Substrate processing apparatus, substrate processing method and recording medium

US11084072B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11084072-B2
Application numberUS-201815871265-A
CountryUS
Kind codeB2
Filing dateJan 15, 2018
Priority dateJan 17, 2017
Publication dateAug 10, 2021
Grant dateAug 10, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Contamination of a bottom surface of a substrate caused by a processing liquid used for cleaning a top surface of the substrate can be suppressed. After performing a liquid processing on the top surface of the substrate and a liquid processing on the bottom surface of the substrate in parallel while rotating the substrate by a substrate holding/rotating unit, when stopping the liquid processing on the top surface of the substrate and the liquid processing on the bottom surface of the substrate, a control unit 18 stops a supply of the processing liquid onto the top surface of the substrate by a first processing liquid supply device 73, and then, stops a supply of the processing liquid onto the bottom surface of the substrate by a second processing liquid supply device 71.

First claim

Opening claim text (preview).

We claim: 1. A substrate processing apparatus configured to perform a liquid processing on a substrate by supplying a processing liquid onto the substrate, the substrate processing apparatus comprising: a substrate holding/rotating unit configured to hold and rotate the substrate; a first processing liquid supply device configured to supply the processing liquid onto a top surface of the substrate; a second processing liquid supply device configured to supply the processing liquid onto a bottom surface of the substrate; and a control unit configured to control processings using the first processing liquid supply device and the second processing liquid supply device, wherein, after performing a liquid processing on the top surface of the substrate and a liquid processing on the bottom surface of the substrate in parallel while rotating the substrate by the substrate holding/rotating unit, when stopping the liquid processing on the top surface of the substrate and the liquid processing on the bottom surface of the substrate, the control unit stops a supply of the processing liquid onto the top surface of the substrate by the first processing liquid supply device first, and after that, stops a supply of the processing liquid onto the bottom surface of the substrate by the second processing liquid supply device, wherein the substrate processing apparatus further comprises: a recovery cup configured to collect the processing liquid scattered from the substrate being rotated; a gas supply device configured to supply a gas to form a downflow from above the substrate; a gas exhaust port configured to exhaust an air flow generated as the downflow is introduced into the recovery cup; and a flow rectifying member provided between the substrate holding/rotating unit and the recovery cup and configured to rectify the air flow such that the air flow heads toward the gas exhaust port, wherein the substrate holding/rotating unit comprises a base plate configured to rotate the substrate, an outer peripheral end of the base plate extends past an outer edge portion of the substrate, and an upper end of the flow rectifying member is located at a position lower than the outer peripheral end of the base plate, and when viewed from above, the upper end of the flow rectifying member is radially spaced apart from the outer peripheral end of the base plate. 2. The substrate processing apparatus of claim 1 , wherein the control unit stops the supply of the processing liquid onto the bottom surface of the substrate by the second processing liquid supply device after the supply of the processing liquid onto the top surface of the substrate by the first processing liquid supply device is stopped and a remaining processing liquid thereon is removed from the top surface of the substrate by a centrifugal force generated through a rotation of the substrate. 3. The substrate processing apparatus of claim 1 , wherein, when starting the liquid processing on the top surface of the substrate and the liquid processing on the bottom surface of the substrate, the control unit starts the supply of the processing liquid onto the bottom surface of the substrate by the second processing liquid supply device first, and after that, starts the supply of the processing liquid onto the top surface of the substrate by the first processing liquid supply device. 4. The substrate processing apparatus of claim 2 , wherein, when starting the liquid processing on the top surface of the substrate and the liquid processing on the bottom surface of the substrate, the control unit starts the supply of the processing liquid onto the bottom surface of the substrate by the second processing liquid supply device first, and after that, starts the supply of the processing liquid onto the top surface of the substrate by the first processing liquid supply device. 5. The substrate processing apparatus of claim 1 , wherein the substrate holding/rotating unit comprises: a supporting member provided on the base plate and configured to support the substrate; and a guide pin provided on the supporting member and configured to guide the substrate, which is transferred from an outside of the apparatus, to a position where the substrate is supported by the supporting member, wherein when an edge of the substrate comes into contact with the guide pin, the substrate slides to the supporting member by the guide pin, wherein the guide pin has a groove extended in a direction intersecting with a periphery of the base plate, and the groove is inclined toward a direction of the processing liquid flowing on a periphery of the substrate during the liquid processing.

Assignees

Inventors

Classifications

  • characterised by the construction of the shaft · CPC title

  • characterised by the mechanical construction of the susceptor, stage or support · CPC title

  • characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

  • characterised by edge profile or support profile · CPC title

  • characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

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What does patent US11084072B2 cover?
Contamination of a bottom surface of a substrate caused by a processing liquid used for cleaning a top surface of the substrate can be suppressed. After performing a liquid processing on the top surface of the substrate and a liquid processing on the bottom surface of the substrate in parallel while rotating the substrate by a substrate holding/rotating unit, when stopping the liquid processing…
Who is the assignee on this patent?
Tokyo Electron Ltd
What technology area does this patent fall under?
Primary CPC classification H10P72/0414. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 10 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).