Magnetic flux concentrator for in-plane direction magnetic field concentration

US11237223B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11237223-B2
Application numberUS-201916521053-A
CountryUS
Kind codeB2
Filing dateJul 24, 2019
Priority dateJul 24, 2019
Publication dateFeb 1, 2022
Grant dateFeb 1, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A structure includes a substrate which includes a surface. The structure also includes a horizontal-type Hall sensor positioned within the substrate and below the surface of the substrate. The structure further includes a patterned magnetic concentrator positioned above the surface of the substrate, and a protective overcoat layer positioned above the magnetic concentrator.

First claim

Opening claim text (preview).

What is claimed is: 1. A structure, comprising: a substrate comprising a surface; a horizontal-type Hall sensor positioned within the substrate and below the surface of the substrate; a patterned magnetic concentrator positioned above the surface of the substrate; and a protective overcoat layer positioned above the magnetic concentrator; wherein the patterned magnetic concentrator comprises multiple magnetic layers; wherein the multiple magnetic layers comprise a composition selected from the group consisting of Ni, Co, Fe, NiFe, CoNiFe, CoTaZr, and combinations thereof, and wherein the multiple magnetic layers are separated from each other via an insulating layer comprising a composition selected from the group consisting of AlN, Al 2 O 3 , and combinations thereof. 2. A structure, comprising: a substrate comprising a surface; a horizontal-type Hall sensor positioned within the substrate and below the surface of the substrate; a patterned magnetic concentrator positioned above the surface of the substrate; and a protective overcoat layer positioned above the magnetic concentrator; wherein the patterned magnetic concentrator comprises multiple magnetic layers; wherein the patterned magnetic concentrator further comprises an electrically conducting metal layer positioned below the multiple magnetic layers, and wherein the electrically conducting metal layer comprises a composition selected from the group consisting of Ti, W, Cu, and combinations thereof. 3. A structure, comprising: a substrate comprising a surface; a horizontal-type Hall sensor positioned within the substrate and below the surface of the substrate; a patterned magnetic concentrator positioned above the surface of the substrate; and a protective overcoat layer positioned above the magnetic concentrator; wherein the patterned magnetic concentrator comprises multiple magnetic layers; wherein the patterned magnetic concentrator further comprises an outer layer at least partially encasing the multiple magnetic layers, and wherein the outer layer comprises a composition selected from the group consisting of Ti, SiN, SiO 2 , SiON, and combinations thereof. 4. A structure, comprising: a substrate comprising a surface; a horizontal-type Hall sensor positioned within the substrate and below the surface of the substrate; a patterned magnetic concentrator positioned above the surface of the substrate; a protective overcoat layer positioned above the magnetic concentrator; and a vertical-type Hall sensor positioned within the substrate and below the surface of the substrate, wherein the patterned magnetic concentrator comprises a gap at an inner portion of the patterned magnetic concentrator, wherein the vertical-type Hall sensor is positioned below the gap, and wherein the horizontal-type Hall sensor comprises multiple Hall sensors which are positioned below outer-edge portions, respectively, of the patterned magnetic concentrator. 5. A method of forming a structure, the method comprising: forming a substrate comprising a surface; positioning a horizontal-type Hall sensor within the substrate and below the surface of the substrate; forming a magnetic concentrator above the surface of the substrate; and forming a protective overcoat layer above the magnetic concentrator; wherein the magnetic concentrator comprises multiple magnetic layers; wherein the multiple magnetic layers comprise a composition selected from the group consisting of Ni, Co, Fe, NiFe, CoNiFe, CoTaZr, and combinations thereof, and wherein the multiple magnetic layers are separated from each other via an insulating layer comprising a composition selected from the group consisting of AlN, Al 2 O 3 , and combinations thereof. 6. A method of forming a structure, the method comprising: forming a substrate comprising a surface; positioning a horizontal-type Hall sensor within the substrate and below the surface of the substrate; forming a magnetic concentrator above the surface of the substrate; and forming a protective overcoat layer above the magnetic concentrator; wherein the magnetic concentrator comprises multiple magnetic layers; wherein the magnetic concentrator further comprises an electrically conducting metal layer positioned below the multiple magnetic layers, and wherein the electrically conducting metal layer comprises a composition selected from the group consisting of Ti, W, Cu, and combinations thereof. 7. A method of forming a structure, the method comprising: forming a substrate comprising a surface; positioning a horizontal-type Hall sensor within the substrate and below the surface of the substrate; forming a magnetic concentrator above the surface of the substrate; and forming a protective overcoat layer above the magnetic concentrator; wherein the magnetic concentrator comprises multiple magnetic layers; wherein the magnetic concentrator further comprises an outer layer at least partially encasing the multiple magnetic layers, and wherein the outer layer comprises a composition selected from the group consisting of Ti, SiN, SiO 2 , SiON, and combinations thereof. 8. A method of forming a structure, the method comprising: forming a substrate comprising a surface; positioning a horizontal-type Hall sensor within the substrate and below the surface of the substrate; forming a magnetic concentrator above the surface of the substrate; forming a protective overcoat layer above the magnetic concentrator; and positioning a vertical-type Hall sensor within the substrate and below the surface of the substrate, wherein the patterned magnetic concentrator comprises a gap at an inner portion of the patterned magnetic concentrator, wherein the vertical-type Hall sensor is positioned below the gap, and wherein the horizontal-type Hall sensor comprises multiple Hall sensors which are positioned below outer-edge portions, respectively, of the patterned magnetic concentrator.

Assignees

Inventors

Classifications

  • Vertical Hall-effect devices · CPC title

  • Geometrical arrangement of magnetic sensor elements; Apparatus combining different magnetic sensor types (G01R33/0206 takes precedence) · CPC title

  • using galvano-magnetic devices · CPC title

  • comprising metal as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a bituminous or tarry layer B32B11/08; next to a water-setting substance layer B32B13/06; next to a glass layer B32B17/061; next to a cellulosic plastic layer B32B23/042)} · CPC title

  • G01R33/07Primary

    Hall effect devices · CPC title

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What does patent US11237223B2 cover?
A structure includes a substrate which includes a surface. The structure also includes a horizontal-type Hall sensor positioned within the substrate and below the surface of the substrate. The structure further includes a patterned magnetic concentrator positioned above the surface of the substrate, and a protective overcoat layer positioned above the magnetic concentrator.
Who is the assignee on this patent?
Texas Instruments Inc
What technology area does this patent fall under?
Primary CPC classification G01R33/07. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 01 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).