Component built-in board and method of manufacturing the same, and mounting body

Patent metadata

Field	Value
Publication number	US-9826646-B2
Application number	US-201514721247-A
Country	US
Kind code	B2
Filing date	May 26, 2015
Priority date	May 27, 2014
Publication date	Nov 21, 2017
Grant date	Nov 21, 2017

Abstract

A component built-in board comprises a multi-layer structure comprising a plurality of unit boards stacked therein a plurality of electronic components built in thereto in a stacking direction. The plurality of unit boards include: a first board having a first insulating layer and comprising an opening in which the electronic component is housed; and an intermediate board adjacent to the first board and comprising a first adhesive layer provided on at least a side of the first board of a second insulating layer. The intermediate board includes a first wiring layer formed at a position overlapping in the stacking direction a gap between an inner periphery of the opening and an outer periphery of the electronic component of the first board on a surface on the first board side of the second insulating layer.

First claim

What is claimed is:

1. A component built-in board of multi-layer structure comprising a plurality of unit boards stacked therein and a plurality of electronic components built in thereto in a stacking direction, wherein
the plurality of electronic components include a first electronic component, and
the plurality of unit boards include;
a first board having a first insulating layer comprising an opening in which the first electronic component is housed; and
an intermediate board adjacent to the first board and comprising a second insulating layer and a first adhesive layer provided on at least a first side of the second insulating layer facing the first board, and
the intermediate board includes a first wiring layer on a first surface on the first side of the second insulating layer facing the first board, and the first wiring layer overlapping a gap between an inner periphery of the opening and an outer periphery of the first electronic component of the first board,
wherein the first wiring layer is entirely disposed within a region on the first surface defined by a boundary of the gap in the stacking direction,
wherein the first wiring layer projects from the first surface toward the gap, and is covered entirely by the first adhesive layer.

2. The component built-in board according to claim 1 , wherein
the plurality of unit boards include:
a second board comprising: a second wiring layer formed on a side of one surface of a third insulating layer; a first inter-layer conductive layer penetrating the third insulating layer and being connected to the second wiring layer; and a second adhesive layer being provided on a side of the other surface of the third insulating layer, and
the second board has a part of the first inter-layer conductive layer connected to the first electronic component on a side of the second adhesive layer.

3. The component built-in board according to claim 1 , wherein
the plurality of electronic components include a second electronic component, and
the plurality of unit boards include:
a third board that is disposed on an opposite side to the first board of the intermediate board, has a fourth insulating layer, and comprises an opening in which the second electronic component is housed at a position overlapping in the stacking direction the first electronic component.

4. The component built-in board according to claim 3 , wherein
the intermediate board includes: a third wiring layer formed at a position overlapping in the stacking direction a gap between an inner periphery of the opening and an outer periphery of the second electronic component of the third board on a surface on a side of the third board of the second insulating layer; and the first adhesive layer provided on the third board side.

5. The component built-in board according to claim 3 , wherein
the plurality of unit boards include:
a fourth board that is disposed between the third board and the intermediate board, comprises: a fourth wiring layer formed on a side of one surface of a fifth insulating layer; a second inter-layer conductive layer penetrating the fifth insulating layer and being connected to the fourth wiring layer; and a third adhesive layer being provided on a side of the other surface of the fifth insulating layer, and
a part of the fourth wiring layer is formed at a position overlapping in the stacking direction a gap between an inner periphery of the opening and an outer periphery of the second electronic component of the third board on a surface on a side of the intermediate board of the fifth insulating layer.

6. The component built-in board according to claim 1 , wherein
the first wiring layer of the intermediate board is a dummy wiring layer.

7. The component built-in board according to claim 4 , wherein
the third wiring layer of the intermediate board is a dummy wiring layer.

8. The component built-in board according to claim 5 , wherein
a part of the fourth wiring layer of the fourth board is a dummy wiring layer.

9. A mounting body having another electronic component surface-mounted on at least one mounting surface of a front surface and a back surface of the component built-in board described in claim 1 .

10. The mounting body according to claim 9 , wherein
the plurality of unit boards include:
a second board comprising: a second wiring layer formed on a side of one surface of a third insulating layer; a first inter-layer conductive layer penetrating the third insulating layer and being connected to the second wiring layer; a second adhesive layer being provided on a side of the other surface of the third insulating layer, and
the second board has a part of the first inter-layer conductive layer connected to the first electronic component on a side of the second adhesive layer.

11. The mounting body according to claim 9 , wherein
the plurality of electronic components include a second electronic component, and
the plurality of unit boards include:
a third board that is disposed on an opposite side to the first board of the intermediate board, has a fourth insulating layer, and comprises an opening in which the second electronic component is housed at a position overlapping in the stacking direction the first electronic component.

12. The mounting body according to claim 11 , wherein
the intermediate board includes: a third wiring layer formed at a position overlapping in the stacking direction a gap between an inner periphery of the opening and an outer periphery of the second electronic component of the third board on a surface on a side of the third board of the second insulating layer; and the first adhesive layer provided on the third board side.

13. The mounting body according to claim 11 , wherein
the plurality of unit boards include:
a fourth board that is disposed between the third board and the intermediate board, comprises: a fourth wiring layer formed on a side of one surface of a fifth insulating layer; a second inter-layer conductive layer penetrating the fifth insulating layer and being connected to the fourth wiring layer; and a third adhesive layer being provided on a side of the other surface of the fifth insulating layer, and
a part of the fourth wiring layer is formed at a position overlapping in the stacking direction a gap between an inner periphery of the opening and an outer periphery of the second electronic component of the third board on a surface on a side of the intermediate board of the fifth insulating layer.

14. The component built-in board according to claim 1 , wherein the gap surrounds the outer periphery of the first electronic component, and the first wiring layer extends along a surrounding shape of the gap.

15. The component built-in board according to claim 1 , wherein the first adhesive layer is bonded to the first electronic component, and the first adhesive layer enters the gap.

Assignees

• Fujikura Ltd

Inventors

• Munakata Koji

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/22

  the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL · CPC title

• H10W72/07236

  Soldering or alloying · CPC title

• H10W72/823

  Interconnections through encapsulations, e.g. pillars through molded resin on a lateral side a chip · CPC title

• H10W70/614

  the multiple chips being integrally enclosed · CPC title