Carrier head

Patent metadata

Field	Value
Publication number	US-9818619-B2
Application number	US-201514747200-A
Country	US
Kind code	B2
Filing date	Jun 23, 2015
Priority date	Jun 23, 2014
Publication date	Nov 14, 2017
Grant date	Nov 14, 2017

Abstract

Provided is a carrier head. The carrier head includes: a body having a ring shape, wherein a first locking part is formed on an external surface of the body; a support unit surrounding lateral and lower parts of the body to be elevatably coupled to the body, wherein a second locking part vertically facing the first locking part is formed on an internal surface of the support unit; a regulating member located in a space between the first locking part and the second locking part; a retainer ring having a ring shape and located at the external bottom of the support unit; and an elevating unit coupling the retainer ring to the support unit to enable a height to be regulated relative to the support unit.

First claim

What is claimed is:

1. A carrier head comprising:
a body having a ring shape, wherein a first locking part is formed on an external surface of the body;
a support unit surrounding lateral and lower parts of the body to be elevatably coupled to the body, wherein a second locking part vertically facing the first locking part is formed on an internal surface of the support unit;
a regulating member located in a space between the first locking part and the second locking part;
a retainer ring having a ring shape and located at an external bottom of the support unit; and
an elevating unit coupling the retainer ring to the support unit to enable a height of the retainer ring to be regulated relative to the support unit.

2. The carrier head of claim 1 , wherein the first locking part protrudes externally from the external surface of the body, and
the regulating member has a set height and is located on a first coupling surface provided on a top of the first locking part.

3. The carrier head of claim 2 , wherein the support unit enables a second coupling surface on a bottom of the second locking part to contact a top of the regulating member.

4. The carrier head of claim 2 , wherein the regulating member has a ring shape.

5. The carrier head of claim 4 , wherein an internal surface of the regulating member has a shape corresponding to a perimeter of a part of the body at which the first locking part is arranged.

6. The carrier head of claim 1 , wherein the elevating unit comprises:
a sealing member located at a lower part of the support unit to form an elevating chamber, the elevating chamber being a space having an opening; and
an elevating member located in the elevating chamber and connected to the retainer ring through the opening.

7. The carrier head of claim 6 , wherein the elevating member has a ring shape, and
a guide rod having a rod shape is arranged on a top of the elevating member.

8. The carrier head of claim 7 , wherein the sealing member comprises:
a first sealing ring, wherein an upper part of the first sealing ring is bent;
a second sealing ring having a larger circumference than the first sealing ring and located outside the first sealing ring, wherein an upper part of the second sealing ring is bent; and
a cap shielding an upper space between the first sealing ring and the second sealing ring.

9. The carrier head of claim 8 , wherein a first bent part bent, a first elevating part bent upwards from an end of the first bent part and a first holding part bent from an end of the first elevating part are formed on a lower part of the first sealing ring, and
a second bent part bent, a second elevating part bent upwards from an end of the second bent part and a second holding part bent from an end of the second elevating part are formed on a lower part of the second sealing ring.

10. The carrier head of claim 9 , wherein a width of the elevating member is formed to be larger than a width of the opening and the elevating member is located on a top of the first holding part and on a top of the second holding part.

11. The carrier head of claim 7 , wherein a guide recess being a space for storing the guide rod is formed in an internal top of the sealing member.

12. The carrier head of claim 6 , further comprising:
a membrane coupled to a bottom of the support unit to be located inside the retainer ring;
a first flow path configured to supply a gas to a space between the membrane and the support unit or to discharge the gas from the space; and
a second flow path connected to the elevating chamber separately from the first flow path.

13. A carrier head, comprising:
a body comprising a first locking part formed on an external surface of the body;
a support unit surrounding the body and elevatably coupled to the body, wherein the support unit comprises a second locking part formed on an internal surface of the support unit;
a retainer ring located at an external bottom of the support unit;
an elevating unit coupling the retainer ring to the support unit to enable a height of the retainer ring to be regulated relative to the support unit;
a membrane coupled to the external bottom of the support unit and located inside the retainer ring; and
a first flow path configured to supply a gas to a space between the membrane and the support unit and to discharge the gas from the space.

14. The carrier head of claim 13 , wherein the elevating unit comprises:
a sealing member that forms an elevating chamber having an opening; and
an elevating member positioned in the elevating chamber and connected to the retainer ring through the opening.

15. The carrier head of claim 14 , further comprising a second flow path connected to the elevating chamber separately from the first flow path.

16. The carrier head of claim 14 , further comprising at least one guide rod arranged on a top of the elevating member.

17. The carrier head of claim 16 , further comprising at least one guide recess formed in an internal top of the sealing member, and wherein the at least one guide rod is located within the at least one guide recess.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Jongbok
• Ban Junho
• Lee Sangseon

Classifications

• H10P52/402 Primary

  of semiconductor materials · CPC title

• B24B37/30 Primary

  for single side lapping of plane surfaces · CPC title

• B24B37/32

  Retaining rings · CPC title

• H01L21/30625 Primary

  Electricity · mapped topic

• B24B37/10

  for single side lapping · CPC title