Thermally conductive sheet feeder and method for feeding thermally conductive sheet

Patent metadata

Field	Value
Publication number	US-9385063-B2
Application number	US-201314390669-A
Country	US
Kind code	B2
Filing date	Mar 29, 2013
Priority date	May 14, 2012
Publication date	Jul 5, 2016
Grant date	Jul 5, 2016

Abstract

Provided by the present invention are a thermally conductive sheet feeder and a method for feeding a thermally conductive sheet, which are a thermally conductive sheet feeder and a method for feeding a thermally conductive sheet using an emboss carrier tape, wherein the emboss carrier tape provided on its surface with a plurality of pockets, each having one thermally conductive sheet accommodated therein, and a cover film to protect surface of the emboss carrier tape are rolled up in a reel-like form.

First claim

The invention claimed is:

1. A thermally conductive sheet feeder wherein an emboss carrier tape provided on its surface with a plurality of pockets, each having one thermally conductive sheet accommodated therein, and a cover film to protect surface of the emboss carrier tape are rolled up in a reel form, wherein
the thermally conductive sheet is composed of a reinforcing layer, and a thermally conductive resin layer laminated on one surface of the reinforcing layer or thermally conductive resin layers laminated on both surfaces of the reinforcing layer, the thermally conductive resin layers being the same or different; a tacking energy of at least one surface of the thermally conductive sheet is 70 μJ or less; thickness of the thermally conductive sheet is in the range of 60 μm or more to 600 μm or less; the thermally conductive resin layer contains 300 parts by mass or more of thermally conductive filler relative to 100 parts by mass of a silicone rubber; and
each thermally conductive sheet is accommodated in each pocket of the emboss carrier tape in the thermally conductive sheet feeder such that the tacking energy of the thermally conductive sheet is the same between a surface of the cover film side and a surface of the pocket's bottom side, or the tacking energy of the thermally conductive sheet of the cover film side is lower than that of the pocket's bottom side.

2. The thermally conductive sheet feeder according to claim 1 , wherein thermal conductivity of the thermally conductive resin layer is 1.0 W/mK or more.

3. The thermally conductive sheet feeder according to claim 1 , wherein thermal conductivity of the thermally conductive resin layer is 3.0 W/mK or more.

4. The thermally conductive sheet feeder according to claim 1 , wherein the reinforcing layer is an aluminum foil.

5. A method for feeding a thermally conductive sheet wherein a thermally conductive sheet accommodated in a pocket of the emboss carrier tape of the thermally conductive sheet feeder according to claim 1 is fed by sucking up the sheet one by one from the pocket by using a vacuum nozzle whereby carrying out an automatic mounting thereof.

6. The thermally conductive sheet feeder according to claim 1 , wherein the pockets have a depth such that there is an allowance of 3 to 5 mm above the thermally conductive sheet accommodated therein.

7. The thermally conductive sheet feeder according to claim 1 , wherein the reinforcing layer comprises a metal foil having a thickness in the range of 20 to 150 μm.

8. The thermally conductive sheet feeder according to claim 1 , wherein the thickness of the thermally conductive sheet is in the range of 200 μm or more to 400 μm or less.

9. The thermally conductive sheet feeder according to claim 1 , wherein the thermally conductive resin layer contains 300 parts by mass or more to 1300 parts by mass by less of thermally conductive filler relative to 100 parts by mass of the silicon rubber.

10. The thermally conductive sheet feeder according to claim 1 , wherein the thermally conductive filler has a median particle diameter in the range of 0.1 to 200 μm.

Assignees

• Shinetsu Chemical Co

Inventors

• Ishihara Yasuhisa
• Endo Akihiro

Classifications

• H10W40/251 Primary

  Organics · CPC title

• H10W40/226 Primary

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H01L2924/0002

  Electricity · mapped topic

• H01L23/3737

  Electricity · mapped topic

• H05K13/0084

  Containers and magazines for components, e.g. tube-like magazines · CPC title