Optical sensor, scanner unit, and image forming apparatus

Patent metadata

Field	Value
Publication number	US-2018024353-A1
Application number	US-201715654369-A
Country	US
Kind code	A1
Filing date	Jul 19, 2017
Priority date	Jul 22, 2016
Publication date	Jan 25, 2018
Grant date	—

Abstract

An optical sensor includes a bare chip mounted on a circuit board, a protection member configured to protect the bare chip, a pad connected to the bare chip via a wire, and a pattern connecting the pad and a terminal portion at an edge of the circuit board to each other. The pattern is connected to the terminal portion on a same surface as a surface on which the bare chip is mounted, and a portion of the pattern between the protection member and the terminal portion is covered with solder resist.

First claim

What is claimed is:

1 . An optical sensor comprising:
a circuit board; a bare chip mounted on the circuit board; a protection member configured to protect the bare chip; a pad connected to the bare chip via a wire; and a pattern connecting the pad and a terminal portion at an edge of the circuit board to each other, wherein the pattern is connected to the terminal portion on a same surface as a surface on which the bare chip is mounted, and a portion of the pattern between the protection member and the terminal portion is covered with solder resist.

2 . An optical sensor comprising:
a circuit board; a bare chip mounted on the circuit board; a protection member configured to protect the bare chip; a pad connected to the bare chip via a wire; a through-hole formed through the circuit board; and a pattern connected to the pad via the through-hole, wherein the pattern is connected to the through-hole on an opposite surface of a surface on which the bare chip is mounted, and is connected to the pad via the through-hole.

3 . The optical sensor according to claim 2 , wherein the pad and the pattern are not mounted on a surface where the protection member is in abutment with the circuit board.

4 . The optical sensor according to claim 2 , wherein the bare chip includes a light receiving element, the light receiving element is rectangular, and the pad is not disposed at a position on any one of a left side and a right side of the light receiving element in a longitudinal direction thereof.

5 . The optical sensor according to claim 1 , wherein the protection member is a transparent acrylic resin and is configured to cover the bare chip therewith.

6 . A scanner unit comprising:
a light emission element; a mirror configured to reflect light emitted from the light emission element; and an optical sensor configured to detect the light reflected by the mirror, the optical sensor including a circuit board, a bare chip mounted on the circuit board, a protection member configured to protect the bare chip, a pad connected to the bare chip via a wire, and a pattern connecting the pad and a terminal portion at an edge of the circuit board to each other, wherein the pattern is connected to the terminal portion on a same surface as a surface on which the bare chip is mounted, and a portion of the pattern between the protection member and the terminal portion is covered with solder resist.

7 . The scanner unit according to claim 6 , wherein the light emission element is a semiconductor laser element.

8 . A scanner unit comprising:
a light emission element; a mirror configured to reflect light emitted from the light emission element; and an optical sensor configured to detect the light reflected by the mirror, the optical sensor including a circuit board, a bare chip mounted on the circuit board, a protection member configured to protect the bare chip, a pad connected to the bare chip via a wire, and a pattern connecting the pad and a terminal portion at an edge of the circuit board to each other, wherein the pattern is connected to a through-hole on an opposite surface of a surface on which the bare chip is mounted, and is connected to the pad via the through-hole.

9 . The scanner unit according to claim 8 , wherein the light emission element is a semiconductor laser element.

10 . An image forming apparatus comprising:
an image bearing member configured to allow an image to be formed thereon; a scanner unit configured to irradiate the image bearing member with light to form a latent image on the image bearing member, the scanner unit including a light emission element, a mirror configured to reflect the light emitted from the light emission element, and an optical sensor configured to detect the light reflected by the mirror, the optical sensor including a circuit board, a bare chip mounted on the circuit board, a protection member configured to protect the bare chip, a pad connected to the bare chip via a wire, and a pattern connecting the pad and a terminal portion at an edge of the circuit board to each other, wherein the pattern is connected to the terminal portion on a same surface as a surface on which the bare chip is mounted, and a portion of the pattern between the protection member and the terminal portion is covered with solder resist; a development unit configured to develop the latent image formed on the image bearing member; and a transfer unit configured to transfer an image developed by the development unit onto a sheet.

11 . The image forming apparatus according to claim 10 , wherein the light emission element is a semiconductor laser element.

12 . An image forming apparatus comprising:
an image bearing member configured to allow an image to be formed thereon; a scanner unit configured to irradiate the image bearing member with light to form a latent image on the image bearing member, the scanner unit including a light emission element, a mirror configured to reflect the light emitted from the light emission element, and an optical sensor configured to detect the light reflected by the mirror, the optical sensor including a circuit board, a bare chip mounted on the circuit board, a protection member configured to protect the bare chip, a pad connected to the bare chip via a wire, and a pattern connecting the pad and a terminal portion at an edge of the circuit board to each other, wherein the pattern is connected to a through-hole on an opposite surface of a surface on which the bare chip is mounted, and is connected to the pad via the through-hole; a development unit configured to develop the latent image formed on the image bearing member; and a transfer unit configured to transfer an image developed by the development unit onto a sheet.

13 . The image forming apparatus according to claim 12 , wherein the light emission element is a semiconductor laser element.

Assignees

• Canon Kk

Inventors

• Tanaka Shunsuke
• Fujii Kazunari

Classifications

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W72/981

  Auxiliary members, e.g. spacers · CPC title

• H10W72/59

  Bond pads specially adapted therefor · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title