Polishing apparatus

Patent metadata

Field	Value
Publication number	US-11224956-B2
Application number	US-201916374590-A
Country	US
Kind code	B2
Filing date	Apr 3, 2019
Priority date	Nov 1, 2004
Publication date	Jan 18, 2022
Grant date	Jan 18, 2022

Abstract

A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

First claim

The invention claimed is:

1. A polishing apparatus comprising:
a top ring body configured to press a substrate against a polishing surface;
a retainer ring having a ring member configured to press the polishing surface;
a retainer ring guide which is brought to into contact with a lower surface of the ring member; and
a retainer ring wear detector configured to detect wear of the ring member when the retainer ring guide is in contact with the lower surface of the ring member,
wherein the retainer ring guide is provided on a pusher which is configured to deliver the substrate to the top ring body, and
wherein the retainer ring wear detector is provided on the pusher.

2. The polishing apparatus according to claim 1 , further comprising:
a controller configured to issue a signal to indicate that the ring member should be replaced when an amount of wear of the ring member reaches a predetermined value.

3. The polishing apparatus according to claim 1 , further comprising:
a controller configured to change a pressing force applied to the substrate according to an amount of wear of the ring member.

4. The polishing apparatus according to claim 1 , further comprising:
a controller configured to control a pressing force applied to the ring member based on correlation data of an amount of wear of the ring member and a polishing profile of the substrate.

5. The polishing apparatus according to claim 1 ,
wherein a push stage operable to push the substrate on a lower surface of the top ring body is provided on the pusher and,
wherein, when the retainer ring guide is brought into contact with ring member, the position of the retainer ring guide is varied according to the amount of wear of the ring member while the position of the push stage is fixed, the retainer ring wear detector is operable to measure a distance between the retainer ring guide and the push stage.

6. The polishing apparatus according to claim 1 ,
wherein the retainer ring guide has a recess formed at its upper end surface, and
wherein, when the retainer ring guide is brought into contact with ring member, a lower portion of the ring member can be fitted into the recess.

7. A polishing apparatus comprising
a top ring body configured to press a substrate against a polishing surface;
a retainer ring having a ring member configured to press the polishing surface;
a retainer ring wear detector configured to detect weary the ring member when in contact with the lower surface of the ring member; and
a pusher configured to deliver the substrate to the top ring body, wherein the retainer ring wear detector is provided on the pusher.

Assignees

• Ebara Corp

Inventors

• Nabeya Osamu
• Togawa Tetsuji
• Fukushima Makoto
• Yasuda Hozumi

Classifications

• H10P52/00 Primary

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B24B49/00

  Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (B24B33/06, B24B37/005 take precedence; if applicable to other machine tools, B23Q15/00 - B23Q17/00 take precedence) · CPC title

• B24B49/18

  taking regard of the presence of dressing tools · CPC title

• B24B49/16

  taking regard of the load · CPC title

• B24B37/32

  Retaining rings · CPC title