Sensor interposer employing castellated through-vias

Patent metadata

Field	Value
Publication number	US-11224125-B2
Application number	US-202016850986-A
Country	US
Kind code	B2
Filing date	Apr 16, 2020
Priority date	Feb 22, 2018
Publication date	Jan 11, 2022
Grant date	Jan 11, 2022

Abstract

An example sensor interposer employing castellated through-vias formed in a PCB includes a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via; and a guard trace formed on the planar substrate, the guard trace having a first portion formed on a first surface of the planar substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, the guard trace having a second portion formed on a second surface of the planar substrate and electrically coupling the third castellated through-via to the fourth castellated through-via, the guard trace formed between the first and second electrical contacts to provide electrical isolation between the first and second electrical contacts.

First claim

That which is claimed is:

1. A method of forming a wearable biosensor comprising:
providing a planar substrate;
forming a plurality of through-vias in the planar substrate;
cutting a portion of the planar substrate to create an interposer substrate of a sensor interposer for the wearable biosensor, the cutting comprising cutting through at least four of the through-vias to create at least four castellated through-vias;
forming a first electrical contact on the interposer substrate and electrically coupling the first electrical contact to a first castellated through-via;
forming a second electrical contact on the interposer substrate and electrically coupling the second electrical contact to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via;
forming a guard trace on the interposer substrate, the guard trace electrically coupled between a third and a fourth through-via formed on the planar substrate, the guard trace isolating the first and second electrical contacts;
providing a sensor wire for the wearable biosensor, the sensor wire including a sensor chemical on a distal end of the sensor wire and including at least two electrodes;
electrically coupling a first electrode of the at least two electrodes of the sensor wire to the first electrical contact; and
electrically coupling a second electrode of the at least two electrodes of the sensor wire to the second electrical contact.

2. The method of claim 1 , wherein the guard trace comprises:
a first portion formed on a first surface of the interposer substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, and
a second portion formed on a second surface of the interposer substrate and electrically coupling the third castellated through-via to the fourth castellated through-via,
the guard trace formed between the first and second electrical contacts to provide electrical isolation between the first and second electrical contacts.

3. The method of claim 1 , further comprising:
defining an opening in the interposer substrate between the first and second electrical contacts, and wherein a third castellated through-via is formed in a perimeter of the planar substrate, and a fourth castellated through-via is formed in a perimeter of the opening, and wherein the guard trace is a first guard trace; and
forming a second guard trace on the interposer substrate, the second guard trace having a first portion formed on a first surface of the interposer substrate and electrically coupling a fifth castellated through-via to a sixth castellated through-via, the second guard trace having a second portion formed on a second surface of the interposer substrate and electrically coupling the fifth castellated through-via to the sixth castellated through-via, the second guard trace formed between the first and second electrical contacts to provide electrical isolation between the first and second electrical contacts,
wherein the fifth castellated through-via is formed in a perimeter of the planar substrate, and the sixth castellated through-via is formed in a perimeter of the opening.

4. The method of claim 1 , wherein the sensor wire comprises a first wire material and a second wire material, the second wire material formed coaxially around the first wire material, a first portion of the first wire material extending beyond the second wire material at a first end of the sensor wire,
wherein:
the first portion of the first wire material includes the first electrode, and
the second wire material includes the second electrode.

5. The method of claim 1 , further comprising:
providing a printed circuit board (“PCB”) having a plurality of electrical contacts defined on a first surface of the PCB;
physically coupling the sensor interposer for the wearable biosensor to the first surface of the PCB; and
electrically coupling the first and second castellated through-vias and the third and fourth through-vias to respective first, second, third, and fourth electrical contacts of the plurality of electrical contacts defined on the first surface of the PCB.

6. The method of claim 5 , wherein the PCB defines a surface feature, and the method further comprises engaging the surface feature with an opening defined in the planar substrate, the surface feature enabling alignment between the PCB and the sensor interposer.

7. The method of claim 1 , wherein the sensor chemical comprises glucose oxidase.

8. The method of claim 1 , wherein the sensor chemical comprises a chemical configured to react with or more of glucose, lactate, or cholesterol.

9. The method of claim 1 , further comprising depositing the sensor chemical on the distal end of the sensor wire.

10. The method of claim 1 , wherein a controller is in communication with the sensor wire, the controller configured to receive sensor signals from the sensor wire, and determine an analyte concentration based on the sensor signals.

11. The method of claim 1 , wherein the first electrical contact and the second electrical contact are formed on opposite sides of the interposer substrate.

12. The method of claim 1 , wherein the distal end of the sensor wire is configured to be inserted into a wearer's skin.

Assignees

• Dexcom Inc

Inventors

• Frick Sean
• Jung Louis
• Lari David

Classifications

• H10W20/20

  Interconnections within wafers or substrates, e.g. through-silicon vias [TSV] · CPC title

• H10W20/01

  Manufacture or treatment · CPC title

• A61B5/14532

  for measuring glucose, e.g. by tissue impedance measurement · CPC title

• H05K1/0262

  Arrangements for regulating voltages or for using plural voltages · CPC title

• H05K1/0219

  Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors · CPC title