Method of manufacturing electrical connection socket, and electrical connection socket

Patent metadata

Field	Value
Publication number	US-11189945-B2
Application number	US-201816768039-A
Country	US
Kind code	B2
Filing date	Jun 29, 2018
Priority date	Nov 30, 2017
Publication date	Nov 30, 2021
Grant date	Nov 30, 2021

Abstract

This electrical connection socket for relaying exchange of electrical signals between a first electrical component and a second electrical component, is provided with: a metallic casing which has a communication hole for communication between the upper surface and lower surface of the metallic casing, to the lower surface side of which the first electrical component is attached, and to the upper surface of which the second electrical component is attached; a signal pin which is disposed in the communication hole so as to be separated from the inner wall surface of the communication hole, one end of which is electrically connected to a terminal of the first electrical component, and the other end of which is electrically connected to a terminal of the second electrical component; an annular first holding member which is, in the upper region of the communication hole, press-fitted in the communication hole; and an annular second holding member which is, in the lower region of the communication hole, press-fitted to the outer circumferential surface of the signal pin, wherein the signal pin is fixed in the communication hole so as to be held by the metallic casing from above and from below via the first and second holding members.

First claim

What is claimed is:

1. A method of manufacturing an electrical connection socket for relaying transmission and reception of an electrical signal between a first electrical component and a second electrical component,
the electrical connection socket comprising:
a metal housing including a communication hole for communicating between an upper surface of the metal housing and a lower surface of the metal housing, the metal housing being disposed such that the first electrical component is disposed at the lower surface, and that the second electrical component is disposed at the upper surface, wherein
the metal housing being configured by connecting an upper plate and a lower plate,
the communication hole being configured by communicating a first through hole formed in the upper plate and a second through hole formed in the lower plate,
first through hole having a first reduced diameter portion in the upper area thereof, and
the second through hole having a second reduced diameter portion in the lower area thereof;

a signal pin disposed apart from an inner wall surface of the communication hole in the communication hole such that one end of signal pin is electrically connected to a terminal of the first electrical component and that another end of the signal pin is electrically connected a terminal of the second electrical component;
a first holding member having an annular shape and press-fitted and fixed in the communication hole in an upper region in the communication hole; and
a second holding member having an annular shape press-fitted and fixed to an outer peripheral surface of the signal pin in a lower region in the communication hole; and
the method comprising:
a first step of preparing the upper plate, and press-fitting and fixing the first holding member into the first reduced diameter portion of the first through hole by pushing the first holding member into the first through hole of the upper plate from the lower side of the first through hole;
a second step of inserting the signal pin into the first through hole of the upper plate from the lower side of the first through hole, with the second holding member being press-fitted and fixed in the lower region of the signal pin; and
a third step of connecting the lower plate to the upper plate, and fixing the signal pin via the first holding member and second holding member in the communication hole, with the second holding member being engaged with the second reduced diameter portion, by sandwiching the signal by the upper plate and the lower plate.

2. The method of manufacturing the electrical connection socket according to claim 1 , wherein the signal pin includes:
a pin barrel fixed by the first holding member and the second holding member in the communication hole; and
a first plunger and a second plunger coupled to the pin barrel at an upper end portion and a lower end portion of the pin barrel, respectively, such that the first plunger and the second plunger are slidable in a vertical direction.

3. The method of manufacturing the electrical connection socket according to claim 1 , wherein an upper end surface of the first holding member is flush with the upper surface of the metal housing.

4. The method of manufacturing the electrical connection socket according to claim 1 , wherein each of the first holding member and the second holding member is composed of an insulating elastic member.

5. The method of manufacturing the electrical connection socket according to claim 1 , wherein a characteristic impedance of the signal path formed by the signal pin is lower than a predetermined characteristic impedance serving as a reference in a first region and a second region, and is higher than the predetermined characteristic impedance in a third region and a fourth region adjacent to the first region and the second region, the first region and the second region being regions where the signal pin is held by the first holding member and the second holding member.

6. The method of manufacturing the electrical connection socket according to claim 1 ,
wherein the first electrical component is a circuit board; and
wherein the second electrical component is an IC package.

7. An electrical connection socket manufactured by the method of claim 1 .

Assignees

• Enplas Corp

Inventors

• Koshiishi Kazutaka
• Narumi Keiichi

Classifications

• G01R1/0466

  concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding · CPC title

• G01R1/045 Primary

  Sockets or component fixtures for RF or HF testing · CPC title

• G01R31/2886

  Features relating to contacting the IC under test, e.g. probe heads; chucks (G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06) · CPC title

• H01R12/57

  surface mounting terminals · CPC title

• G01R31/2896

  Testing of IC packages; Test features related to IC packages (containers per se H10W76/10, encapsulations per se H10W74/00) · CPC title