Semiconductor inspection device

Patent metadata

Field	Value
Publication number	US-11209476-B2
Application number	US-201816617840-A
Country	US
Kind code	B2
Filing date	Mar 7, 2018
Priority date	Jun 2, 2017
Publication date	Dec 28, 2021
Grant date	Dec 28, 2021

Abstract

An inspection system includes a light source, a mirror, Galvano mirrors, a casing that holds the mirror and the Galvano mirrors inside and includes an attachment portion for attaching an optical element, and a control unit that controls a deflection angle of the Galvano mirrors, wherein the control unit controls the deflection angle so that an optical path optically connected to a semiconductor device is switched between a first optical path passing through the Galvano mirrors and the mirror, and a second optical path passing through the Galvano mirrors and the attachment portion, and controls the deflection angle so that the deflection angle when switching to the first optical path has been performed and the deflection angle when switching to the second optical path has been performed do not overlap.

First claim

The invention claimed is:

1. A semiconductor inspection device that inspects a semiconductor device, the semiconductor inspection device comprising:
a first light source configured to emit light for irradiating the semiconductor device with;
a light guide element optically connected to the first light source;
a pair of Galvano mirrors provided at positions at which the Galvano mirrors are optically connectable to the first light source via the light guide element;
a casing holding the light guide element and the pair of Galvano mirrors therein and including a first attachment portion for attaching an optical element, the first attachment portion being provided at a position at which the optical element is optically connectable to the pair of Galvano mirrors; and
a controller configured to control a deflection angle of the pair of Galvano mirrors,
wherein the controller
controls the deflection angle so that an optical path optically connected to the semiconductor device is switched between a first optical path passing through the pair of Galvano mirrors and the light guide element and a second optical path passing through the pair of Galvano mirrors and the first attachment portion, and
controls the deflection angle so that the deflection angle when switching to the first optical path has been performed and the deflection angle when switching to the second optical path has been performed do not overlap.

2. The semiconductor inspection device according to claim 1 , further comprising:
a first photodetector configured to detect light from the semiconductor device,
wherein the light guide element is optically connected to the first photodetector.

3. The semiconductor inspection device according to claim 1 , further comprising:
a second photodetector configured to detect light from the semiconductor device,
wherein the second photodetector is configured to detect the light via the second optical path by being attached to the first attachment portion.

4. The semiconductor inspection device according to claim 3 , wherein the second photodetector is attached to the first attachment portion via a collimator lens and an optical fiber.

5. The semiconductor inspection device according to claim 3 , wherein the second photodetector is a superconducting single photon detector.

6. The semiconductor inspection device according to claim 1 , further comprising:
a second light source configured to emit light for irradiating the semiconductor device with,
wherein the second light source is attached to the first attachment portion, such that the light can be radiated via the second optical path.

7. The semiconductor inspection device according to claim 6 , wherein the second light source is attached to the first attachment portion via a collimator lens and an optical fiber.

8. The semiconductor inspection device according to claim 1 , further comprising:
a second light source configured to emit light for irradiating the semiconductor device with, a second photodetector configured to detect light from the semiconductor device, and an optical path division element optically connected to the second light source and the second photodetector,
wherein the optical path division element is attached to the first attachment portion, such that the light can be radiated and/or detected via the second optical path.

9. The semiconductor inspection device according to claim 1 ,
wherein the casing further includes a second attachment portion for attaching an optical element, the second attachment portion being provided at a position at which the optical element can be optically connected to the pair of Galvano mirrors,
the controller
controls the deflection angle so that switching among the first optical path, the second optical path, and a third optical path passing through the pair of Galvano mirrors and the second attachment portion is performed, and
controls the deflection angle so that the deflection angle when switching to the first optical path has been performed, the deflection angle when switching to the second optical path has been performed, and the deflection angle when switching to the third optical path has been performed do not overlap.

10. The semiconductor inspection device according to claim 1 , wherein the light guide element is a mirror.

11. The semiconductor inspection device according to claim 10 ,
wherein the mirror is a dichroic mirror, and
the casing further includes a third attachment portion for attaching an optical element on an extended line connecting the pair of Galvano mirrors to the dichroic mirror.

12. The semiconductor inspection device according to claim 1 , further comprising:
a third light source optically connected to the light guide element.

Assignees

• Hamamatsu Photonics Kk

Inventors

• Nakamura Tomonori
• IWAKI Yoshitaka

Classifications

• G06T7/0004

  Industrial image inspection · CPC title

• G02B26/105

  with one or more pivoting mirrors or galvano-mirrors (G02B26/101 takes precedence) · CPC title

• G02B6/32

  having lens focusing means {positioned between opposed fibre ends (with lens being an integral part of the single fibre end G02B6/262)} · CPC title

• G01R31/308 Primary

  using non-ionising electromagnetic radiation, e.g. optical radiation {(investigating or analysing materials by the use of optical means G01N21/00; image analysis G06T7/00)} · CPC title

• G01R31/2656 Primary

  using non-ionising electromagnetic radiation, e.g. optical radiation · CPC title