Semiconductor manufacturing apparatus
US-11551948-B2 · Jan 10, 2023 · US
This page is not indexed by search engines while we improve data quality.
Chen Feibiao patents
Chen Feibiao is listed as an inventor on 18 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Feibiao |
| Total patents | 18 |
| First publication | Feb 5, 2019 |
| Latest publication | Jan 10, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Chip bonding device
US-11081380-B2 · Aug 3, 2021 · US
Chip bonding device and bonding method thereof
US-11037900-B2 · Jun 15, 2021 · US
Flip chip bonding device and bonding method
US-10903105-B2 · Jan 26, 2021 · US
Universal chip batch-bonding apparatus and method
US-10770320-B2 · Sep 8, 2020 · US
Batch bonding apparatus and bonding method
US-10763235-B2 · Sep 1, 2020 · US
Chip bonding apparatus and bonding method
US-10658327-B1 · May 19, 2020 · US
Focusing and leveling measurement device and method
US-10656507-B2 · May 19, 2020 · US
Chip bonding apparatus and bonding method
US-2020144218-A1 · May 7, 2020 · US
Universal chip batch-bonding apparatus and method
US-2020013647-A1 · Jan 9, 2020 · US
Recent patents
Latest publications not already listed above.
Flip chip bonding device and bonding method
US-2020013656-A1 · Jan 9, 2020 · US
Batch bonding apparatus and bonding method
US-2019385972-A1 · Dec 19, 2019 · US
Chip bonding device
US-2019378741-A1 · Dec 12, 2019 · US
Focusing and leveling measurement device and method
US-2019302582-A1 · Oct 3, 2019 · US
A chip bonding device and bonding method thereof
US-2019164930-A1 · May 30, 2019 · US
Adaptive groove focusing and leveling device and method
US-10274840-B2 · Apr 30, 2019 · US
Chip bonding apparatus and method
US-2019088516-A1 · Mar 21, 2019 · US
Exposure device and out-of-focus and tilt error compensation method
US-10197923-B2 · Feb 5, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Shanghai Micro Electronics Equipment Group Co Ltd | 18 |
| Shanghai Microelectronics Equi | 1 |
| Shanghai Micro Electronic Equipment Group Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/0446 | 14 |
| H10P72/3212 | 10 |
| H10P72/50 | 10 |
| H10P72/0606 | 10 |
| H10P72/3206 | 9 |