Electrical contact element for an electrical connector having microstructured caverns under the contact surface

Patent metadata

Field	Value
Publication number	US-11239593-B2
Application number	US-201916270716-A
Country	US
Kind code	B2
Filing date	Feb 8, 2019
Priority date	Aug 8, 2016
Publication date	Feb 1, 2022
Grant date	Feb 1, 2022

Abstract

An electrically conductive contact element for an electrical connector comprises a contact surface having a plurality of caverns arranged under the contact surface in a microstructure and an auxiliary material filled in the plurality of caverns.

First claim

What is claimed is:

1. An electrically conductive contact element for an electrical connector, comprising:
a contact surface having a plurality of caverns arranged under the contact surface in a microstructure; and
an auxiliary material closed within the plurality of caverns by the contact surface arranged directly over each of the plurality of caverns.

2. The electrically conductive contact element of claim 1 , wherein the microstructure extends parallel to the contact surface.

3. The electrically conductive contact element of claim 1 , wherein the caverns form a substantially homogeneous pattern with the microstructure.

4. The electrically conductive contact element of claim 1 , wherein the auxiliary material is selected from the group of an antioxidant, a corrosion protection agent, a lubricant, and an acid.

5. The electrically conductive contact element of claim 1 , wherein the entirety of the auxiliary material is closed under the contact surface.

6. The electrically conductive contact element of claim 1 , wherein the microstructure and the plurality of caverns are formed in a first material, wherein the auxiliary material is closed within the first material.

7. The electrically conductive contact element of claim 1 , wherein the microstructure is formed within a coating applied to a base material of the contact element, wherein the plurality of caverns do not extend into the base material.

8. The electrically conductive contact element of claim 1 , wherein the caverns do not have an output at the contract surface such that the auxiliary material cannot be accessed through the contact surface.

9. The electrically conductive contact element of claim 1 , wherein the microstructure forms a pattern that is periodic at least in sections.

10. The electrically conductive contact element of claim 9 , wherein the microstructure has a period length of 0.5 μm to 300 μm in at least one direction.

11. The electrically conductive contact element of claim 10 , wherein the period length is 1 μm to 100 μm in at least one direction.

12. The electrically conductive contact element of claim 1 , wherein the contact surface has a surface texture configured to reduce the bearing surface between the contact surface and a mating contact surface.

13. The electrically conductive contact element of claim 12 , wherein the surface texture is congruent with the microstructure.

14. The electrically conductive contact element of claim 12 , wherein the surface texture is formed on the contact surface directly above the caverns of the microstructure.

15. An electrical connector, comprising:
an electrically conductive contact element including a contact surface having a plurality of caverns arranged directly under the contact surface in a microstructure and an auxiliary material closed within each of the plurality of caverns by the contact surface arranged directly over each of the plurality of caverns.

16. A method for enclosing an auxiliary material under a contact surface of an electrically conductive contact element, comprising:
forming a microstructure at the contact surface;
applying the auxiliary material onto the contact surface; and
closing the auxiliary material within each of a plurality of caverns formed in the microstructure by forming the contact surface directly above each of the plurality of caverns.

17. The method of claim 16 , wherein the enclosing step includes treating the contact surface with a laser radiation having an interference pattern.

18. The method of claim 16 , wherein the applying step occurs before the forming step.

19. The method of claim 18 , wherein the auxiliary material is enclosed in the microstructure during the forming step.

20. The method of claim 16 , wherein the applying step occurs after the forming step.

21. The method of claim 20 , wherein the enclosing step occurs after the applying step, and wherein the contact surface is mechanically deformed during the enclosing step.

Assignees

• Te Connectivity Germany Gmbh
• Steinbeiss Forschungszentrum

Inventors

• Leidner Michael
• Mucklich Frank
• Reinert Leander
• Trinh Quoc Herr Kim Eric
• Schmidt Helge
• Thoss Stefan

Classifications

• H01R43/005

  for making dustproof, splashproof, drip-proof, waterproof, or flameproof connection, coupling, or casing · CPC title

• B32B15/018

  one layer being formed of a noble metal or a noble metal alloy · CPC title

• H01R13/533

  Bases, cases made for use in extreme conditions, e.g. high temperature, radiation, vibration, corrosive environment, pressure (H01R13/52 takes precedence) · CPC title

• C22C9/00

  Alloys based on copper · CPC title

• B32B15/01

  all layers being exclusively metallic {(making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00)} · CPC title