Injection molding apparatus and injection molding method

Patent metadata

Field	Value
Publication number	US-11155014-B2
Application number	US-201916516349-A
Country	US
Kind code	B2
Filing date	Jul 19, 2019
Priority date	Jul 20, 2018
Publication date	Oct 26, 2021
Grant date	Oct 26, 2021

Abstract

An injection molding apparatus includes an injection-molding mold including a fixed mold and a movable mold, the fixed mold having a gate opening into which a molding material flows, the movable mold having a cavity and being configured to be separated from the fixed mold during mold opening; a hot runner including a nozzle having a channel that guides the molding material to the gate opening, and a heater, the hot runner being disposed in the fixed mold; and a control unit that controls a temperature of the heater to adjust a temperature of the hot runner. The control unit controls the temperature of the heater to a first temperature when the molding material is injected from the hot runner to the cavity, and after the injection of the molding material is completed, controls the temperature of the heater to a second temperature that is higher than the first temperature.

First claim

What is claimed is:

1. An injection molding apparatus comprising:
an injection-molding mold including a fixed mold and a movable mold, the fixed mold having a gate opening into which a molding material flows, the movable mold having a cavity and being configured to be separated from the fixed mold during mold opening;
a hot runner including a nozzle having a channel that guides the molding material to the gate opening, and a heater, the hot runner being disposed in the fixed mold; and
a control unit that controls a temperature of the heater to adjust a temperature of the hot runner, wherein
the control unit
controls the temperature of the heater to a first temperature when the molding material is injected from the hot runner to the cavity, and
after the injection of the molding material is completed, controls the temperature of the heater to a second temperature that is higher than the first temperature, and

a gap between the nozzle and the gate opening when the temperature of the heater is controlled to the second temperature is narrower than the gap when the temperature of the heater is controlled to the first temperature.

2. The injection molding apparatus according to claim 1 , wherein a thermal expansion coefficient of the nozzle is larger than a thermal expansion coefficient of the fixed mold.

3. The injection molding apparatus according to claim 1 , wherein the control unit, after the injection of the molding material is completed, controls the temperature of the heater to the second temperature such that a tip end portion of the nozzle near the gate opening is located nearer to the cavity than the gate opening.

4. The injection molding apparatus according to claim 1 , wherein the control unit, after the injection of the molding material is completed, controls the temperature of the heater to the second temperature such that a tip end portion of the nozzle near the gate opening closes the gate opening.

5. The injection molding apparatus according to claim 1 , wherein
the heater includes
a first heater that is disposed around the nozzle and that heats the nozzle and
a second heater that is disposed farther from the nozzle than the first heater.

6. The injection molding apparatus according to claim 5 , wherein
the control unit,
when the molding material is injected from the hot runner to the cavity, controls a temperature of the first heater and a temperature of the second heater to the first temperature, and
after the injection of the molding material is completed, controls the temperature of the first heater to the second temperature and controls the temperature of the second heater to the first temperature.

7. The injection molding apparatus according to claim 1 , further comprising:
a material formation unit that has a flat screw configured to rotate and that forms the molding material by melting a material supplied to the flat screw.

Assignees

• Seiko Epson Corp

Inventors

• Anegawa Kenta
• Yamashita Seiichiro
• Yokota Kei
• Inutsuka Mitsuru
• Watanabe Yusuke
• Sasagawa Kakeru
• Sasage Yuichi

Classifications

• B29C45/2737 Primary

  Heating or cooling means therefor (B29C45/7331 takes precedence) · CPC title

• B29C45/53

  using injection ram or piston · CPC title

• B29C2945/76892

  Solidification, setting phase · CPC title

• B29C2945/76535

  derivative, change thereof · CPC title

• B29C45/03 Primary

  Injection moulding apparatus (transfer moulding B29C45/02) · CPC title