Active matrix substrate and liquid crystal display device
US-2024377690-A1 · Nov 14, 2024 · US
US2016284733A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016284733-A1 |
| Application number | US-201514925644-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 28, 2015 |
| Priority date | Mar 27, 2015 |
| Publication date | Sep 29, 2016 |
| Grant date | — |
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A method of manufacturing a display apparatus includes: preparing a substrate including a pixel circuit region and a driving circuit region; forming a first active layer at the pixel circuit region; forming a second active layer at the driving circuit region; forming gate electrodes that overlap the first active layer and the second active layer, respectively, with a gate insulating layer disposed therebetween; forming a first insulating layer covering the first and second active layers; forming a first contact hole that passes through the first insulating layer until a portion of the first active layer is exposed; heat-treating the substrate where the first insulating layer, in which the first contact hole is formed, is formed; and forming a second contact hole that passes through the first insulating layer disposed on the heat-treated substrate until a portion of the second active layer is exposed.
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1 . A method of manufacturing a display apparatus, the method comprising the steps of: preparing a substrate including a pixel circuit region and a driving circuit region; forming a first active layer at the pixel circuit region of the substrate; forming a second active layer at the driving circuit region of the substrate; forming gate electrodes that overlap the first active layer and the second active layer, respectively, with a gate insulating layer disposed therebetween; forming a first insulating layer on the substrate so as to cover the first active layer and the second active layer; forming a first contact hole that passes through the first insulating layer until a portion of the first active layer, among the first active layer and the second active layer, is exposed; heat-treating the substrate where the first insulating layer, having the first contact hole passing through it, is formed; and forming a second contact hole that passes through the first insulating layer disposed on the heat-treated substrate until a portion of the second active layer is exposed. 2 . The method of claim 1 , wherein the first active layer and the second active layer are formed during a same mask process, and comprise a same material. 3 . The method of claim 1 , wherein a hydrogen concentration of the first active layer that is adjacent to the first contact hole is less than a hydrogen concentration of the second active layer that is adjacent to the second contact hole. 4 . The method of claim 1 , wherein a hydrogen concentration of a first part of the first insulating layer that is adjacent to the first contact hole is less than a hydrogen concentration of a second part of the first insulating layer that is adjacent to the second contact hole. 5 . The method of claim 1 , wherein: the gate insulating layer is disposed between the first and second active layers and the first insulating layer; and each of the first contact hole and the second contact hole passes through the gate insulating layer and the first insulating layer. 6 . The method of claim 5 , wherein a hydrogen concentration of a first part of the gate insulating layer that is adjacent to the first contact hole is less than a hydrogen concentration of a second part of the gate insulating layer that is adjacent to the second contact hole. 7 . The method of claim 1 , further comprising the step of doping the first active layer and the second active layer with same impurities. 8 . A display apparatus, comprising: a substrate including a pixel circuit region and a driving circuit region; a first thin film transistor disposed in the pixel circuit region of the substrate and comprising a first active layer, a first gate electrode, a first source electrode, and a first drain s electrode; a display device connected to one of the first source electrode and the first drain electrode; a second thin film transistor disposed in the driving circuit region of the substrate and comprising a second active layer, a second gate electrode, a second source electrode, and a second drain electrode; and a first insulating layer covering the first active layer and the second active layer; wherein the first insulating layer includes a first contact hole that exposes a portion of the first active layer, and a second contact hole that exposes a portion of the second active layer; and wherein the first active layer and the second active layer comprise a same material, and a hydrogen concentration of a first part of the first active layer that is adjacent to the first contact hole is less than a hydrogen concentration of a second part of the second active layer that is adjacent to the second contact hole. 9 . The apparatus of claim 8 , wherein a hydrogen concentration of a first part of the first insulating layer that is adjacent to the first contact hole is less than a hydrogen concentration of a second part of the first insulating layer that is adjacent to the second contact hole. 10 . The apparatus of claim 8 , further comprising: a gate insulating layer disposed between the first and second active layers and the first insulating layer; wherein each of the first contact hole and the second contact hole passes through the gate insulating layer and the first insulating layer. 11 . The apparatus of claim 10 , wherein a hydrogen concentration of a first part of the gate insulating layer that is adjacent to the first contact hole is less than a hydrogen concentration of a second part of the gate insulating layer that is adjacent to the second contact hole. 12 . The apparatus of claim 8 , wherein: the first active layer includes a source region and a drain region doped with first impurities, the second active layer includes a source region and a drain region doped with second impurities, and the first impurities are of same materials as the second impurities. 13 . The apparatus of claim 8 , further comprising the first active layer and the second active layer doped with the same impurities.
integrated with passive devices, e.g. auxiliary capacitors · CPC title
characterised by the compositions or shapes of the interlayer dielectrics · CPC title
using masks, e.g. half-tone masks · CPC title
comprising crystallisation of amorphous, microcrystalline or polycrystalline semiconductor materials · CPC title
Amorphous silicon · CPC title
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