Method of forming light emitting diode with high-silica substrate
US-2017207372-A1 · Jul 20, 2017 · US
Method of producing an optoelectronic component
US11211524B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11211524-B2 |
| Application number | US-201816631294-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 31, 2018 |
| Priority date | Aug 1, 2017 |
| Publication date | Dec 28, 2021 |
| Grant date | Dec 28, 2021 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; simultaneously spraying particles and a further material onto the cast surface, wherein a mixture of the further material and the particles includes a proportion of the particles of 20 percent by weight to 60 percent by weight, a portion of the particles remains at the cast surface, and a topography is created at the cast surface.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method of manufacturing an optoelectronic component comprising: providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; simultaneously spraying particles and a further material onto the cast surface, wherein a mixture of the further material and the particles comprises a proportion of the particles of 20 percent by weight to 60 percent by weight, a portion of the particles remains at the cast surface, and a topography is created at the cast surface. 2. The method as claimed in claim 1 , further comprising, before spraying on the particles, introducing a substance into the casting material, wherein the substance is configured to prevent the particles to be sprayed onto the cast surface from sinking into the casting material. 3. The method as claimed in claim 1 , further comprising, before spraying on the particles, partially hardening the casting material. 4. The method as claimed in claim 1 , further comprising, after spraying on the particles, hardening the casting material. 5. The method as claimed in claim 1 , further comprising, after spraying on the particles, removing unbonded or weakly bonded particles at the cast surface. 6. The method as claimed in claim 1 , wherein a thickness of the further material after spraying the further material onto the cast surface is smaller than an average diameter of the particles. 7. The method as claimed in claim 1 , wherein the casting material comprises further particles. 8. The method as claimed in claim 1 , wherein the casting material comprises a wavelength-converting fluorescent material.
Assignees
Inventors
Classifications
Scattering means (H10H20/82 takes precedence) · CPC title
of encapsulations · CPC title
of wavelength conversion means · CPC title
not being in contact with the bodies · CPC title
- H10H20/853Primary
characterised by their shape · CPC title
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- What does patent US11211524B2 cover?
- A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; simultaneously…
- Who is the assignee on this patent?
- Osram Oled Gmbh
- What technology area does this patent fall under?
- Primary CPC classification H10H20/853. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 28 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).