Circuit board and display device

Patent metadata

Field	Value
Publication number	US-11212914-B2
Application number	US-201916622108-A
Country	US
Kind code	B2
Filing date	Apr 24, 2019
Priority date	May 10, 2018
Publication date	Dec 28, 2021
Grant date	Dec 28, 2021

Abstract

The present disclosure provides a circuit board, including a substrate on which a first conductive layer and an electronic device are disposed, wherein the first conductive layer is disposed on a first surface of the substrate, and wherein a bottom end of the electronic device is disposed on the first conductive layer through the substrate. The present disclosure provides a display device.

First claim

What is claimed is:

1. A circuit board, comprising a substrate on which a first conductive layer and an electronic device are disposed,
wherein the first conductive layer is disposed on a first surface of the substrate, and
wherein a bottom end of the electronic device passes through the substrate and connects to the first conductive layer,
wherein a second conductive layer is further disposed on the substrate,
wherein the second conductive layer is disposed on a second surface of the substrate opposite to the first surface, and a top end of the electronic device is located on a side of the first conductive layer facing the second conductive layer,
wherein a first protective layer is provided on a side of the first conductive layer facing away from the substrate, and a second protective layer is provided on a side of the second conductive layer facing away from the substrate; and
wherein an adhesive layer is provided between the first conductive layer and the first protective layer, and between the second conductive layer and the second protective layer, respectively.

2. The circuit board according to claim 1 , wherein a plurality of pads are provided on the bottom end of the electronic device so that the plurality of pads are in contact with the first conductive layer.

3. The circuit board according to claim 2 , wherein the first conductive layer comprises a plurality of signal lines in contact with the plurality of pads on the electronic device, respectively.

4. The circuit board according to claim 3 , wherein a material of the plurality of signal lines comprises copper.

5. The circuit board according to claim 1 , wherein an antistatic layer is provided on the side of the first conductive layer facing away from the substrate.

6. The circuit board according to claim 1 , wherein the substrate is a flexible substrate.

7. A display device, comprising a display panel and the circuit board according to claim 1 , wherein the display panel comprises a bonding area, and the bonding area is provided with a bonding electrode to which the first region of the first conductive layer is bonded.

8. The display device according to claim 7 , wherein the substrate of the circuit board is a flexible substrate, and a portion of the circuit board is bent to a side of the display panel facing away from a display direction of the display panel.

9. The display device according to claim 7 , further comprising a driving circuit board connected to a second region of the first conductive layer, wherein the second region is different from the first region.

Assignees

• Beijing Boe Optoelectronics Tech Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Shu Xingjun
• Wu Jianwu
• Chen Xi
• Li Xinda
• Yang Shengwei
• Zhang Yadong
• Tang Jianye
• Wang Jiaqiang

Classifications

• H05K1/183

  associated with components mounted in and supported by recessed areas of the PCBs · CPC title

• H05K1/0259

  Electrostatic discharge [ESD] protection · CPC title

• H05K1/189 Primary

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K2201/0154

  Polyimide · CPC title