Thermally conductive sheet

Patent metadata

Field	Value
Publication number	US-10370575-B2
Application number	US-201515315149-A
Country	US
Kind code	B2
Filing date	May 25, 2015
Priority date	Jun 10, 2014
Publication date	Aug 6, 2019
Grant date	Aug 6, 2019

Abstract

A thermally conductive sheet including a glass cloth filled with a thermally conductive resin composition, one or both surfaces of the glass cloth being layered with a cured, thermally conductive silicone composition, wherein the thermally conductive silicone composition comprises a silicone component and thermally conductive filler (C) of an amount of 1,200 to 2,000 parts by mass, relative to 100 parts by mass of the silicone component, the thermally conductive filler (C) has an average particle size smaller than 15 μm, and an amount of particles having a particle size of 45 μm or larger is 0 to 3 mass % and an amount of particles having a particle size of 75 μm or larger is 0 to 0.01 mass %, based on an amount of the thermally conductive filler (C).

First claim

The invention claimed is:

1. A thermally conductive sheet consisting of
a glass cloth filled with a thermally conductive resin composition, and
a cured thermally conductive silicone composition on one or both surfaces of the glass cloth, wherein
the thermally conductive silicone composition comprises a silicone component and thermally conductive filler (C) of an amount of 1,200 to 2,000 parts by mass, relative to 100 parts by mass of the silicone component,
the thermally conductive filler (C) has an average particle size smaller than 15 μm,
an amount of particles having a particle size of 45 μm or larger is 0 to 3 mass % and an amount of particles having a particle size of 75μm or larger is 0 to 0.01 mass %, based on an amount of the thermally conductive filler (C), and
the cured thermally conductive silicone composition has a hardness of 85 to 96, as determined by a type A durometer.

2. The thermally conductive sheet according to claim 1 , wherein the cured thermally conductive silicone composition has a thermal conductivity of 3.0 W/m·K or larger.

3. The thermally conductive sheet according to claim 1 , wherein the thermally conductive sheet having a total thickness of 0.2 mm has a thermal resistance of 1.8 cm 2 ·K/W or less, as determined according to the ASTM D5470 standards.

4. The thermally conductive sheet according to claim 1 , wherein the thermally conductive sheet having a total thickness of 0.2 mm has a dielectric breakdown voltage of 6 kV or higher, as determined according to the Japanese Industrial Standards (JIS) K 6249.

5. The thermally conductive sheet according to claim 1 , wherein a thickness of the glass cloth is 60 μm or smaller in a cross section of the thermally conductive sheet, a thickness of the whole thermally conductive sheet is 130 to 900 μm when the sheet has the cured thermally conductive silicone composition on the both surfaces of the glass cloth, or a thickness of the whole thermally conductive sheet is 80 to 500 μm when the sheet has the cured thermally conductive silicone composition on one surface of the glass cloth.

6. The thermally conductive sheet according to claim 1 , wherein the silicone component comprises an organopolysiloxane (A) which has at least two alkenyl groups each bonded to a silicon atom and has the following average compositional formula:
R 1 a SiO (4-a)/2
wherein R 1 is, independently of each other, substituted or unsubstituted, monovalent hydrocarbon group having 1 to 10 carbon atoms and a is 1.90 to 2.05.

7. The thermally conductive sheet according to claim 6 , wherein the silicone component further comprises
(D) at least one of the following (D1) or (D2):
(D1) an alkoxy silane represented by the following formula (1):
R 2 a R 3 b Si(OR 4 ) 4-a-b   (1)

wherein R 2 is, independently of each other, an alkyl group having 6 to 15 carbon atoms, R 3 is, independently of each other, a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 12 carbon atoms, R 4 is, independently of each other, an alkyl group having 1 to 6 carbon atoms, a is an integer of from 1 to 3, and b is an integer of from 0 to 2, provided that a total of a and b is 1 to 3; or

(D2) a dimethylpolysiloxane in which one terminal is capped with a trialkoxysilyl group and which is represented by the following formula (2):

wherein R 5 is, independently of each other, an alkyl group having 1 to 6 carbon atoms and c is an integer of from 5 to 100.

