Semiconductor device with partial EMI shielding and method of making the same

Patent metadata

Field	Value
Publication number	US-11088082-B2
Application number	US-201816116485-A
Country	US
Kind code	B2
Filing date	Aug 29, 2018
Priority date	Aug 29, 2018
Publication date	Aug 10, 2021
Grant date	Aug 10, 2021

Abstract

A semiconductor device has a substrate. A lid is disposed over the substrate. An encapsulant is deposited over the substrate. A film mask is disposed over the encapsulant with the lid exposed from the film mask and encapsulant. A conductive layer is formed over the film mask, encapsulant, and lid. The film mask is removed after forming the conductive layer.

First claim

What is claimed:

1. A method of making a semiconductor device, comprising:
providing a substrate;
disposing an electromagnetic interference (EMI) shield over the substrate to surround a component disposed over the substrate;
depositing an encapsulant over the substrate;
disposing a film mask over the encapsulant, wherein the film mask extends over a plurality of system-in-package (SiP) devices formed on the substrate;
forming an opening in the film mask over the EMI shield and component, wherein the EMI shield is exposed from the film mask and encapsulant;
singulating the plurality of SiP devices after disposing the film mask over the encapsulant;
forming a conductive layer over the film mask, encapsulant, and EMI shield after singulating the substrate; and
removing the film mask after forming the conductive layer.

2. The method of claim 1 , further including applying the film mask with a jig.

3. The method of claim 1 , wherein singulating the substrate and encapsulant also cuts the film mask into a plurality of portions.

4. The method of claim 1 , wherein the film mask completely surrounds the opening after singulating the substrate and encapsulant.

5. A method of making a semiconductor device, comprising:
providing a substrate;
depositing an encapsulant over the substrate;
forming a trench in the encapsulant, wherein the trench exposes the substrate from the encapsulant;
depositing a conductive material into the trench to form an electromagnetic interference (EMI) shield;
disposing a film mask over the encapsulant;
forming a conductive layer over the film mask, encapsulant, and EMI shield, wherein the conductive layer extends over a top surface and a side surface of the encapsulant; and
removing the film mask after forming the conductive layer.

6. The method of claim 5 , further including disposing the film mask on a side surface of the encapsulant.

7. The method of claim 5 , further including disposing the film mask over the encapsulant with the EMI shield exposed from the encapsulant and film mask.

8. The method of claim 5 , wherein the film mask includes an opening over the encapsulant.

9. The method of claim 5 , further including singulating the substrate and encapsulant into a plurality of system-in-package (SiP) devices after disposing the film mask over the encapsulant and before forming the conductive layer.

10. The method of claim 5 , further including singulating the substrate and encapsulant into a plurality of system-in-package (SiP) devices prior to disposing the film mask over the encapsulant and prior to forming the conductive layer.

11. The method of claim 10 , further including:
disposing the plurality of SiP devices on a carrier with a gap between each pair of adjacent SiP devices; and
disposing the film mask extending to each of the SiP devices.

12. A method of making a semiconductor device, comprising:
providing a first SiP device;
providing a second SiP device;
singulating the first SiP device and second SiP device;
disposing a film mask over the first SiP device and second SiP device after singulating;
forming a conductive layer over the film mask, wherein the conductive layer extends over a side surface of the first SiP device; and
removing the film mask.

13. The method of claim 12 , further including disposing the film mask using a jig.

14. The method of claim 12 , further including forming an electromagnetic interference (EMI) shield in the first SiP device.

15. The method of claim 12 , further including cutting the film mask after disposing the film mask over the first SiP device and second SiP device.

16. The method of claim 12 , further including:
disposing the first SiP device and second SiP device on a carrier with a gap between the first SiP device and second SiP device; and
disposing the film mask to span the gap.

17. The method of claim 12 , further including a third SiP device singulated from the first SiP device and second SiP device, wherein the film mask extends continuously from the first SiP device to the second SiP device and third SiP device.

18. A method of making a semiconductor device, comprising:
providing a substrate;
disposing an electromagnetic interference (EMI) shield over the substrate;
depositing an encapsulant over the substrate and around the EMI shield;
disposing a film mask over the encapsulant; and
forming a conductive layer over the EMI shield, film mask, and a first portion of a top surface of the encapsulant, wherein the conductive layer extends over a side surface of the encapsulant and the film mask is disposed between the conductive layer and encapsulant.

19. The method of claim 18 , further including forming the conductive layer in contact with a top surface and a side surface of the EMI shield.

20. The method of claim 18 , wherein a second portion of the top surface of the encapsulant is devoid of the conductive layer.

21. The method of claim 18 , wherein the EMI shield surrounds a component disposed on the substrate.

22. The method of claim 18 , further including singulating the substrate and encapsulant into a plurality of system-in-package (SiP) devices after disposing the film mask over the encapsulant and before forming the conductive layer.

23. The method of claim 22 , further including forming an opening in the film mask over each of the SiP devices.

Assignees

• Stats Chippac Pte Ltd

Inventors

• Kim Changoh
• Park Kyounghee
• Koo Kyowang
• Cho Sungwon

Classifications

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W76/12

  characterised by their shape · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/01

  Manufacture or treatment · CPC title