Actuator cooling apparatus and method

US10005216B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10005216-B2
Application numberUS-201715398340-A
CountryUS
Kind codeB2
Filing dateJan 4, 2017
Priority dateAug 14, 2014
Publication dateJun 26, 2018
Grant dateJun 26, 2018

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

An injection molding apparatus comprising a clamp plate, a heated manifold, an actuator, a mold and a cooling device, wherein the cooling device comprises: a heat transmitter comprising a distal arm or member and a proximal base or member, the distal arm or member being mounted by a spring loadable interconnection or engagement to or with the proximal base or member, the clamp plate, the mold, the manifold, the actuator and the heat transmitter being assemblable together in an arrangement wherein the spring loadable interconnection is loaded urging the distal end surface of the distal arm or member into compressed engagement with the clamp plate.

First claim

Opening claim text (preview).

The invention claimed is: 1. An injection molding apparatus comprising a clamp plate, a heated manifold, an actuator interconnected to a valve pin having an axis A, a mold and a cooling device that cools the actuator wherein, when assembled, the clamp plate is mounted upstream of the mold, the manifold being disposed between the clamp plate and the mold, wherein the cooling device comprises: a heat transmitter comprising a proximal base or member comprised of a heat conductive material and a distal arm or member comprised of a thermally conductive material, the distal arm or member being mounted by one or more spring loadable interconnections on or to the proximal base or member, the distal arm or member having a distal end surface for engaging the clamp plate under a spring load and a proximal surface for transmitting heat from the proximal surface to the distal end surface, the spring or spring loadable interconnection having an amount or degree of mass that renders the spring substantially non-heat conductive between the proximal and distal members, the clamp plate, the mold, the manifold, the actuator including a housing and the heat transmitter being assemblable together in an arrangement wherein the spring loadable interconnection is loaded urging the distal end surface of the distal arm or member into compressed engagement with the clamp plate at least when the manifold is heated to an elevated operating temperature; wherein the area of engagement or contact between the engagement surfaces of the spring loadable interconnection and one or both of complementary surfaces of proximal and distal members is less than about 10 square mm. 2. The apparatus of claim 1 wherein the mass of the spring loadable interconnection is selected to minimize, enable or impart a minimal amount of heat conduction between the proximal and distal arms or members via or through the spring or spring loadable interconnection. 3. The apparatus of claim 1 wherein the spring or spring loadable interconnection has engagement surfaces that engage against complementary opposing engagement surfaces of proximal and distal members having a selected area of engagement that renders the spring substantially non-heat conductive between the proximal and distal arms or members. 4. The apparatus of claim 1 wherein the actuator comprises a housing body that is mounted in thermally conductive contact along the axis A to one or more actuator mounts that are mounted downstream in heat conductive communication with or contact with or on the manifold along the axis A, the housing body having a surface that is spaced laterally from the axis A, the proximal base or member being mounted in heat conductive contact with and to the lateral surface such that the proximal base or member is spaced laterally apart from contact with the one or more actuator mounts. 5. The apparatus of claim 1 wherein the distal member has a proximal exterior surface that is adapted to be engaged and slidable against a complementary surface of the housing body of the actuator such that heat thermally conducts between the housing body and the distal arm or member, the distal end surface of the distal arm or member being movable toward and away from the actuator by sliding movement of the proximal exterior surface of the distal arm or member on the complementary surface of the actuator. 6. The apparatus of claim 4 wherein the lateral surface and the proximal base or member are laterally spaced apart from direct heat conductive communication with the heated manifold. 7. The apparatus of claim 1 further comprising a mount separating the actuator housing from direct contact with the manifold, the mount being cooled and having an upstream mounting surface in thermally conductive communication with a complementary mounting surface of the actuator and a downstream mounting surface in thermally conductive communication with the manifold. 8. The apparatus of claim 1 wherein the distal arm or member is attached to the actuator such that the arm is disposed in slidable thermally conductive contact with a lateral surface of the housing body. 9. The apparatus of claim 1 wherein the distal arm or member comprises a rod slidably disposed within a complementary bore disposed within the housing body of the actuator, the complementary bore and the rod being configured such that an exterior surface of the rod is slidably engaged in thermally conductive contact against an interior surface of the complementary bore. 10. A method of cooling the actuator of the apparatus according to claim 1 comprising assembling the clamp plate, the mold, the manifold, the actuator and the cooling device of the apparatus of claim 1 such that the spring loadable interconnection is loaded urging the distal end surface of the distal arm or member into compressed engagement with the clamp plate at least upon heating the manifold to an elevated operating temperature. 11. An injection molding apparatus comprising a clamp plate, a heated manifold, an actuator interconnected to a valve pin having an axis A, a mold and a cooling device that cools the actuator wherein, when assembled, the clamp plate is mounted upstream of the mold, the manifold being disposed between the clamp plate and the mold, wherein the cooling device comprises: a heat transmitter comprising a proximal base or member comprised of a heat conductive material and a distal arm or member comprised of a thermally conductive material, the distal arm or member being mounted by one or more spring loadable interconnections on or to the proximal base or member, the distal arm or member having a distal end surface for engaging the clamp plate under a spring load and a proximal surface for transmitting heat from the proximal surface to the distal end surface, the spring or spring loadable interconnection having engagement surfaces that engage against complementary opposing engagement surfaces of proximal and distal members forming a selected area of engagement that renders the spring substantially non-heat conductive between the proximal and distal arms or members, the clamp plate, the mold, the manifold, the actuator including a housing and the heat transmitter being assemblable together in an arrangement wherein the spring loadable interconnection is loaded urging the distal end surface of the distal arm or member into compressed engagement with the clamp plate at least when the manifold is heated to an elevated operating temperature; wherein the area of engagement or contact between the engagement surfaces of the spring loadable interconnection and one or both of complementary surfaces of proximal and distal members is less than about 10 square mm. 12. The apparatus of claim 11 wherein the spring or spring loadable interconnection has an amount or degree of mass that renders the spring substantially non-heat conductive between the proximal and distal members. 13. The apparatus of claim 11 wherein the area of engagement or contact between the engagement surfaces of the spring loadable interconnection and one or both of complementary surfaces of proximal and distal members minimizes, enables or imparts a minimal amount of heat conduction between members and via or through the spring or spring loadable interconnection. 14. The apparatus of claim 11 wherein the actuator comprises a housing body that is mounted in thermally conductive contact along the axis A to one or more actuator mounts that are mounted downstream in heat conductive communication with or contact with or on the manifold along the axis A, the housing body having a surface that is spaced laterally from the axis A, the proxi

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What does patent US10005216B2 cover?
An injection molding apparatus comprising a clamp plate, a heated manifold, an actuator, a mold and a cooling device, wherein the cooling device comprises: a heat transmitter comprising a distal arm or member and a proximal base or member, the distal arm or member being mounted by a spring loadable interconnection or engagement to or with the proximal base or member, the clamp plat…
Who is the assignee on this patent?
Synventive Molding Solutions Inc
What technology area does this patent fall under?
Primary CPC classification B29C45/74. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 26 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).