Nanowire interfaces

Patent metadata

Field	Value
Publication number	US-11239195-B2
Application number	US-202016843580-A
Country	US
Kind code	B2
Filing date	Apr 8, 2020
Priority date	Apr 8, 2019
Publication date	Feb 1, 2022
Grant date	Feb 1, 2022

Abstract

In some examples, a system comprises a first component having a first surface, a first set of nanoparticles coupled to the first surface, and a first set of nanowires extending from the first set of nanoparticles. The system also comprises a second component having a second surface, a second set of nanoparticles coupled to the second surface, and a second set of nanowires extending from the second set of nanoparticles. The system further includes an adhesive positioned between the first and second surfaces. The first and second sets of nanowires are positioned within the adhesive.

First claim

What is claimed is:

1. A system, comprising:
a first component having a first surface;
a first set of nanoparticles coupled to the first surface;
a first set of nanowires extending from the first set of nanoparticles;
a second component having a second surface;
a second set of nanoparticles coupled to the second surface;
a second set of nanowires extending from the second set of nanoparticles; and
an adhesive positioned between the first and second surfaces, the first and second sets of nanowires positioned within the adhesive.

2. The system of claim 1 , further comprising a metal layer positioned on the first surface, the first set of nanoparticles positioned on the metal layer.

3. The system of claim 1 , further comprising a metal layer positioned on the second surface, the second set of nanoparticles positioned on the metal layer.

4. The system of claim 1 , wherein the adhesive is selected from the group consisting of a glue, an epoxy, and solder.

5. The system of claim 1 , wherein the first component comprises a semiconductor die and the second component comprises a lead frame die pad.

6. The system of claim 1 , wherein a nanowire of the first set of nanowires has a length-to-width ratio of at least 2 to 1.

7. The system of claim 1 , wherein a nanowire of the first set of nanowires has a diameter ranging between 0.5 microns and 1.5 microns.

8. The system of claim 1 , wherein a nanoparticle of the first set of nanoparticles has a diameter ranging between 0.01 microns and 1.5 microns.

9. The system of claim 1 , further comprising a third component coupled to the first component, the third component having a third set of nanowires coupled thereto.

10. A system, comprising:
a first set of nanoparticles coupled to a first component;
a first set of nanowires extending from the first set of nanoparticles;
a second set of nanoparticles coupled to a second component;
a second set of nanowires extending from the second set of nanoparticles; and
an adhesive positioned between the first and second components, the first and second sets of nanowires positioned within the adhesive.

11. The system of claim 10 , further comprising a metal layer positioned on the first component, the first set of nanoparticles positioned on the metal layer.

12. The semiconductor package of claim 11 , wherein the metal layer comprises a set of nanoparticles.

13. The semiconductor package of claim 11 , wherein the metal layer is a solid metal layer.

14. The system of claim 10 , further comprising a metal layer positioned on the second component, the second set of nanoparticles positioned on the metal layer.

15. The semiconductor package of claim 14 , wherein the metal layer comprises a set of nanoparticles.

16. The semiconductor package of claim 14 , wherein the metal layer is a solid metal layer.

17. The system of claim 10 , wherein the adhesive is selected from the group consisting of a glue, an epoxy, and solder.

18. The system of claim 10 , wherein the first component comprises a
semiconductor die and the second component comprises a lead frame die pad.

19. The system of claim 10 , wherein a nanowire of the first set of nanowires has a length-to-width ratio of at least 2 to 1.

20. The system of claim 10 , wherein a nanowire of the first set of nanowires has a diameter ranging between 0.5 microns and 1.5 microns.

21. The system of claim 10 , wherein a nanoparticle of the first set of
nanoparticles has a diameter ranging between 0.01 microns and 1.5 microns.

22. The system of claim 10 , further comprising a third component coupled to the first component, the third component having a third set of nanowires coupled thereto.

Assignees

• Texas Instruments Inc

Inventors

• Koduri Sreenivasan Kalyani
• Cook Benjamin Stassen
• Muenster Ralf Jakobskrueger

Classifications

• H10W90/766

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• H10W72/01335

  by plating, e.g. electroless plating or electroplating · CPC title