Method of manufacture including polishing pad monitoring method and polishing apparatus including polishing pad monitoring device

Patent metadata

Field	Value
Publication number	US-11222786-B2
Application number	US-201916426117-A
Country	US
Kind code	B2
Filing date	May 30, 2019
Priority date	Nov 12, 2018
Publication date	Jan 11, 2022
Grant date	Jan 11, 2022

Abstract

In a method of manufacture, a displacement sensor is provided over a conditioner disk. The conditioner disk is rotated to perform a conditioning process on a polishing surface of a polishing pad. A displacement of the rotating conditioner disk is detected using the displacement sensor during the conditioning process. A height of the conditioner disk is calculated from the detected displacement. An end point of the conditioning process is determined on the polishing surface based on the calculated height.

First claim

What is claimed is:

1. A method of manufacture, the method comprising:
providing a displacement sensor over a conditioner disk;
rotating the conditioner disk to perform a conditioning process on a polishing surface of a polishing pad;
detecting a displacement of the rotating conditioner disk using the displacement sensor during the conditioning process;
calculating a height of the conditioner disk from the detected displacement; and
determining an end point of the conditioning process on the polishing surface based on the calculated height,
wherein the displacement sensor comprises an eddy current sensor,
wherein the method further comprises performing a chemical mechanical polishing process on a substrate with the polishing pad disposed on a polishing table of a chemical mechanical polishing apparatus, dicing the substrate into a plurality of chips, and packaging each of the chips to form a semiconductor device,
wherein detecting the displacement of the rotating conditioner disk comprises obtaining a voltage signal from the eddy current sensor,
wherein detecting the displacement of the rotating conditioner disk comprises converting a plane profile to waveform of an upper surface of the conditioner disk into a two-dimensional plane profile of a constant displacement, and
wherein converting the plane profile of waveform into the two-dimensional plane profile of a constant displacement comprises performing an offset compensation on data of voltage signals using singular points obtained from indexing structures on the upper surface of the conditioner disk.

2. The method of claim 1 , wherein the displacement sensor is installed in a disk head that rotates a disk shaft connected to the conditioner disk.

3. The method of claim 2 , wherein the displacement sensor is installed in a lower surface of the disk head.

4. The method of claim 2 , wherein a plurality of displacement sensors is installed at equal angle interval along a circumferential direction of the disk head to be spaced apart from each other.

5. The method of claim 1 , wherein calculating the height of the conditioner disk from the detected displacement comprises converting the voltage signal into the height of the conditioner disk using a calibration map between the voltage signal and the height.

6. The method of claim 1 , wherein determining the end point of the conditioning process on the polishing surface based on the calculated height comprises determining a height of the polishing pad or a failure of a polishing pad conditioner including the conditioner disk.

7. A method of manufacture, the method comprising:
rotating a conditioner disk to perform a conditioning process on a polishing surface of a polishing pad;
detecting a displacement of the rotating conditioner disk using a non-contacting displacement sensor which is arranged to face an upper surface of the conditioner disk during the conditioning process;
calculating a height of the conditioner disk from the detected displacement; and
determining a height of the polishing pad or a failure of a polishing pad conditioner including the conditioner disk based on the calculated height,
wherein the non-contacting displacement sensor is installed in a disk head which is configured to rotate a disk shaft connected to the conditioner disk, and
wherein a plurality of non-contacting displacement sensor is installed at equal angle interval along a circumferential direction of the disk head to be spaced apart from each other.

8. The method of claim 7 , wherein the non-contacting displacement sensor comprises an eddy current sensor.

9. The method of claim 8 , wherein detecting the displacement of the rotating conditioner disk comprises obtaining a voltage signal from the eddy current sensor.

10. The method of claim 7 , wherein the non-contacting displacement sensor is installed in a lower surface of the disk head.

11. A method of manufacture, the method comprising:
rotating a conditioner disk to perform a conditioning process on a polishing surface of a polishing pad;
detecting a displacement of the rotating conditioner disk using a non-contacting displacement sensor which is arranged to face an upper surface of the conditioner disk during the conditioning process;
calculating a height of the conditioner disk from the detected displacement;
determining a height of the polishing pad or a failure of a polishing pad conditioner including the conditioner disk based on the calculated height; and
securing the conditioner disk to a calibration jig to create a calibration map for converting data of voltage signals.

12. The method of claim 11 , wherein the calibration map comprises
a first calibration map for converting a plane profile of waveform of an upper surface of the conditioner disk into a two-dimensional plane profile of a constant displacement; and
a second calibration map for converting a voltage signal into the height of the conditioner disk.

13. The method of claim 12 , wherein detecting the displacement of the rotating conditioner disk comprises converting an output signal from an eddy current sensor into two-dimensional plane profile data of a constant displacement using the first calibration map.

14. The method of claim 12 , wherein calculating the height of the conditioner disk from the detected displacement comprises converting the voltage signal into the height of the conditioner disk using the second calibration map.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Shin Jin
• Son Woo-Mok
• Lee Nam-Hoon
• Kim Dong-Eog
• Oh Seung-Hun
• Lee Eun-Seok
• Jang Young-Seok

Classifications

• H10P90/123

  by grinding or lapping · CPC title

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P52/00 Primary

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B24B49/00

  Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (B24B33/06, B24B37/005 take precedence; if applicable to other machine tools, B23Q15/00 - B23Q17/00 take precedence) · CPC title

• B24B57/02

  for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents · CPC title