Chip bonding device

Patent metadata

Field	Value
Publication number	US-11081380-B2
Application number	US-201816489198-A
Country	US
Kind code	B2
Filing date	Feb 27, 2018
Priority date	Feb 28, 2017
Publication date	Aug 3, 2021
Grant date	Aug 3, 2021

Abstract

A chip bonding apparatus includes a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit. The bonding robotic arm unit includes a first bonding robotic arm unit and a second bonding robotic arm unit. The first bonding robotic arm unit includes a first motion stage, a first driver configured to drive the first motion stage and at least one first bonding robotic arm arranged on the first motion stage. The first bonding robotic arm is configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit. The second bonding robotic arm unit includes a second motion stage, a second driver configured to drive the second motion stage and at least one second bonding robotic arm arranged on the second motion stage.

First claim

What is claimed is:

1. A chip bonding apparatus, comprising:
a chip separation unit;
a chip alignment unit;
a chip bonding unit; and
a bonding robotic arm unit,
wherein the bonding robotic arm unit comprises a first bonding robotic arm unit and a second bonding robotic arm unit;
the first bonding robotic arm unit comprises a first motion stage, a first driver configured to drive the first motion stage, and at least one first bonding robotic arm which is arranged on the first motion stage and configured to suck up a chip from the chip separation unit and deliver the chip to the chip alignment unit;
the second bonding robotic arm unit comprises a second motion stage, a second driver configured to drive the second motion stage, and at least one second bonding robotic arm which is arranged on the second motion stage and configured to suck up a chip from the chip alignment unit and deliver the chip to the chip bonding unit;
wherein the chip alignment unit comprises a third motion stage and an alignment measurement system configured to measure a position of a mark on a chip;
wherein the third motion stage at least comprises:
a first part for receiving a chip delivered from the first bonding robotic arm;
a second part for measuring, with the alignment measurement system, the position of the mark on the chip; and
a third part for holding a chip which has been measured and is to be delivered by the second bonding robotic arm;
wherein the first, second and third parts of the third motion stage are able to work simultaneously.

2. The chip bonding apparatus of claim 1 , wherein the first motion stage is implemented as a rotary motion stage, the at least one first bonding robotic arm is arranged circumferentially on the rotary motion stage.

3. The chip bonding apparatus of claim 1 , wherein the first motion stage is implemented as a pivotal arm having an output end at which the first bonding robotic arm is mounted.

4. The chip bonding apparatus of claim 3 , wherein the pivotal arm is able to pivot in an X-Y plane.

5. The chip bonding apparatus of claim 1 , wherein the second motion stage is implemented as a rotary motion stage, the at least one second bonding robotic arm is arranged circumferentially on the rotary motion stage.

6. The chip bonding apparatus of claim 1 , wherein the chip alignment unit further comprises a third driver configured to drive the third motion stage and a plurality of measuring suckers arranged on the third motion stage.

7. The chip bonding apparatus of claim 6 , wherein the alignment measurement system comprises a chip-down alignment measurement system and/or a chip-up alignment measurement system.

8. The chip bonding apparatus of claim 7 , wherein the chip-down alignment measurement system is disposed under the second motion stage and configured to identify a position of a mark on a chip received by one of the at least one second bonding robotic arm from one of the measuring suckers.

9. The chip bonding apparatus of claim 7 , wherein the chip-up alignment measurement system is disposed above the third motion stage and configured to identify a position of a mark on a chip on one of the measuring suckers.

10. The chip bonding apparatus of claim 7 , wherein the chip bonding unit comprises a bonding stage, a bonding tray disposed on the bonding stage and configured to accommodate a bonding substrate, and a bonding measurement system configured to measure a position of the bonding substrate.

11. The chip bonding apparatus of claim 10 , further comprising a calibration measurement system configured to measure a reference mark on the third motion stage and a bonding substrate mark on the bonding stage.

12. The chip bonding apparatus of claim 11 , wherein only one calibration measurement system is included and disposed between adjacent two of the at least one second bonding robotic arm on the second motion stage; or the calibration measurement system is same as the at least one second bonding robotic arm in number, and the calibration measurement systems and the second bonding robotic arms are disposed alternately on the second motion stage.

13. The chip bonding apparatus of claim 12 , wherein the chip-up alignment measurement system is integrated into the calibration measurement system, so that when moving to a position above one of the measuring suckers, the calibration measurement system acts as the chip-up alignment measurement system to identify a position of a mark on a chip on the measuring sucker.

14. The chip bonding apparatus of claim 6 , wherein the third motion stage is implemented as a rotary motion stage, the measuring suckers are arranged circumferentially on the rotary motion stage.

15. The chip bonding apparatus of claim 1 , wherein the chip separation unit comprises a workpiece motion stage, a workpiece tray disposed on the workpiece motion stage, a vertical robotic arm configured to separate a chip from the workpiece tray, and a separation measurement system configured to measure a position of the chip.

16. The chip bonding apparatus of claim 1 , further comprising, when in a chip-down configuration, a flipping robotic arm configured to flip over a chip together with a mark thereon.

17. The chip bonding apparatus of claim 16 , wherein the flipping robotic arm is implemented as a vertical flipping robotic arm that is disposed between the chip separation unit and the first bonding robotic arm and is configured to pick up a chip from the chip separation unit, flip the chip over and deliver it to the first bonding robotic arm.

18. The chip bonding apparatus of claim 16 , wherein the flipping robotic arm comprises a pair of pivotal arms both disposed above the chip alignment unit, one of the pivotal arms configured to pick up a chip from the chip alignment unit and deliver it to the other pivotal arm, thereby flipping over the chip, the other pivotal arm configured to deliver the flipped chip to the chip alignment unit.

Assignees

• Shanghai Micro Electronics Equipment Group Co Ltd

Inventors

• Chen Feibiao
• Xia Hai
• Zhu Yuebin
• Cheng Hailin
• Jiang Xiaoyu
• Zhao Lili
• Zhang Donghao

Classifications

• H10P72/0428 Primary

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10P72/38

  with angular orientation of workpieces · CPC title

• H10W72/011

  Apparatus therefor · CPC title

• H10P72/53 Primary

  using optical controlling means · CPC title