Display panel and method of fabricating the same
US-2019115407-A1 · Apr 18, 2019 · US
US11107844B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11107844-B2 |
| Application number | US-201815993198-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 30, 2018 |
| Priority date | Dec 22, 2017 |
| Publication date | Aug 31, 2021 |
| Grant date | Aug 31, 2021 |
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A display device can include a first thin film transistor including a first active layer including a first semiconductor material, a first gate electrode overlapping with the first active layer, and a first source electrode and a first drain electrode both electrically connected to the first active layer; a separation insulating layer disposed on the first thin film transistor; and a second thin film transistor disposed on the separation insulating layer and including: a second active layer including a second semiconductor material different from the first semiconductor material, a second gate electrode overlapping with the second active layer, and a second source electrode and a second drain electrode both electrically connected to the second active layer, in which the second active layer of the second thin film transistor has a first thickness and a second thickness greater than the first thickness.
Opening claim text (preview).
What is claimed is: 1. A display device, comprising: an emission element including a first electrode, an emission layer on the first electrode, and a second electrode on the emission layer; a first thin film transistor including: a first active layer including a first semiconductor material, a first gate electrode overlapping with the first active layer, and a first source electrode and a first drain electrode both electrically connected to the first active layer; a separation insulating layer disposed on the first thin film transistor; a second thin film transistor disposed on the separation insulating layer and including: a second active layer including a second semiconductor material different from the first semiconductor material, a second gate electrode overlapping with the second active layer, and a second source electrode and a second drain electrode both electrically connected to the second active layer; a first interlayer insulating layer disposed on a lower surface of the separation insulating layer; a second interlayer insulating layer disposed on an upper surface of the separation insulating layer; a connecting electrode disposed under the first electrode to overlap with the first electrode, the connecting electrode being connected to the first drain electrode of the first thin film transistor and the second source electrode of the second thin film transistor; a passivation layer disposed on the second interlayer insulating layer to cover the second source electrode, the second drain electrode and the connecting electrode; an auxiliary electrode being in direct contact with the second drain electrode of the second thin film transistor through a contact hole penetrating the passivation layer and the auxiliary electrode electrically connecting the second thin film transistor with the first electrode; and a planarization layer disposed on the auxiliary electrode and the passivation layer, wherein the connecting electrode and the auxiliary electrode are disposed on upper surfaces of different layers, wherein the second active layer of the second thin film transistor has a first thickness and a second thickness greater than the first thickness, and wherein portions of the second active layer in direct contact with the second source and drain electrodes have the second thickness. 2. The display device according to claim 1 , wherein the separation insulating layer is disposed between the first thin film transistor and the second thin film transistor. 3. The display device according to claim 1 , wherein an area of the second active layer overlapped with the second gate electrode has the first thickness and an area not overlapped with the second gate electrode has the second thickness. 4. The display device according to claim 3 , further comprising: contact holes penetrating the second interlayer insulating layer and overlapping with the area not overlapped with the second gate electrode having the second thickness, wherein the second thickness of the second active layer protects the second active layer from damage during formation of the contact holes penetrating the second interlayer insulating layer. 5. The display device according to claim 1 , wherein an area of the second active layer overlapped with the second gate electrode is a single layer, and an area of the second active layer not overlapped with the second gate electrode is a plurality of layers. 6. The display device according to claim 5 , wherein the single layer of the area of the second active layer overlapped with the second gate electrode includes the second semiconductor material different than the first semiconductor material, and wherein the plurality of layers of the area of the second active layer not overlapped with the second gate electrode include a lower layer including the second semiconductor material and an upper layer disposed on the lower layer and including a different material than the lower layer. 7. The display device according to claim 6 , wherein the upper layer of the second active layer includes a metal material, and wherein the metal material is any one of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd) and alloys thereof. 8. The display device according to claim 1 , wherein the first semiconductor material in the first thin film transistor is a low temperature poly-silicon (LTPS) and the second semiconductor material in the second thin film transistor is an oxide semiconductor material. 9. A display device, comprising: an emission element including a first electrode, an emission layer on the first electrode, and a second electrode on the emission layer; a first thin film transistor including: a first active layer including a first channel region, a first source region and a first drain region, and the first active layer is formed of a first semiconductor material, a first gate electrode overlapping with the first active layer, and a first source electrode and a first drain electrode both electrically connected to the first active layer; a second thin film transistor including: a second source region formed as a plurality of layers and a second drain region formed as a plurality of layers, a second active layer including a second channel region formed as a single layer, the second active layer is formed of a second semiconductor material different from the first semiconductor material, and the second active layer is electrically connected to the second source region and the second drain region, a second gate electrode overlapped with the second channel region of the second active layer, and a second source electrode and a second drain electrode connected to the second source region and the second drain region of the second active layer, respectively; a separation insulating layer disposed between the first thin film transistor and the second thin film transistor; a first interlayer insulating layer disposed on a lower surface of the separation insulating layer; a second interlayer insulating layer disposed on an upper surface of the separation insulating layer; a connecting electrode disposed under the first electrode to overlap with the first electrode, the connecting electrode being connected to the first drain electrode of the first thin film transistor and the second source electrode of the second thin film transistor; a passivation layer disposed on the second interlayer insulating layer to cover the second source electrode, the second drain electrode and the connecting electrode; an auxiliary electrode being in direct contact with the second drain electrode of the second thin film transistor through a contact hole penetrating the passivation layer and the auxiliary electrode electrically connecting the second thin film transistor with the first electrode; and a planarization layer disposed on the auxiliary electrode and the passivation layer, wherein the connecting electrode and the auxiliary electrode are disposed on upper surfaces of different layers. 10. The display device according to claim 9 , wherein the second source region includes a second source region lower layer and a second source region upper layer disposed on the second source region lower layer, and wherein the second drain region includes a second drain region lower layer and a second drain region upper layer disposed on the second drain region lower layer. 11. The display device according to claim 10 , wherein the second source region lower layer and the second drain region lower layer are formed of the same material as the second channel region. 12. The display device according to cla
Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title
of inorganic materials · CPC title
the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz · CPC title
the material being a silicon oxide, e.g. SiO2 · CPC title
in the presence of a plasma [PECVD] · CPC title
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