8. The thermally conductive sheet according to claim 7 , wherein an amount of component (D) is 0.01 to 60 mass %, based on a total amount of the silicone component.

9. The thermally conductive sheet according to claim 1 , wherein the thermally conductive filler (C) consists of 20 to 50 mass % of alumina (C1) which has an average particle size of at least 0.1 μm and smaller than 5 μm, and 50 to 80 mass % of alumina (C2) which has an average particle size of at least 5 μm and smaller than 15 μm.

10. The thermally conductive sheet according to claim 9 , wherein component (C2) is spherical alumina.

11. A thermally conductive sheet consisting of
a glass cloth filled with a thermally conductive resin composition, and
a cured, cured thermally conductive silicone composition on one or both surfaces of the glass cloth, wherein
the thermally conductive silicone composition comprises a silicone component and thermally conductive filler (C) of an amount of 1,200 to 2,000 parts by mass, relative to 100 parts by mass of the silicone component,
the thermally conductive filler (C) has an average particle size smaller than 15 μm,
an amount of particles having a particle size of 45 μm or larger is 0 to 3 mass % and an amount of particles having a particle size of 75 μm or larger is 0 to 0.01 mass %, based on an amount of the thermally conductive filler (C), and
the silicone component comprises:
an organopolysiloxane (A) which has at least two alkenyl groups each bonded to a silicon atom and has the following average compositional formula:
R 1 a SiO (4-a)/2

wherein R 1 is, independently of each other, substituted or unsubstituted, monovalent hydrocarbon group having 1 to 10 carbon atoms and a is 1.90 to 2.05; and
(D) at least one of the following (D1) or (D2):
(D1) an alkoxy silane represented by the following formula (1):
R 2 a R 3 b Si(OR 4 ) 4-a-b   (1)

wherein R 2 is, independently of each other, an alkyl group having 6 to 15 carbon atoms, R 3 is, independently of each other, a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 12 carbon atoms, R 4 is, independently of each other, an alkyl group having 1 to 6 carbon atoms, a is an integer of from 1 to 3, and b is an integer of from 0 to 2, provided that a total of a and b is 1 to 3; or
(D2) a dimethylpolysiloxane in which one terminal is capped with a trialkoxysilyl group and which is represented by the following formula (2):

wherein R 5 is, independently of each other, an alkyl group having 1 to 6 carbon atoms and c is an integer of from 5 to 100.

12. The thermally conductive sheet according to claim 11 , wherein the cured thermally conductive silicone composition has a hardness of 60 to 96, as determined by a type A durometer.

13. The thermally conductive sheet according to claim 11 , wherein the cured thermally conductive silicone composition has a thermal conductivity of 3.0 W/m·K or larger.

14. The thermally conductive sheet according to claim 11 , wherein the thermally conductive sheet having a total thickness of 0.2 mm has a thermal resistance of 1.8 cm 2 ·K/W or less, as determined according to the ASTM D5470 standards.

15. The thermally conductive sheet according to claim 11 , wherein the thermally conductive sheet having a total thickness of 0.2 mm has a dielectric breakdown voltage of 6 kV or higher, as determined according to the Japanese Industrial Standards (JIS) K 6249.

16. The thermally conductive sheet according to claim 11 , wherein a thickness of the glass cloth is 60 μm or smaller in a cross section of the thermally conductive sheet, a thickness of the whole thermally conductive sheet is 130 to 900 μm when the sheet has the cured thermally conductive silicone composition on the both surfaces of the glass cloth, or a thickness of the whole thermally conductive sheet is 80 to 500 μm when the sheet has the cured thermally conductive silicone

Assignees

• Shinetsu Chemical Co

Inventors

• Ishihara Yasuhisa
• Endo Akihiro
• Maruyama Takahiro

Classifications

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W40/251

  Organics · CPC title

• H10W40/25 Primary

  characterised by their materials · CPC title

• H10W40/10

  Arrangements for heating · CPC title

• C08K7/18

  inorganic · CPC title