System and method for attaching solder balls and posts in antenna areas

Patent metadata

Field	Value
Publication number	US-2016006133-A1
Application number	US-201514754823-A
Country	US
Kind code	A1
Filing date	Jun 30, 2015
Priority date	Jul 1, 2014
Publication date	Jan 7, 2016
Grant date	—

Abstract

Aspects of the present disclosure provide an apparatus for wireless communications. The apparatus generally includes a printed circuit board (PCB) and a plurality of antenna elements. Each of the plurality of antenna elements is mechanically attached to a perimeter of the PCB via one or more solder elements. Each of the solder elements are spaced apart from each other and electrically isolated from each other in a vicinity of the antenna elements.

First claim

What is claimed is:

1 . An apparatus for wireless communication, comprising:
a printed circuit board (PCB); and a plurality of antenna elements, each mechanically attached to a perimeter of the PCB via one or more solder elements, wherein the solder elements are spaced apart and electrically isolated from each other in a vicinity of the antenna elements.

2 . The apparatus of claim 1 , wherein the solder elements are electrically isolated from the antenna elements.

3 . The apparatus of claim 1 , wherein the one or more solder elements form a frame around the perimeter of the PCB.

4 . The apparatus of claim 1 , wherein the plurality of antenna elements are evenly spaced along the perimeter of the PCB.

5 . The apparatus of claim 1 , wherein the plurality of antenna elements are configured to form a radiation pattern that radiates outward from the perimeter of the PCB.

6 . The apparatus of claim 1 , wherein the plurality of antenna elements comprises a plurality of antenna elements packaged in a single unit.

7 . A method, comprising:
positioning a plurality of antenna elements relative to a printed circuit board (PCB); and attaching the antenna elements to the PCB using one or more solder elements, wherein the solder elements are spaced apart and electrically isolated from each other in a vicinity of the antenna elements.

8 . The method of claim 7 , wherein the solder elements are electrically isolated from the antenna elements.

9 . The method of claim 7 , wherein the one or more solder elements form a frame around the perimeter of the PCB.

10 . The method of claim 7 , wherein the plurality of antenna elements are evenly spaced along the perimeter of the PCB.

11 . The method of claim 7 , wherein the plurality of antenna elements are configured to form a radiation pattern that radiates outward from the perimeter of the PCB.

12 . The method of claim 7 , wherein the plurality of antenna elements comprises a plurality of antenna elements packaged in a single unit.

13 . A wireless node, comprising:
a transceiver; a printed circuit board (PCB); and a plurality of antenna elements, each coupled to the transceiver and mechanically attached to a perimeter of the PCB via one or more solder elements, wherein the solder elements are spaced apart and electrically isolated from each other in a vicinity of the antenna elements.

14 . The wireless node of claim 13 , wherein the solder elements are electrically isolated from the antenna elements.

15 . The wireless node of claim 13 , wherein the one or more solder elements form a frame around a perimeter of the PCB.

16 . The wireless node of claim 13 , wherein the plurality of antenna elements comprises an array of antenna elements, and wherein the plurality of antenna elements are evenly spaced along the perimeter of the PCB.

17 . The wireless node of claim 13 , wherein the plurality of antenna elements are configured to form a radiation pattern that radiates outward from the perimeter of the PCB.

18 . The wireless node of claim 13 , wherein the plurality of antenna elements comprises a plurality of antenna elements packaged in a single unit.

19 . An apparatus for wireless communications, comprising:
means for transmitting and receiving radio frequency signals; and means for coupling the means for transmitting and receiving radio frequency signals to a printed circuit board (PCB), wherein the means for coupling are spaced apart and electrically isolated from each other in a vicinity of the means for transmitting and receiving radio frequency signals.

20 . The apparatus of claim 19 , wherein the means for coupling are electrically isolated from the means for transmitting and receiving radio frequency signals.

21 . The apparatus of claim 19 , wherein the means for coupling form a frame around the perimeter of the PCB.

22 . The apparatus of claim 19 , wherein the means for transmitting and receiving radio frequency signals are evenly spaced along the perimeter of the PCB.

23 . The apparatus of claim 19 , wherein the means for transmitting and receiving radio frequency signals are configured to form a radiation pattern that radiates outward from the perimeter of the PCB.

24 . The apparatus of claim 19 , wherein the means for transmitting and receiving radio frequency signals comprise means for transmitting and receiving radio frequency signals packaged in a single unit.

Assignees

• Qualcomm Inc

Inventors

• Ganchrow Elimelech
• Yehezkely Alon

Classifications

• H01Q21/0087

  Apparatus or processes specially adapted for manufacturing antenna arrays (manufacturing waveguides H01P11/00) · CPC title

• H01Q21/28 Primary

  Combinations of substantially independent non-interacting antenna units or systems {(multiple beam H01Q25/00)} · CPC title

• H01Q1/24

  with receiving set · CPC title

• H01Q1/2283 Primary

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title