Plasma reactor with electrode array in ceiling

Patent metadata

Field	Value
Publication number	US-11114284-B2
Application number	US-201715630658-A
Country	US
Kind code	B2
Filing date	Jun 22, 2017
Priority date	Jun 22, 2017
Publication date	Sep 7, 2021
Grant date	Sep 7, 2021

Abstract

A plasma reactor includes a chamber body having an interior space that provides a plasma chamber, a gas distributor to deliver a processing gas to the plasma chamber, a workpiece support to hold a workpiece, an electrode assembly comprising a plurality of conductors spaced apart from and extending laterally across the workpiece support in a parallel coplanar array, a first RF power source to supply a first RF power to the electrode assembly, and a dielectric bottom plate between the electrode assembly and the workpiece support, the dielectric bottom plate providing an RF window between the electrode assembly and the plasma chamber.

First claim

What is claimed is:

1. A plasma reactor comprising:
a chamber body having an interior space that provides a plasma chamber;
a gas distributor to deliver a processing gas to the plasma chamber;
a workpiece support to hold a workpiece;
an electrode assembly comprising a plurality of conductors extending laterally in parallel across at least a region spanning an expected position of the workpiece on the workpiece support in a coplanar array;
a RF power source to supply a first RF power to the electrode assembly;
a dielectric bottom plate between the electrode assembly and the workpiece support, the dielectric bottom plate providing an RF window between the electrode assembly and the plasma chamber;
a dielectric top plate having a lower surface with a plurality of parallel grooves; and
a plurality of filaments in the plurality of grooves between the dielectric top plate and the RF window, each filament comprising a single conductor from the plurality of conductors and a non-metallic shell surrounding the single conductor and positioned between the dielectric top plate and the RF window, wherein the shell forms a conduit and the single conductor extends through the conduit as a solid wire and is suspended in the conduit with a gap surrounding and separating the single conductor from the shell such that the single conductor is spaced apart from an inner floor of the shell.

2. The plasma reactor of claim 1 , wherein the dielectric top plate is a ceramic body and the dielectric bottom plate is quartz or silicon nitride.

3. The plasma reactor of claim 1 , wherein the plurality of conductors are uniformly spaced apart.

4. The plasma reactor of claim 1 , wherein a spacing between the workpiece support and the plurality of conductors is 2 mm to 50 cm.

5. The plasma reactor of claim 1 , wherein the plurality of conductors includes a first multiplicity of conductors and a second multiplicity of conductors arranged in an alternating pattern with the first multiplicity of conductors, and the RF power source is configured to apply a first RF input signal to the first multiplicity of conductors, and to apply a second RF input signal to the second multiplicity of conductors.

6. The plasma reactor of claim 5 , wherein the RF power source is configured to generate the first RF input signal and the second RF input signal with same frequency.

7. The plasma reactor of claim 6 , wherein the RF power source is configured to generate the first RF input signal and the second RF input signal such that a phase difference between the first RF input signal and the second RF input signal is 180°.

8. The plasma reactor of claim 6 , wherein the RF power source is configured to provide an adjustable phase difference between the first RF input signal and the second RF input signal.

9. The plasma reactor of claim 5 , wherein the plurality of conductors have a plurality of first ends at a first side of the plasma chamber and a plurality of second ends at an opposite second side of the plasma chamber.

10. The plasma reactor of claim 9 , wherein the RF power source is configured to apply the first RF input signal to the first ends of the first multiplicity of conductors and to apply the second RF input signal to the second ends of the second multiplicity of conductors.

11. The plasma reactor of claim 10 , wherein second ends of the first multiplicity of conductors are floating and first ends of the second multiplicity of conductors are floating.

12. The plasma reactor of claim 10 , wherein the first ends of the first multiplicity of conductors are connected to a first common bus, and the second ends of the second multiplicity of conductors are connected to a second common bus.

13. The plasma reactor of claim 10 , wherein the second ends of the first multiplicity of conductors are grounded and the first ends of the second multiplicity of conductors are grounded.

14. The plasma reactor of claim 13 , wherein the first ends of the first multiplicity of conductors are connected to a first common bus located outside the plasma chamber on the first side of the chamber, the second ends of the second multiplicity of conductors are connected to a second common bus located outside the plasma chamber on the second side of the chamber, the second ends of the first multiplicity of conductors are connected to a third common bus located outside the plasma chamber on the second side of the chamber, and the first ends of the second multiplicity of conductors are connected to a fourth common bus located outside the plasma chamber on the first side of the chamber.

15. The plasma reactor of claim 1 , wherein the shell is cylindrical and plurality of grooves have straight side-walls.

16. The plasma reactor of claim 1 , wherein a bottom of the shell is flush with the lower surface.

17. The plasma reactor of claim 1 , wherein the shell is an oxide.

18. The plasma reactor of claim 2 , wherein the shell is silicon, silicon oxide, silicon carbide, or aluminum oxide.

Assignees

• Applied Materials Inc

Inventors

• Collins Kenneth S
• Rice Michael R
• Ramaswamy Kartik
• Carducci James D
• Rauf Shahid
• Bera Kallol

Classifications

• C23C16/45536

  Use of plasma, radiation or electromagnetic fields · CPC title

• H01J37/32091

  the radio frequency energy being capacitively coupled to the plasma · CPC title

• C23C16/4584

  the substrate being rotated · CPC title

• C23C16/509

  using internal electrodes · CPC title

• H01J37/32541

  Shape · CPC title