Sensor unit including a decoupling structure and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-9926188-B2
Application number	US-201515119917-A
Country	US
Kind code	B2
Filing date	Feb 5, 2015
Priority date	Feb 18, 2014
Publication date	Mar 27, 2018
Grant date	Mar 27, 2018

Abstract

A sensor unit including a first semiconductor component and a second semiconductor component, the first semiconductor component including a first substrate and a sensor structure. The second semiconductor component includes a second substrate, the first and second semiconductor components being connected to each other with the aid of a wafer connection, the sensor unit having a decoupling structure, which is configured in such a way that the sensor structure is decoupled thermally and/or mechanically from the second semiconductor component.

First claim

What is claimed is:

1. A sensor unit, comprising:
a first semiconductor component, the first semiconductor component having a first substrate and a sensor structure; and
a second semiconductor component having a second substrate, the first and second semiconductor components being connected to each other via a wafer connection;
wherein the sensor unit includes a decoupling structure, which is configured so that the sensor structure is thermomechanically and/or mechanically decoupled from the second semiconductor component, and
wherein the decoupling structure includes at least one diaphragm element, which spans a cavity in a layer structure of the first semiconductor component and is formed in the area over the wafer connection.

2. The sensor unit of claim 1 , wherein the decoupling structure has a trench structure, the trench structure extending along a normal direction perpendicular to the main extension plane of the first substrate, into the first substrate or all the way through the first substrate.

3. The sensor unit of claim 1 , wherein the decoupling structure includes coupling elements for coupling the sensor structure to a mainland structure of the first substrate.

4. The sensor unit of claim 1 , wherein the trench structure extends mainly parallel to the main extension plane of the first substrate, the trench structure surrounding the sensor structure.

5. The sensor unit of claim 4 , wherein the cavity underneath the at least one diaphragm element is closed or has at least one pressure equalization opening.

6. The sensor unit of claim 3 , wherein the sensor structure has a structure element surrounded by a first substrate and a sensor element surrounded by a function layer of the first semiconductor component, the sensor element being connected to the first substrate exclusively indirectly via the coupling elements.

7. The sensor unit of claim 1 , wherein the sensor unit includes a cavity and/or a separate further cavity, the cavity and/or the further cavity being situated between the first and second semiconductor components, the wafer connection having a bond frame structure surrounding the cavity and/or the further cavity, the bond frame structure being configured so that the cavity and/or the separate further cavity is/are hermetically sealable or sealed.

8. The sensor unit of claim 1 , wherein the sensor structure is a pressure sensor structure, a pressure sensor channel being situated in the first substrate, the pressure sensor channel extending into the sensor unit to a diaphragm of the pressure sensor structure.

9. The sensor unit of claim 1 , wherein the sensor unit has a via formed in the first substrate for electrically contacting the sensor element of the sensor structure.

10. The sensor unit of claim 1 , wherein the decoupling structure is a trench structure filled with a filling material, the filling material being a polymer material in particular, the filling material having an elasticity modulus that is at least one order of magnitude smaller than a substrate material.

11. A method for making a sensor unit, the method comprising:
providing a first semiconductor component including a first substrate and a sensor structure;
providing a second semiconductor component including a second substrate;
connecting the first and second semiconductor components to each other via a wafer connection to a sensor system;
forming a decoupling structure for thermomechanical and/or mechanical decoupling of the sensor structure from the second semiconductor component;
wherein the decoupling structure includes at least one diaphragm element, which spans a cavity in a layer structure of the first semiconductor component and is formed in the area over the wafer connection.

12. The method of claim 11 , wherein in the forming, at least one of the decoupling structure, a pressure sensor channel, a via hole, a ventilation duct, and an insulation structure, are structured with the aid of a laser beam.

13. The method of claim 12 , wherein in the forming, at least one of the decoupling structure, the pressure sensor channel, the via hole, the ventilation duct, and the insulation structure, are formed simultaneously in the first semiconductor component.

14. The method of claim 11 , wherein in the forming, at least one of the decoupling structure, a pressure sensor channel, a via hole, a ventilation duct, and an insulation structure, are structured in particular in the first semiconductor component, in particular, in the first substrate with the aid of time-controlled etching, in particular, reactive ion deep etching, and/or with the aid of a laser beam.

15. The method of claim 12 , wherein in the forming, at least one of the decoupling structure, the pressure sensor channel, the via hole, the ventilation duct, and the insulation structure, are formed simultaneously in the first semiconductor component, in particular, in the first substrate.

16. The sensor unit of claim 1 , wherein the decoupling structure has a trench structure, the trench structure extending along a normal direction perpendicular to the main extension plane of the first substrate, into the first substrate or all the way through the first substrate.

17. The sensor unit of claim 1 , wherein the trench structure extends mainly parallel to the main extension plane of the first substrate, the trench structure surrounding the sensor structure, in particular, the trench structure being meander-shaped or frame-shaped, in particular, ring-shaped.

18. The sensor unit of claim 1 , wherein the sensor structure has a structure element surrounded by a first substrate and a sensor element surrounded by a function layer of the first semiconductor component, the sensor element being connected to the first substrate exclusively indirectly via coupling elements, the coupling elements being formed from the first substrate and/or from the function layer.

19. The sensor unit of claim 1 , wherein the sensor unit includes a cavity and/or a separate further cavity, the cavity and/or the further cavity being situated between the first and second semiconductor components, the wafer connection having a bond frame structure surrounding the cavity and/or the further cavity, the bond frame structure being configured so that the cavity and/or the separate further cavity is/are hermetically sealable or sealed, in particular, a ventilation duct extending through the first substrate to the cavity or the further cavity.

20. The sensor unit of claim 1 , wherein the sensor unit has a via formed in the first substrate, in particular, a silicon via, for electrically contacting the sensor element of the sensor structure.

21. The sensor unit of claim 1 , wherein the decoupling structure is a trench structure filled with a filling material, the filling material being a polymer material in particular, the filling material having an elasticity modulus that is at least one order of magnitude smaller than a substrate material, in particular, silicon material of the first substrate.

22. The sensor unit of claim 1 , wherein the at least one diaphragm element is made of porous silicon (porSi).

23. The method of claim 11 , wherein the at least one diaphragm element is made of porous silicon (porSi).

24. The sensor unit of claim 1 , wherein the at least one diaphragm element is formed in the first substrate.

25. The method of claim 11 , wherein the at least one diaphragm element is formed in the first substrat

Assignees

• Bosch Gmbh Robert

Inventors

• Classen Johannes
• Kramer Torsten
• Benzel Hubert
• Frey Jens
• Meisel Daniel Christoph
• Schelling Christoph

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• B81B2203/0127

  Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function · CPC title

• B81C2201/019

  Bonding or gluing multiple substrate layers · CPC title

• B81B7/0048 Primary

  between the MEMS die and the substrate · CPC title

• B81C2201/0132

  Dry etching, i.e. plasma etching, barrel etching, reactive ion etching [RIE], sputter etching or ion milling · CPC title