Packaging methods and packaged semiconductor devices
US-10128175-B2 · Nov 13, 2018 · US
US11239010B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11239010-B2 |
| Application number | US-201616061801-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 18, 2016 |
| Priority date | Jan 14, 2016 |
| Publication date | Feb 1, 2022 |
| Grant date | Feb 1, 2022 |
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A mechanically stable main body having a cutout, into which an ESD protection element is at least partly embedded and mechanically fixed by means of a connection means. Electrical terminals of the protection element are connected to terminal pads on the top side of the main body by way of a structured metallic layer bearing on main body and protection element.
Opening claim text (preview).
The invention claimed is: 1. A carrier plate for an electrical component comprising a mechanically stable main body, having external contacts on the underside and terminal pads for the component on the top side, comprising a cutout, into which an ESD protection element is at least partly embedded, wherein the electrical terminals of the protection element are accessible from the top side of the main body, wherein the protection element is mechanically fixedly embedded in the cutout of the main body by means of a connection means, the protection element being discrete from the main body and including an interspace between the protection element and the outer walls of the cutout, wherein the electrical terminals of the protection element are connected by way of a structured metallic layer to the terminal pads on the top side, wherein the main body is a crystalline, ceramic or vitreous main body, wherein an outwardly facing surface of the protection element terminates flush with a surface of the main body, and wherein the structured metallic layer bears on the two flush surfaces. 2. The carrier plate according to claim 1 , wherein the protection element is a varistor, a zener diode, a TVS component or some other nonlinear element. 3. The carrier plate according to claim 1 , wherein the connection means comprises a plastic or a ceramic material, glass or a metal. 4. The carrier plate according to claim 1 , wherein the external contacts and the terminal pads are electrically connected via plated-through holes, wherein the main body has a multilayer construction in which a wiring plane is provided internally in the main body. 5. The carrier plate according to claim 1 , wherein the cutout is arranged between the terminal pads for the component or therebelow, wherein the protection element is recessed in the main body to a depth such that the component can be applied at least partly above the protection element. 6. The carrier plate according to claim 1 , wherein the cutout is configured in the form of a trench extending transversely over the main body. 7. The carrier plate according to claim 1 , wherein the cutout is laterally enclosed by the main body, wherein the cutout extends vertically through the entire main body. 8. The carrier plate according to claim 1 , on which a multiplicity of component regions having terminal pads and at least one cutout in each case are provided, wherein the carrier plate is able to be singulated into individual carriers, on each of which a component region for one or a plurality of components is provided. 9. A carrier plate for an electrical component comprising a mechanically stable main body, having external contacts on the underside and terminal pads for the component on the top side, comprising a cutout, into which an ESD protection element is at least partly embedded, wherein the electrical terminals of the protection element are accessible from the underside of the main body, the protection element being discrete from the main body and including an interspace between the protection element and the outer walls of the cutout, wherein the protection element is mechanically fixedly embedded in the cutout of the main body by means of a connection means, wherein the electrical terminals of the protection element are connected by way of a structured metallic layer to the terminal pads on the external contacts on the underside, wherein the main body is a crystalline, ceramic or vitreous main body, wherein the outwardly facing surface of the protection element terminates flush with a surface of the main body, and wherein the structured metallic layer bears on the two flush surfaces.
protecting against electrostatic charges or discharges, e.g. Faraday shields (integrated devices comprising arrangements for electrical protection H10D89/60) · CPC title
the housing or enclosure being formed as coating or mould without outer sheath (H01C1/032 takes precedence) · CPC title
Varistor boundary, e.g. surface layers (H01C7/12 takes precedence) · CPC title
Means to assemble electrical device · CPC title
Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors · CPC title
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