B) a thermoconductive filler, wherein the thermoconductive filler is 60-85 vol % of the thermoconductive silicone composition, and 40-60 vol % of the thermoconductive filler is aluminum nitride having an average particle diameter of at least 50 μm.

First claim

The invention claimed is:

1. A heat-conductive silicone composition comprising (A) an organopolysiloxane as a base polymer and (B) a heat-conductive filler, wherein the heat-conductive filler (B) accounts for 60 to 85% by volume of the heat-conductive silicone composition, and aluminum nitride having an average particle size of at least 50 μm accounts for 40 to 60% by volume of the heat-conductive filler,
wherein relative to the total volume of the aluminum nitride as the heat-conductive filler which is 1, aluminum nitride having an average particle size of 50 μm to less than 70 μm is present in a volume ratio between 0.5 and 0.6, and aluminum nitride having an average particle size of 70 μm to 90 μm is present in a volume ratio between 0.4 and 0.5.

2. The heat-conductive silicone composition of claim 1 wherein the aluminum nitride is unsintered crushed aluminum nitride.

3. The heat-conductive silicone composition of claim 1 wherein a heat-conductive filler having an average particle size of up to 5 μm accounts for 25 to 45% by volume of the heat-conductive filler.

4. The heat-conductive silicone composition of claim 3 wherein the heat-conductive filler having an average particle size of up to 5 μm is crushed particles or round particles of aluminum oxide.

5. A cured product of the heat-conductive silicone composition of claim 1 , having a thermal conductivity of at least 8 W/mK.

6. The cured product of claim 5 , which has an Asker C hardness of up to 50.

7. The cured product of claim 5 , which has a dielectric breakdown voltage of at least 6 kV at a thickness of 1 mm.

8. The heat-conductive silicone composition of claim 1 wherein the amount of component (B) is 75 to 85% by volume of the heat-conductive silicone composition.

9. A heat-conductive silicone composition comprising (A) an organopolysiloxane as a base polymer and (B) a heat-conductive filler, wherein the heat-conductive filler (B) accounts for 60 to 85% by volume of the heat-conductive silicone composition, and aluminum nitride having an average particle size of at least 50 μm accounts for 40 to 60% by volume of the heat-conductive filler, wherein the component (B) comprises, per (A) 100 parts by weight of the organopolysiloxane,
(B-I) 1,100 to 1,400 parts by weight of aluminum nitride having an average particle size of 50 μm to less than 70 μm,
(B-II) 900 to 1,200 parts by weight of aluminum nitride having an average particle size of 70 μm to 90 μm,
(B-III) 650 to 800 parts by weight of aluminum oxide having an average particle size of 5 μm to 15 μm, and
(B-IV) 1,200 to 1,700 parts by weight of aluminum oxide having an average particle size of 0.5 μm to less than 5 μm or aluminum hydroxide having an average particle size of 0.5 μm to less than 5 μm.

10. The heat-conductive silicone composition of claim 9 wherein component (B-I) is unsintered crushed aluminum nitride having an average particle size of 50 μm to less than 70 μm, component (B-II) is unsintered crushed aluminum nitride having an average particle size of 70 μm to 90 μm or sintered spherical aluminum nitride having an average particle size of 70 μm to 90 μm, component (B-III) is spherical aluminum oxide having an average particle size of 5 μm to 15 μm, and component (B-IV) is crushed aluminum oxide having an average particle size of 0.5 μm to less than 5 μm or aluminum hydroxide having an average particle size of 0.5 μm to less than 5 μm.

11. The heat-conductive silicone composition of claim 9 , further comprising (C) at least one compound selected from components (C-1) and (C-2), in an amount of 10 to 160 parts by weight per 100 parts by weight of component (A),
(C-1) an alkoxysilane compound having the general formula (1):
R 1 a R 2 b Si(OR 3 ) 4-a-b   (1)

wherein R 1 is independently a C 6 -C 15 alkyl group, R 2 is independently a substituted or unsubstituted C 1 -C 8 monovalent hydrocarbon group, R 3 is independently a C 1 -C 6 alkyl group, a is an integer of 1 to 3, b is an integer of 0 to 2, and a+b is an integer of 1 to 3,
(C-2) a dimethylpolysiloxane capped with a trialkoxy group at one end of the molecular chain, having the general formula (2):

wherein R 4 is independently a C 1 -C 6 alkyl group and c is an integer of 5 to 100.

12. A method of preparing the heat-conductive silicone composition of claim 9 , comprising the step of mixing
(A) 100 parts by weight of the organopolysiloxane,
(B-I) 1,100 to 1,400 parts by weight of aluminum nitride having an average particle size of 50 μm to less than 70 μm,
(B-II) 900 to 1,200 parts by weight of aluminum nitride having an average particle size of 70 μm to 90 μm,
(B-III) 650 to 800 parts by weight of aluminum oxide having an average particle size of 5 μm to 15 μm, and
(B-IV) 1,300 to 1,700 parts by weight of aluminum oxide having an average particle size of 0.5 μm to less than 5 μm or aluminum hydroxide having an average particle size of 0.5 μm to less than 5 μm.

Assignees

• Shinetsu Chemical Co

Inventors

• Ishihara Yasuhisa
• Endo Akihiro

Classifications

• C08L83/04 Primary

  Polysiloxanes · CPC title

• C08K2201/014

  Additives containing two or more different additives of the same subgroup in C08K · CPC title

• C08K2003/2227

  of aluminium · CPC title

• C08G77/04

  Polysiloxanes · CPC title

• C08G77/18

  to alkoxy or aryloxy groups · CPC title