Heater, resin molding apparatus, resin molding method and resin molded body

Patent metadata

Field	Value
Publication number	US-10131081-B2
Application number	US-91856909-A
Country	US
Kind code	B2
Filing date	Feb 19, 2009
Priority date	Feb 20, 2008
Publication date	Nov 20, 2018
Grant date	Nov 20, 2018

Abstract

Because it is possible to cool down a column member at a higher speed than natural cooling, throughput can be improved further. Especially, when the tubular body M 42 and the column part M 43 are made of different metals and the column part M 43 is pressed into the tubular body M 42, a distortion will occur in the column member M 42 and M 43 and the top board M 41 fixed to the column member M 42 and M 43 due to the difference in thermal expansion coefficients between them, but the cooling paths P 1 and P 2 can absorb a distortion caused by the difference in thermal expansion coefficients of these metals. In particular, when the top board M 41 is used as a mold for resin molding, it is possible to perform resin molding precisely because distortion caused by the difference in thermal expansion coefficients does not easily occur.

First claim

The invention claimed is:

1. A molding apparatus heater comprising:
a top board made of metal;
a column member made of metal, said top board being fixed to a top end of the column member, the top board being thermally connected to the column member such that heat generated in the column member is conducted to the top board, the column member including a cooling path in its interior, the column member comprising:
a tubular body made of a first metal, and
a core member made of a second metal and provided in the tubular body, the core member extending along an entire length of the tubular body while an outer periphery surface of the core member is in contact with an inner periphery surface of the tubular body, a thermal conductivity of the second metal being higher than a thermal conductivity of the first metal, a thermal conductivity of the top board being higher than the thermal conductivity of the first metal; and

a coil surrounding the tubular body of said column member relative to an axis thereof.

2. The heater according to claim 1 , wherein said cooling path is provided in said core member.

3. The heater according to claim 1 , wherein the thermal conductivity of said first metal is 60 W/mK or less, and wherein the thermal conductivity of said second metal is 70 W/mK or more.

4. A molding apparatus heater comprising:
a top board made of metal and having a first surface and an opposing second surface, the first surface including a recessed pattern configured to receive a resin to be molded;
a column member made of metal, said second surface of the top board being fixed to a top end of the column member, the top board being thermally connected to the column member such that heat generated in the column member is conducted to the top board, the column member including a cooling path in its interior, the column member comprising:
a tubular body made of a first metal, and
a core member made of a second metal and provided in the tubular body, the core member extending along an entire length of the tubular body while an outer periphery surface of the core member is in contact with an inner periphery surface of the tubular body, a thermal conductivity of the second metal being higher than a thermal conductivity of the first metal, a thermal conductivity of the top board being higher than the thermal conductivity of the first metal; and

a coil surrounding the tubular body of said column member relative to an axis thereof.

5. The heater according to claim 4 , wherein said cooling path is provided in said core member.

6. The heater according to claim 4 , wherein the thermal conductivity of said first metal is 60 W/mK or less, and wherein the thermal conductivity of said second metal is 70 W/mK or more.

Assignees

• Maeda Mitsuo
• Matsumi Yasuo
• Sumitomo Chemical Co

Inventors

• Maeda Mitsuo
• Matsumi Yasuo

Classifications

• B29C45/78

  of temperature · CPC title

• B29C33/06

  using radiation {, e.g. electro-magnetic waves, induction heating} · CPC title

• B29C45/7312 Primary

  Construction of heating or cooling fluid flow channels · CPC title

• B29C45/2737

  Heating or cooling means therefor (B29C45/7331 takes precedence) · CPC title

• B29C45/14655

  connected to or mounted on a carrier, e.g. lead frame · CPC title