Electrical component and electronic device

Patent metadata

Field	Value
Publication number	US-2017012377-A1
Application number	US-201615200350-A
Country	US
Kind code	A1
Filing date	Jul 1, 2016
Priority date	Jul 9, 2015
Publication date	Jan 12, 2017
Grant date	—

Abstract

An electrical component includes a contact point part that establishes an electrical connection by contact. In addition, the contact point part includes: a substrate having a metal as a constituent material; and a thin film arranged at a surface of the substrate. Moreover, the thin film includes a π-accepting molecule having a π-acceptability, in which the π-accepting molecule has a size of ligand field splitting in a spectrochemical series larger than or equal to a size of ligand field splitting of 2,2′-bipyridyl.

First claim

What is claimed is:

1 . An electrical component comprising:
a contact point part that establishes an electrical connection by contact, wherein the contact point part includes:
a substrate having a metal as a constituent material; and
a thin film arranged at a surface of the substrate, and
wherein the thin film includes a π-accepting molecule having a π-acceptability, in which the π-accepting molecule has a size of ligand field splitting in a spectrochemical series larger than or equal to a size of ligand field splitting of 2,2′-bipyridyl.

2 . The electrical component according to claim 1 ,
wherein the π-accepting molecule includes at least one of 1,10-phenanthroline and a 1,10-phenanthroline analog.

3 . The electrical component according to claim 2 ,
wherein the π-accepting molecule is 1,10-phenanthroline in which an electron-attracting group is introduced to at least one of 2- to 9-positions of the 1,10-phenanthroline.

4 . The electrical component according to claim 1 ,
wherein the π-accepting molecule includes at least one of 2,2′-bipyridyl and a 2,2′-bipyridyl analog.

5 . The electrical component according to claim 4 ,
wherein the π-accepting molecule is 2,2′-bipyridyl in which an electron-attracting group is introduced to at least one of 3- to 6- and 3′- to 6′-positions of the 2,2′-bipyridyl.

6 . The electrical component according to claim 1 , wherein:
the thin film is a plated film; and the π-accepting molecule is dispersed in the plated film.

7 . The electrical component according to claim 6 ,
wherein the plated film includes one of Ni, Cu, Ag, and Co as a major component.

8 . The electrical component according to claim 1 ,
wherein the thin film is an immersion film containing the π-accepting molecule as a constituent material.

9 . The electrical component according to claim 1 , wherein:
the π-accepting molecule is included in a capsule; and the capsule is dispersed in the thin film.

10 . An electronic device comprising:
a first component that has a first contact point part; and a second component that has a second contact point part electrically connected to the first contact point part by being in contact with the first contact point part, wherein at least one of the first component and the second component includes the electrical component according to claim 1 .

Assignees

• Denso Corp

Inventors

• Ochi Kenji

Classifications

• C23C18/1662

  Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires · CPC title

• C23C18/40

  using reducing agents · CPC title

• H05K3/244

  Finish plating of conductors, especially of copper conductors, e.g. for pads or lands (selective plating methods H05K3/243; finish plating of conductors made by printing techniques H05K3/246; solder as finish H05K3/3465) · CPC title

• H01R13/03

  characterised by the material, e.g. plating, or coating materials · CPC title

• H05K2203/122

  Organic non-polymeric compounds, e.g. oil, wax or thiol · CPC title