Micro electromechanical systems (MEMS)inertial sensor

Patent metadata

Field	Value
Publication number	US-11111132-B2
Application number	US-201715782937-A
Country	US
Kind code	B2
Filing date	Oct 13, 2017
Priority date	Oct 25, 2016
Publication date	Sep 7, 2021
Grant date	Sep 7, 2021

Abstract

An micro electro mechanical sensor comprising: a substrate; and a sensor element movably mounted to a first side of said substrate; wherein a second side of said substrate has a pattern formed in relief thereon. The pattern formed in relief on the second side of the substrate provides a reduced surface area for contact with the die bond layer. The reduced surface area reduces the amount of stress that is transmitted from the die bond layer to the substrate (and hence reduces the amount of transmitted stress reaching the MEMS sensor element). Because the substrate relief pattern provides a certain amount of stress decoupling, the die bond layer does not need to decouple the stress to the same extent as in previous designs. Therefore a thinner die bond layer can be used, which in turn allows the whole package to be slightly thinner.

First claim

The invention claimed is:

1. A micro electromechanical systems (MEMS) sensor that is an accelerometer or a gyroscope comprising:
a substrate; and
a sensor element movably mounted to a first side of said substrate;
wherein a second side of said substrate has a pattern formed in relief thereon; and
wherein the sensor element has a rotational symmetry and wherein the pattern has a rotational symmetry that substantially corresponds to the symmetry of the sensor element to minimize the effect of stress transfer on the sensor operation; and
wherein the pattern comprises a set of radially oriented ribs.

2. A sensor as claimed in claim 1 , wherein the pattern has a 4-fold or 8-fold symmetry.

3. A sensor as claimed in claim 1 , wherein the ribs are arranged in a circle at equal angular intervals.

4. A sensor as claimed in claim 3 , wherein the ribs comprise a first set of ribs and a second set of ribs, the ribs of the first set being longer than the ribs of the second set.

5. A sensor as claimed in claim 4 , wherein the sensor has a rectangular shape and wherein the ribs of the first set extend closer to the diagonals of the rectangle than the ribs of the second set.

6. A sensor as claimed in claim 1 , wherein the substrate is formed from glass and the sensor element is formed from silicon.

7. A sensor as claimed in claim 6 , wherein the pattern is formed by powder blasting or wet etching.

8. A sensor as claimed in claim 1 , wherein the substrate is formed from silicon and the sensor element is formed from silicon.

9. A packaged sensor comprising:
a package;
a die bond layer adhered to the package; and
a sensor that is an accelerometer or a gyroscope and that includes:
a substrate; and
a sensor element movably mounted to a first side of said substrate;
wherein a second side of said substrate has a pattern formed in relief thereon with the pattern of its second surface adhered to the die bond layer; and
wherein the sensor element has a rotational symmetry;

wherein the pattern has a rotational symmetry that substantially corresponds to the rotational symmetry of the sensor element to minimize the effect of stress transfer on the sensor operation; and
wherein the pattern comprises a set of radially oriented ribs.

10. An micro electromechanical systems (MEMS) sensor system comprising:
a package;
a sensor that is an accelerometer or a gyroscope and that includes:
a substrate; and
a sensor element movably mounted to a first side of said substrate;

wherein a second side of said substrate has a pattern formed in relief thereon;
wherein the sensor element has a rotational symmetry;
wherein the pattern minimizes effects of stress transfer on the sensor operation by having a rotational symmetry that substantially corresponds to the rotational symmetry of the sensor element; and
wherein the pattern comprises a set of radially oriented ribs.

Assignees

• Atlantic Inertial Systems Ltd

Inventors

• Durston Michael
• Townsend Kevin

Classifications

• B81C2203/032

  Gluing · CPC title

• B81B2201/0242

  Gyroscopes · CPC title

• B81B2201/0235

  Accelerometers · CPC title

• B81B7/0048 Primary

  between the MEMS die and the substrate · CPC title

• B81B7/02 Primary

  containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence) · CPC title