Film formation apparatus

Patent metadata

Field	Value
Publication number	US-11211233-B2
Application number	US-201916585525-A
Country	US
Kind code	B2
Filing date	Sep 27, 2019
Priority date	Sep 28, 2018
Publication date	Dec 28, 2021
Grant date	Dec 28, 2021

Abstract

According to one embodiment, a film formation apparatus includes a chamber having an interior to be vacuumed, a carrying unit which is provided in the chamber, and which carries a workpiece that has a processing target surface in a solid shape along a circular carrying path, a film formation unit that causes a film formation material to be deposited by sputtering on the workpiece that is being carried by the carrying unit to form a film thereon, and a shielding member which has an opening located at a side where the workpiece passes through, and which forms a film formation chamber where the film formation by the film formation unit is performed. A compensation plate that protrudes in the film formation chamber is provided, and the compensation plate has a solid shape along a shape of the processing target surface of the workpiece, and is provided at a position facing the workpiece.

First claim

What is claimed is:

1. A film formation apparatus comprising:
a chamber, an interior of the chamber is capable of being vacuumed;
a carrying unit which is provided in the chamber, and which carries a workpiece that has a processing target surface in a solid shape along a circular carrying path;
a film formation unit that causes a film formation material to be deposited by sputtering on the workpiece that is being carried by the carrying unit to form a film thereon; and
a shielding member which has an opening located at a side where the workpiece passes through, and which forms a film formation chamber where the film formation by the film formation unit is performed,
wherein a compensation plate that protrudes in the film formation chamber is provided,
wherein the compensation plate has a solid shape along a shape of the processing target surface of the workpiece, and is provided at a position facing the workpiece,
wherein the workpiece comprises a convexity and a flat surface in a surface facing the film formation unit;
wherein the shielding member comprises a concavity along the convexity of the workpiece in an end of the opening;
and wherein the compensation plate is provided so as to cover a part of the workpiece and the flat surface thereof at the end of the opening of the shielding member.

2. The film formation apparatus according to claim 1 , wherein the compensation plate is configured to expose a part of the workpiece where a film formation rate is at the minimum level.

3. The film formation apparatus according to claim 1 , wherein a distance between the compensation plate and the processing target surface of the workpiece is 5 mm or less.

4. The film formation apparatus according to claim 1 , further comprising three circular targets in the film formation chamber,
wherein a center of the one target is shifted from a line that connects respective centers of the two targets among the three targets, and
wherein the compensation plate is provided on an opposite side to the one target with respect to the line connecting the centers of the two targets.

5. The film formation apparatus according to claim 1 , wherein:
the shielding member comprises dividing walls that face with each other in the carrying direction in which the workpiece is carried; and
the compensation plate is attached to the dividing wall at an upstream side in the carrying direction.

6. The film formation apparatus according to claim 1 , wherein:
the shielding member comprises dividing walls that face with each other in the carrying direction in which the workpiece is carried; and
the compensation plate is attached to the dividing walls so as to contact therewith.

7. A film formation apparatus comprising:
a chamber, an interior of the chamber is capable of being vacuumed;
a carrying unit which is provided in the chamber, and which carries a workpiece that has a processing target surface in a solid shape along a circular carrying path;
a film formation unit that causes a film formation material to be deposited by sputtering on the workpiece that is being carried by the carrying unit to form a film thereon;
a shielding member which has an opening located at a side where the workpiece passes through, and which forms a film formation chamber where the film formation by the film formation unit is performed; and
three circular targets in the film formation chamber,
wherein a compensation plate that protrudes in the film formation chamber is provided,
wherein the compensation plate has a solid shape along a shape of the processing target surface of the workpiece, and is provided at a position facing the workpiece,
wherein a center of the one target is shifted from a line that connects respective centers of the two targets among the three targets,
and wherein the compensation plate is provided on an opposite side to the one target with respect to the line connecting the centers of the two targets.

8. The film formation apparatus according to claim 7 , wherein the compensation plate is configured to expose a part of the workpiece where a film formation rate is at the minimum level.

9. The film formation apparatus according to claim 7 , wherein a distance between the compensation plate and the processing target surface of the workpiece is 5 mm or less.

10. The film formation apparatus according to claim 7 , wherein:
the shielding member comprises dividing walls that face with each other in the carrying direction in which the workpiece is carried; and
the compensation plate is attached to the dividing wall at an upstream side in the carrying direction.

11. The film formation apparatus according to claim 7 , wherein:
the shielding member comprises dividing walls that face with each other in the carrying direction in which the workpiece is carried; and
the compensation plate is attached to the dividing walls so as to contact therewith.

Assignees

• Shibaura Mechatronics Corp

Inventors

• Ono Daisuke

Classifications

• H01J37/3441 Primary

  Dark space shields · CPC title

• C23C14/542

  Controlling the film thickness or evaporation rate · CPC title

• C23C14/505

  for rotation of the substrates · CPC title

• C23C14/3464 Primary

  using more than one target (C23C14/56 takes precedence) · CPC title

• C23C14/10

  Glass or silica · CPC title